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公开(公告)号：KR1020160141057A
公开(公告)日：2016-12-08
申请号：KR1020150074187
申请日：2015-05-27
Applicant: 한양대학교 산학협력단 , 성균관대학교산학협력단
Abstract: 본발명은 2가금속산화물로이루어진복수의나노로드가부착된생물발광공명에너지전이유도용바이오센서및 이를이용한생물발광공명에너지전이시스템에관한것이다. 본발명을이용함으로써, 생물발광공명에너지전이(BRET)에대한효율적인플랫폼의제공이가능하다.
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公开(公告)号：KR101802325B1
公开(公告)日：2017-11-29
申请号：KR1020150074187
申请日：2015-05-27
Applicant: 한양대학교 산학협력단 , 성균관대학교산학협력단
Abstract: 본발명은 2가금속산화물로이루어진복수의나노로드가부착된생물발광공명에너지전이유도용바이오센서및 이를이용한생물발광공명에너지전이시스템에관한것이다. 본발명을이용함으로써, 생물발광공명에너지전이(BRET)에대한효율적인플랫폼의제공이가능하다.
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Patent Agency Ranking
公开(公告)号：KR1020100026138A
公开(公告)日：2010-03-10
申请号：KR1020080085023
申请日：2008-08-29
Applicant: 성균관대학교산학협력단
CPC classification number: C22C1/05 , B21C1/00 , C01P2006/40 , C22C23/00 , C22C2202/00
Abstract: PURPOSE: A method of manufacturing MgB2 superconductivity which is doped with heterogeneity atom with using a mechanical alloying method are provided to manufacture a MgB2 wire in which critical current property is improved under a high magnetic field. CONSTITUTION: Material powder of MgB2 alloy and heterogeneity atom powder for doping are mixed to form compound powder(S2). A mechanical alloy method is performed for the compound powder(S3). A thermal process is performed for the compound powder enforcing the mechanical alloy method(S5). The compound powder which performs the mechanical alloy method is molded before enforcing a thermal processing step(S4). Mold through swaging or drawing to a wire after inserting the compound powder in the metallic conduit in a rod shape.
Abstract translation: 目的：提供一种使用机械合金法掺杂异质原子的MgB2超导体的制造方法，用于制造在高磁场下临界电流特性得到改善的MgB2线。 构成：将MgB2合金的材料粉末和用于掺杂的异质原子粉末混合形成复合粉末（S2）。 对化合物粉末（S3）进行机械合金化。 对采用机械合金法的复合粉末进行热处理（S5）。 执行机械合金方法的复合粉末在实施热处理步骤（S4）之前被模制。 将化合物粉末以棒状插入金属导管中后，通过模锻或拉丝成丝。
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公开(公告)号：KR1020090041556A
公开(公告)日：2009-04-29
申请号：KR1020070107125
申请日：2007-10-24
Applicant: 성균관대학교산학협력단
IPC: H01L21/28
CPC classification number: H01L21/76871 , H01L21/02068 , H01L21/0274 , H01L21/28506
Abstract: A flexible conductive polyimide substrate with a fine wiring and a method for manufacturing the same is provided to manufacture a higher value-add flexible conductive polyimide by using an electroless planting and additive method before electroplating. A photosensitive film(14) is adhered to a polyimide(10), and the photosensitive film is developed with exposure and a circuit is patterned by using a photolithography. The surface of selected patterned polyimide patterned is selectively modified, and a metal seed layer(16) is formed on the surface modified polyimide by using an electroless plating. A copper layer is formed on the metal seed layer by using the electroplating, and the photosensitive film is eliminated, and the flexible conductive polyimide substrate is washed.
Abstract translation: 提供具有精细布线的柔性导电聚酰亚胺基板及其制造方法，以在电镀之前通过使用无电植入和添加方法制造更高附加值的柔性导电聚酰亚胺。 将感光膜（14）粘附到聚酰亚胺（10）上，并且通过曝光使感光膜显影，并且通过使用光刻法对电路进行图案化。 选择性地修饰图案化的所选图案化的聚酰亚胺的表面，并且通过使用化学镀在表面改性的聚酰亚胺上形成金属种子层（16）。 通过使用电镀在金属种子层上形成铜层，除去感光性膜，洗涤柔性导电性聚酰亚胺基板。
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公开(公告)号：KR100779378B1
公开(公告)日：2007-11-23
申请号：KR1020060098386
申请日：2006-10-10
Applicant: 성균관대학교산학협력단
IPC: H01B12/00
CPC classification number: Y02E40/64
Abstract: A multi-filament super conductors wire for reducing an AC loss and a method for manufacturing the same are provided to be applied to a patterning technology of an electronic element using various chemical solutions. A multi-filament super conductor wire for reducing an AC loss is produced by selectively spraying a lamp solution by a photolithography process. The multi-filament super conductor wire for reducing the AC loss is produced by spraying the lamp solution by using a metallic mask. A multi-filament thin film is formed on a multi-layered metal substrate or a single crystal substrate(31) by using a micro-nozzle. A lamp solution is sprayed in a desired form by using the micro-nozzle performing an X-Y scanning operation(32). A super lamp solution having a pitch and a width to be realized is sprayed by a piezo-electronic element or a mechanical nozzle as the micro-nozzle. The droplet sprayed by the micro-nozzle is between 10^-13 to 10^-5 L.
