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公开(公告)号:KR100470912B1
公开(公告)日:2005-03-10
申请号:KR1020020032888
申请日:2002-06-12
Applicant: 전자부품연구원
IPC: G02B6/32
Abstract: 본 발명은 마이크로 옵틱스 광 필터의 패키징 제조방법에 관한 것으로, 2개의 필터 홀더(10,11)와 1개의 필터 고정용 디스크(12)로 이루어진 홀더로 구성된 3바디 필터 홀더를 제작하고, 제작된 3바디 필터 홀더(10,11,12)를 필터(13)에 부착한다. 이후, 필터(13)에 부착된 3바디 필터 홀더를 사용하여 양쪽으로 다심 또는 단심 광콜리메이터를 각각 솔더링(soldering)하여 패키징을 완료한다. 따라서, 원통형의 외부 하우징과 광콜리메이터에 씌우는 원통형의 금속관 없이 패키징을 수행할 수 있어 멀티-포트 필터의 제작에 사용되는 부품의 구성 요소 수가 적어지며, 광콜리메이터와 외부 하우징의 접합이 필요치 않기 때문에 접합을 필요로 하는 부분도 적게 되어 멀티-포트 필터의 제조 단가를 줄일 수 있어 신뢰성을 향상시킬 수 있는 효과가 있다.
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公开(公告)号:KR100444111B1
公开(公告)日:2004-08-11
申请号:KR1020020076901
申请日:2002-12-05
Applicant: 전자부품연구원
IPC: G02B6/42
Abstract: PURPOSE: A method for hardening an epoxy used in package an optical component and a soldering method are provided to reduce a hardening period and simplify an automation process by removing a process for inserting the optical component into a chamber. CONSTITUTION: An optical component is formed with a fiber pigtail(103), a glass tube(101), and a fiber(104). A thermosetting epoxy(102) is adhered to the optical component by heating and hardening the thermosetting epoxy within a chamber. The fiber pigtail is arranged to adhere the fiber pigtail to a green lens(107) coated by a metal material(106). The thermosetting epoxy is coated on the optical component. The optical component coated with the thermosetting epoxy is located at a high-frequency coil by using a high-frequency device(105).
Abstract translation: 目的:提供一种硬化用于封装光学部件的环氧树脂的方法和焊接方法,以通过去除将光学部件插入腔室的过程来减少硬化周期并简化自动化过程。 构成:光学部件由光纤引出线(103),玻璃管(101)和光纤(104)形成。 通过加热并硬化腔室内的热固性环氧树脂,将热固性环氧树脂(102)粘附到光学部件上。 光纤尾纤布置成将光纤尾纤粘附到由金属材料(106)涂覆的绿色透镜(107)。 热固性环氧树脂涂在光学元件上。 用热固性环氧树脂涂覆的光学元件通过使用高频装置(105)定位在高频线圈上。
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公开(公告)号:KR1020040006787A
公开(公告)日:2004-01-24
申请号:KR1020020041180
申请日:2002-07-15
Applicant: 전자부품연구원
IPC: G02B6/42
CPC classification number: G02B6/2937 , G02B6/29398 , G02B6/327
Abstract: PURPOSE: A method for packaging the optical devices for an optical communication is provided to increase the productivity and to obtain a uniformity of the quality by automatically packaging the optical devices. CONSTITUTION: A method for packaging the optical devices for an optical communication includes the steps of: a first step for mounting the optical filter on the cylindrical filter holder; a second step for positioning a first and a second solder preforms(281) on the top surface and the bottom surface of the cylindrical filter holder; a third step for contacting the single core collimator(310) to the first solder preform(310) and for contacting two core collimator(320) to the second solder preform; a fourth step for optically aligning the single and two core collimator(310,320) with the optical filter; and a fifth step for bonding the single and two core collimator(310,320) to the cylindrical filter holder by fusing the first and the second solder preforms(281).
