Abstract:
본 발명은 카본 나이트라이드(C 3 N 4 )-그래핀 복합체 제조방법 및 이에 의해 제조되는 카본 나이트라이드(C 3 N 4 )-그래핀 복합체에 관한 것이다. 구체적으로, 본 발명은 그라파이트 옥사이드를 용매하에서 박리하여 그래핀 옥사이드 분산용액을 제조하는 단계(단계 1); 및 상기 분산용액에 시안아마이드(cyanamide)를 첨가하여 100 ~ 150 ℃에서 환류시키는 단계(단계 2)를 포함하는 카본 나이트라이드(C 3 N 4 )-그래핀 복합체 제조방법을 제공한다. 본 발명에 따른 카본 나이트라이드(C 3 N 4 )-그래핀 복합체 제조방법은 그래핀 옥사이드 표면에 결합된 산소를 포함하는 작용기를 효과적으로 환원시킬 뿐만 아니라 종래 알려진 카본 나이트라이드 제조공정보다 상대적으로 저온에서 카본 나이트라이드 구조를 형성시킬 수 있고, 카본 나이트라이드(C 3 N 4 )-그래핀 복합체를 대량으로 수득할 수 있는 장점이 있다.
Abstract:
The present invention relates to a method of preparing a carbon nitride (C3N4)-graphene composite and the carbon nitride (C3N4)-graphene composite prepared thereby. The present invention provides the method of preparing the carbon nitride-graphene composite comprising: a step (step 1) of manufacturing a graphene oxide dispersion solution by peeling off a graphite oxide in a solvent; and a step (step 2) of adding cyanamide in the dispersion solution and refluxing them at a temperature of 100-150°C. The method of preparing the carbon nitride according to the present invention effectively reduces a functional group containing oxygen bonded to the surface of the graphene oxide, forms a carbon nitride structure at low temperatures as compared to the existing process for preparing the carbon nitride and has advantages such as producing the carbon nitride (C3N4)-graphene composite in large quantities. [Reference numerals] (AA) Example 1;(BB) Example 3;(CC) Comparative example 1
Abstract:
PURPOSE: A resistive memory device with a minimized upper electrode contact and a manufacturing method thereof are provided to arrange an upper electrode with a sidewall electrode and a sidewall contact part, thereby maximally reducing area touched with a resistance variable material layer. CONSTITUTION: A resistance variable layer(30) is arranged between a lower electrode(20) and an upper electrode(70). The upper electrode is formed along one side surface of a first insulating film. The first insulating film is arranged on one side of the upper part of the resistance variable layer. The upper electrode is comprised of a sidewall contact part(56) and a sidewall electrode(52) arranged on one lateral surface of the first insulating film. The sidewall contact part is arranged on the upper part of the first insulating film in order to be connected to the sidewall electrode.
Abstract:
PURPOSE: A semiconductor devices and a method of driving the same are provided to implement high integration by preventing the interference between nonvolatile memory cells. CONSTITUTION: In a semiconductor devices and a method of driving the same, a unit cell structure(1) comprises electrode layers(M1,M2), a bipolar resistance memory material film(RM1), and a unipolar resistance memory material film(RM2) The bipolar resistance memory material film and the unipolar resistance memory material film are formed between electrode layers which are opposite to each other. The bipolar resistance memory material film and the unipolar resistance memory material film are electrically serially connected. The electrode layers include resistance memory material films which are connected to conductive lines respectively.