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公开(公告)号：KR101375298B1
公开(公告)日：2014-03-19
申请号：KR1020110138246
申请日：2011-12-20
Applicant: 제일모직주식회사
CPC classification number: H01L24/29 , H01L24/13 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/13144 , H01L2224/16225 , H01L2224/29082 , H01L2224/2929 , H01L2224/29301 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/29393 , H01L2224/29398 , H01L2224/29401 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29464 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/83193 , H01L2224/83203 , H01L2224/83851 , H01L2924/07802 , H01L2924/12041 , H01L2924/12044 , H01L2924/15788 , H01L2924/20106 , H01L2924/00014 , H01L2924/00 , H01L2924/014
Abstract: 본 발명은 코어가 고분자 수지와 SiO
2 의 복합체(composite)로 이루어짐으로써 전도성 미립자의 경도가 20% K-value가 7,000~12,000 N/mm
2 로 높고 220℃, 110MPa의 조건으로 5초간 열압착시켰을 때 압축 변형율이 5% 내지 40% 범위로, 초기 접속저항 및 신뢰성 이후 접속 저항값이 모두 양호한 전도성 미립자, 이를 포함하는 이방 전도성 필름 및 이를 포함하는 반도체 장치에 관한 것이다.-
公开(公告)号：KR1020120076182A
公开(公告)日：2012-07-09
申请号：KR1020100138216
申请日：2010-12-29
Applicant: 제일모직주식회사
CPC classification number: H05K3/323 , B32B7/02 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/38 , B32B2250/02 , B32B2250/24 , B32B2264/102 , B32B2264/12 , B32B2307/202 , B32B2307/706 , B32B2457/202 , C08J5/18 , C08J2363/00 , C09J163/00 , G02F1/13452 , H01R4/04 , Y10T428/1055
Abstract: PURPOSE: A bi-layered anisotropic conductive film is provided to release pressure disproportion at mounting, to reduce short fault generation, and to improve connection reliability by reducing connection resistance. CONSTITUTION: A bi-layered anisotropic conductive film comprises an epoxy resin comprising a polycyclic aromatic ring, and has minimum melt viscosity 3,000-10,000 Pa.s at 30-200 °C. The comprised amount of the epoxy resin comprising the polycyclic aromatic ring is 20-60 weight% of the film. The bi-layered anisotropic conductive film comprises an anisotropic conductive film layer, and a non-conductive film layer. The glass transition temperature of the epoxy resin comprising the polycyclic aromatic ring is 165-250 °C.
Abstract translation: 目的：提供双层各向异性导电膜，以在安装时释放压力不均衡，以减少短路故障产生，并通过降低连接电阻来提高连接可靠性。 构成：双层各向异性导电膜包含包含多环芳环的环氧树脂，并且在30-200℃下具有3,000-10,000Pa.s的最小熔体粘度。 包含多环芳环的环氧树脂的含量为膜的20-60重量％。 双向各向异性导电膜包括各向异性导电膜层和非导电膜层。 包含多环芳族环的环氧树脂的玻璃化转变温度为165-250℃。
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公开(公告)号：KR101131162B1
公开(公告)日：2012-03-28
申请号：KR1020080126168
申请日：2008-12-11
Applicant: 제일모직주식회사
Abstract: 본 발명은 저온 속경화형 이방 전도성 필름용 조성물에 관한 것으로, 보다 상세하게는 1분자 중에 2개 이상의 에폭시기를 가지며 분자 체인(chain)의 주쇄에 프로필렌 옥사이드(Propylene Oxide)가 포함된, 프로필렌 옥사이드계 에폭시 수지, 경화제, 바인더 수지, 도전성 입자 및 용제를 포함하여 저온 속경화가 가능하고, 전기적 특성이 매우 우수하며, 고온다습한 환경이나 열충격 조건에서도 우수한 접착력과 낮은 전기접속저항을 유지할 수 있는 저온 속경화형 이방 전도성 필름용 조성물에 관한 것이다.
이방 전도성 필름, 프로필렌 옥사이드, 양이온 경화, 저온 속경화-
4.发明公开
公开(公告)号：KR1020110074320A
公开(公告)日：2011-06-30
申请号：KR1020090131245
申请日：2009-12-24
Applicant: 제일모직주식회사
IPC: C08L101/12 , C08L63/00 , C08J5/18 , H01B1/20
Abstract: PURPOSE: A low-temperature quick-curable anisotropic conductive film composition is provided to ensure excellent electrical characteristic. CONSTITUTION: A low-temperature quick-curable anisotropic conductive film contains: 100 weight parts of epoxy resin containing cycloexane epoxy resin; 0.05-30 weight parts of sulfonium hardening agent; 20-300 weight parts of binder resin; 1-80 weight parts of conductive particles. The sulfonium hardening agent is selected from alipathic sulfonium salt, aromatic sulfonium salt, and mixture thereof.
