公开(公告)号：KR1020120090775A

公开(公告)日：2012-08-17

申请号：KR1020120001195

申请日：2012-01-04

Applicant: 소이텍

Inventor： 레콤테모니크 ,  제나드파스칼 ,  리갈소피 ,  소타다비드 ,  자닌파비안느 ,  베티주크리스텔

IPC: H01L27/12

CPC classification number: H01L21/76254 ,  H01L21/02032

Abstract: PURPOSE: A method for reproducing a supply substrate is provided to reduce the time, quality, and costs of a reproduction operation by easily removing a remaining material ring on a donor substrate. CONSTITUTION: A weak interface is generated(110). A supply substrate is contacted with a support substrate(120). The supply substrate is thermally processed(130). An electromagnetic wave is selectively irradiated to the supply substrate(210). The supply substrate is chemically and mechanically polished(220).

Abstract translation: 目的：提供用于再现供应基板的方法，通过容易地去除供体基板上的剩余材料环来减少再现操作的时间，质量和成本。 构成：生成弱接口（110）。 供应基板与支撑基板（120）接触。 供应基板被热处理（130）。 电磁波被选择性地照射到供给基板（210）。 供应基板经化学和机械抛光（220）。