Abstract translation: 提供一种用于降低AC损耗的复丝超导线及其制造方法，用于使用各种化学溶液的电子元件的图案化技术。 通过用光刻工艺选择性地喷射灯泡溶液来产生用于减少AC损耗的复丝超导线。 用于减少AC损耗的复丝超导线通过使用金属掩模喷射灯溶液而产生。 通过使用微型喷嘴，在多层金属基板或单晶基板（31）上形成复丝薄膜。 通过使用执行X-Y扫描操作的微型喷嘴（32）以期望的形式喷射灯泡溶液。 具有要实现的节距和宽度的超级灯溶液作为微型喷嘴被压电电子元件或机械喷嘴喷射。 由微型喷嘴喷雾的液滴在10 ^ -13至10 ^ -5 L之间。
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公开(公告)号：KR100727371B1
公开(公告)日：2007-06-12
申请号：KR1020060062362
申请日：2006-07-04
Applicant: 성균관대학교산학협력단
Abstract: Provided are a method for manufacturing a metal mask and a metal mask produced thereby using multi-layered photoresist film, which has excellent accuracy and minute pitch when compared to a metal mask produced by conventional process. The method for manufacturing a metal mask comprises the steps of: applying a multi-layered photoresist film onto a conductive substrate(S200,S210); exposing and developing the multi-layered photoresist film sequently via a photolithography process to perform a patterning(S220,S230); forming a metal layer via electroforming(S240); and separating the metal layer from the conductive substrate. The method further comprises the step of removing contaminants from a surface of the conductive substrate prior to the step of applying a multi-layered photoresist film onto a conductive substrate.
Abstract translation: 本发明提供一种使用多层光致抗蚀剂膜制造金属掩模和由其制造的金属掩模的方法，与通过传统方法制造的金属掩模相比，该多层光致抗蚀剂膜具有优异的精度和微小间距。 用于制造金属掩模的方法包括以下步骤：将多层光刻胶膜施加到导电基板上（S200，S210）; 接着经由光刻工艺接着曝光并显影多层光致抗蚀剂膜以执行图案化（S220，S230）; 通过电铸形成金属层（S240）; 以及从导电衬底分离金属层。 该方法还包括在将多层光致抗蚀剂膜施加到导电基底上的步骤之前从导电基底的表面去除污染物的步骤。
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公开(公告)号：KR100906308B1
公开(公告)日：2009-07-07
申请号：KR1020070107125
申请日：2007-10-24
Applicant: 성균관대학교산학협력단
IPC: H01L21/28
Abstract: 본 발명은 선택적 도금법을 이용하여 기존 FCCL의 화학적 에칭법의 정밀도 제어에 있어서의 단점을 보완하여 공정이 단순하고, 미세 패턴을 갖는 고부가가치의 연성 전도성 폴리이미드 기판을 제조하는 방법에 관한 것이다. 보다 상세하게는, 연성 회로 기판의 원재료인 FCCL의 제조 후 미세 pitch와 복잡한 패터닝 공정을 무전해 도금 및 전해 도금 공정 이전에 애디티브(additive) 방식으로 구현하는 공정에 관한 것이다. 이를 위해 폴리이미드 기판 위에 감광필름을 압착한 후 구현하고자 하는 회로 형태를 포토리소그래피 공정을 이용하여 형성시키고 폴리이미드의 표면개질을 통해 무전해 도금으로 금속 시드층(seed layer)을 형성시킨다. 그 후 무전해 도금 되지 않은 부분의 감광필름을 제거한 후 일정 두께 이상의 구리층을 형성시키기 위하여 전해 도금 공정을 수행한다. 본 발명에 따른 연성 전도성 폴리이미드 기판의 제조 방법은 공정이 단순하며, 미세 패턴의 형성이 가능한 장점을 지닌다.
전도성 폴리이미드 기판, 노광 공정, 미세 배선, 무전해 도금, 전해 도금
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