Abstract translation: 目的：提供低温快速固化各向异性导电膜组合物，以确保优异的电气特性。 构成：低温快速固化各向异性导电膜含有：100重量份环氧树脂，含环氧环氧树脂; 0.05-30重量份锍硬化剂; 20-300份粘合剂树脂; 1-80重量份导电颗粒。 锍硬化剂选自硫化锍盐，芳族锍盐及其混合物。
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公开(公告)号：KR101391697B1
公开(公告)日：2014-05-07
申请号：KR1020110134685
申请日：2011-12-14
Applicant: 제일모직주식회사
CPC classification number: H01B1/20 , C08K3/08 , C08K5/41 , C08K9/02 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01B1/22 , H01L23/5328 , H01L24/29 , H01L2224/2929 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32225 , H01L2924/07802 , H01L2924/07811 , H01L2924/15788 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
Abstract: 본원발명은하기화학식 1의수소화비스페놀 A형에폭시모노머, 또는하기화학식 2의수소화비스페놀 A형에폭시올리고머를포함하는이방성도전필름용조성물및 그필름에관한것으로, 내습성및 내열성이뛰어나고저온속경화형인이방성도전필름용조성물및 그필름에관한것이다. [화학식 1][화학식 2]상기화학식 2에서, n은 1 내지 50이다.
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Patent Agency Ranking
公开(公告)号：KR101362868B1
公开(公告)日：2014-02-14
申请号：KR1020100138216
申请日：2010-12-29
Applicant: 제일모직주식회사
CPC classification number: H05K3/323 , B32B7/02 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/38 , B32B2250/02 , B32B2250/24 , B32B2264/102 , B32B2264/12 , B32B2307/202 , B32B2307/706 , B32B2457/202 , C08J5/18 , C08J2363/00 , C09J163/00 , G02F1/13452 , H01R4/04 , Y10T428/1055
Abstract: 본 발명은 폴리사이클릭 방향족 고리를 포함하는 에폭시 수지와 나노 실리카를 포함하는 ACF 층 및 NCF 층을 포함하는 이중층 이방성 도전성 필름에 관한 것이다.
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公开(公告)号：KR1020130076237A
公开(公告)日：2013-07-08
申请号：KR1020110144748
申请日：2011-12-28
Applicant: 제일모직주식회사
CPC classification number: H01L23/538 , C08G59/226 , C08G59/245 , C08K2201/001 , C08K2201/011 , C09J9/02 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/16225 , H01L2224/2929 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29366 , H01L2224/29371 , H01L2224/29386 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/32225 , H01L2224/73204 , H01L2924/07802 , H01L2924/07811 , H01L2924/15788 , H01L2924/00 , C08L63/00 , C08K3/36 , C08K3/10
Abstract: PURPOSE: A composition for anisotropically conductive film is provided to improve pre-compression performance by uniformly transferring pressures to each of the bumps. CONSTITUTION: A composition for an anisotropically conductive film includes a polycyclic aromatic ring-containing epoxy resin; a fluorene-based epoxy resin; a nanosilica; and a conductive particle. The glass transition temperature of the polycyclic aromatic ring-containing epoxy resin after hardening is 165-250°C. The boiling point of the fluorene-based epoxy resin is 50-80°C, and the molecular weight is 1000 or less. The polycyclic aromatic ring-containing epoxy resin is one or more selected from a tetrafunctional polycyclic aromatic ring-containing epoxy resin and a bifunctional polycyclic aromatic ring-containing epoxy resin.
