Abstract:
A method of forming silicon nitride at low temperature, charge trap memory device comprising crystalline nano dots formed using the same and method of manufacturing charge trap memory device are provided to prevent the increment of the leakage current even though the thickness of the nitride film is thin. The substrate is loaded in the chamber of the silicon nitride deposition apparatus(100). The silicon nitride deposition apparatus includes a filament. The temperature of filament is increased to the dissociation temperature of the reaction gas(110). The reaction gas for the silicon nitride formation is supplied to the chamber(120). Therefore, the crystalline silicon nitride is formed in the top of the substrate. At this time, the temperature of filament is maintained by 1400°C-2000°C. The pressure of the chamber maintains in the number torr~ several tens torr.
Abstract:
상기 박막 제조 방법에 있어서, 챔버 내에 기판을 제공한다. 챔버 내에 제1 반응 가스 및 제2 반응 가스를 공급한다. 그리고, 제1 반응 가스를 해리하여 결정성 나노 입자를 형성한다. 제2 반응 가스를 이용하여 기판 상에 비결정성 물질의 형성을 억제한다. 그리고, 기판 상에 제공된 결정성 나노 입자로부터 결정성 박막을 형성한다.
Abstract:
A method for production of thin layer and an apparatus for manufacturing the same are provided to perform the manufacturing process at the lower temperature by dissociating the reaction gas. A substrate is provided inside the chamber(S510). The first reaction gas and the second reaction gas are supplied inside the chamber(S520). The first reaction gas is dissociated and the crystalline nano particle is formed(S530). The formation of the non-crystalline substance is suppressed on the top of the substrate by using the second reaction gas(S540). The crystalline thin layer is formed from the crystalline nano particle provided to the top of the substrate(S550).