Abstract translation: 目的:提供用于光通信的光学装置的封装方法,以通过自动封装光学装置来提高生产率并获得质量的均匀性。 构成:用于封装用于光通信的光学装置的方法包括以下步骤:将滤光器安装在圆筒形过滤器保持器上的第一步骤; 第二步骤,用于将第一和第二焊料预制件(281)定位在圆筒形过滤器保持器的顶表面和底表面上; 第三步骤,用于将单个芯准直器(310)接触到第一焊料预制件(310)并将两个芯准直器(320)接触到第二焊料预制件; 用于将单个和两个芯准直器(310,320)与光学滤光器对准的第四步骤; 以及第五步骤,通过熔化第一和第二焊料预制件(281)将单个和两个芯准直器(310,320)接合到圆筒形过滤器保持器。
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公开(公告)号:KR1020030095608A
公开(公告)日:2003-12-24
申请号:KR1020020032888
申请日:2002-06-12
Applicant: 전자부품연구원
IPC: G02B6/32
Abstract: PURPOSE: A method for fabricating micro optic filter packaging is provided to reduce a fabrication cost and to simplify a fabrication process by packaging a gap between optical collimators. CONSTITUTION: A method for fabricating micro optic filter packaging includes a three-body holder forming process, an adhering process, and a soldering process. The three-body holder forming process is to form a three-body holder with two filter holders(10,11) and one disk(12) for fixing a filter. The adhering process is to adhere the three-body holder to a filter(13). The soldering process is to solder a single collimator or a dual collimator by using the three-body holder adhered to the filter(13). The method further includes a gold plating process for plating the filter holders(10,11) and a bonding process for bonding the gold-plated sides(15) to each other.
Abstract translation: 目的:提供一种制造微型光纤过滤器封装的方法,以减少制造成本,并通过在光学准直器之间封装间隙来简化制造工艺。 构成:微型光纤滤波器封装的制造方法包括三体夹持器形成工艺,粘合工艺和焊接工艺。 三体保持器的形成过程是形成具有两个过滤器保持器(10,11)和一个用于固定过滤器的盘(12)的三体保持器。 粘合过程是将三体保持器粘附到过滤器(13)上。 焊接工艺是通过使用粘附到过滤器(13)的三体保持器来焊接单个准直器或双准直器。 该方法还包括用于镀覆过滤器保持器(10,11)的镀金工艺和用于将镀金侧面(15)彼此接合的接合工艺。
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公开(公告)号:KR100437188B1
公开(公告)日:2004-06-23
申请号:KR1020020041180
申请日:2002-07-15
Applicant: 전자부품연구원
IPC: G02B6/42
CPC classification number: G02B6/2937 , G02B6/29398 , G02B6/327
Abstract: The present invention relates to a method of packaging optical parts for optical communication. According to the method of the present invention, there are advantages in that a packaging process for optical parts is automated to improve productivity and to obtain price competitiveness and uniformity of quality, and a high frequency heater for locally transferring heat to only a solder preform is used to minimize thermal deformation of areas except a soldering area, thereby achieving highly reliable packaging of the optical parts.
Abstract translation: 本发明涉及一种封装用于光通信的光学部件的方法。 根据本发明的方法,具有以下优点:用于光学部件的封装工艺被自动化以提高生产率并且获得价格竞争力和质量的均匀性,并且用于局部地将热量局部传递到焊料预制件的高频加热器是 用于最小化除焊接区域以外的区域的热变形,从而实现光学部件的高度可靠的封装。
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公开(公告)号:KR1020040049925A
公开(公告)日:2004-06-14
申请号:KR1020020076901
申请日:2002-12-05
Applicant: 전자부품연구원
IPC: G02B6/42
Abstract: PURPOSE: A method for hardening an epoxy used in package an optical component and a soldering method are provided to reduce a hardening period and simplify an automation process by removing a process for inserting the optical component into a chamber. CONSTITUTION: An optical component is formed with a fiber pigtail(103), a glass tube(101), and a fiber(104). A thermosetting epoxy(102) is adhered to the optical component by heating and hardening the thermosetting epoxy within a chamber. The fiber pigtail is arranged to adhere the fiber pigtail to a green lens(107) coated by a metal material(106). The thermosetting epoxy is coated on the optical component. The optical component coated with the thermosetting epoxy is located at a high-frequency coil by using a high-frequency device(105).
Abstract translation: 目的:提供一种用于硬化用于封装光学部件的环氧树脂的方法和焊接方法,以通过去除将光学部件插入室中的过程来减少硬化时间并简化自动化过程。 构成:光纤部件由纤维尾纤(103),玻璃管(101)和纤维(104)形成。 热固性环氧树脂(102)通过在室内加热和固化热固性环氧树脂而粘附到光学部件上。 纤维尾纤被布置成将纤维尾纤粘附到由金属材料(106)涂覆的绿色透镜(107)上。 热固性环氧树脂涂在光学部件上。 涂覆有热固性环氧树脂的光学部件通过使用高频装置(105)位于高频线圈。
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