Abstract translation: 目的：提供用于各向异性导电膜的组合物，以通过均匀地将压力传递到每个凸块来提高预压缩性能。 构成：用于各向异性导电膜的组合物包括含多环芳环的环氧树脂; 芴基环氧树脂; 纳米二氧化硅 和导电颗粒。 硬化后的多环芳香族环氧树脂的玻璃化转变温度为165〜250℃。 芴系环氧树脂的沸点为50〜80℃，分子量为1000以下。 含有多环芳香环的环氧树脂是选自四官能多环芳环的环氧树脂和双官能多环芳环的环氧树脂中的一种以上。
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公开(公告)号：KR1020130073191A
公开(公告)日：2013-07-03
申请号：KR1020110140905
申请日：2011-12-23
Applicant: 제일모직주식회사
CPC classification number: C09J9/02 , C09J7/22 , C09J7/30 , C09J2201/602 , C09J2201/622 , C09J2203/30 , C09J2205/102 , H01L21/02002
Abstract: PURPOSE: An anisotropic adhesive film is provided to reduce viscosity of a composition of a conducting film, and to increase dispersity and flowability, thereby being compressed at low temperature. CONSTITUTION: An anisotropic adhesive film includes an anisotropic conductive film layer with conducting particles, and to include a non-conductive film layer containing visible particles. The hardness of the conductive particle is higher than the hardness of the visible particle. A semiconductor device includes a wiring substrate included in the outermost layer; an anisotropic conductive film attached to the chip-mounting side of the wiring substrate; and a semiconductor chip mounted to the anisotropic conductive film. The anisotropic conductive film is the adhesive film.
Abstract translation: 目的：提供各向异性粘合剂膜以降低导电膜的组合物的粘度，并增加分散性和流动性，从而在低温下被压缩。 构成：各向异性粘合膜包括具有导电颗粒的各向异性导电膜层，并且包括含有可见颗粒的非导电膜层。 导电颗粒的硬度高于可见颗粒的硬度。 半导体器件包括包含在最外层中的布线基板; 连接到布线基板的芯片安装侧的各向异性导电膜; 以及安装在各向异性导电膜上的半导体芯片。 各向异性导电膜是粘合膜。
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公开(公告)号：KR1020130072632A
公开(公告)日：2013-07-02
申请号：KR1020110140147
申请日：2011-12-22
Applicant: 제일모직주식회사
Abstract: PURPOSE: An isotropic conductive film is provided to strengthen connectivity, by including a first conductive particle and a second conductive particle together. CONSTITUTION: A first conductive particle includes silica or nucleus. The nucleus contains silica composite. A second conductive particle has nucleus. The nucleus contains polymer resin. The first conductive particle forms 10 - 40 protrusion. [Reference numerals] (AA) Second conductive particle; (BB) First conductive particle
Abstract translation: 目的：提供各向同性导电膜以通过将第一导电颗粒和第二导电颗粒包括在一起来增强连接性。 构成：第一导电颗粒包括二氧化硅或核。 核含有二氧化硅复合材料。 第二导电颗粒具有核。 核含有聚合物树脂。 第一导电颗粒形成10-40突起。 （附图标记）（AA）第二导电颗粒; （BB）第一导电颗粒
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公开(公告)号：KR1020130069908A
公开(公告)日：2013-06-27
申请号：KR1020110136957
申请日：2011-12-19
Applicant: 제일모직주식회사
CPC classification number: C09J163/00 , C08G59/226 , C08G59/24 , C08G59/687 , C08L63/00 , C08L2205/02 , C09D5/24 , C09J9/02 , H01B1/20 , H01L23/29 , H01L24/29 , H01L2224/2929 , H01L2224/29298 , H01L2224/293 , H01L2924/07802 , H01L2924/07811 , H01L2924/15788 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: An anisotropically conductive film is provided to perform hardening at a low temperature and to prevent a severe warpage phenomenon after thermal hardening by containing a reactive monomer having 120-180 g/eq of an epoxy equivalent a sulfonium cation hardening catalyst. CONSTITUTION: An anisotropic conductive film contains (a) 120-180 g/eq of a reactive monomer having 1-20 parts by weight of an epoxy equivalent; (b) 5-50 parts by weight of a hydrogenated epoxy resin; (c) 0.1-10 parts by weight of a sulfonium cation hardening catalyst; (d) 20-60 parts by weight of a binder resin; and (e) 0.1-30 parts by weight of conductive particles based on 100.0 parts by weight of the anisotropic conductive film contains in a solid content. Also, a semiconductor device comprises (a) a wiring substrate; (b) the anisotropic conductive film attached on a chip-mounted surface of the wiring substrate; and (c) a semiconductor chip mounted on the anisotropic conductive film.
Abstract translation: 目的：提供各向异性导电膜以在低温下进行硬化，并且通过含有具有120-180g / eq的环氧当量的锍阳离子固化催化剂的反应性单体来防止热硬化之后的严重翘曲现象。 构成：各向异性导电膜含有（a）120-180g / eq的具有1-20重量份环氧当量的反应性单体; （b）5-50重量份氢化环氧树脂; （c）0.1-10重量份的锍阳离子硬化催化剂; （d）20-60重量份粘合剂树脂; 和（e）基于100.0重量份的各向异性导电膜的0.1-30重量份的导电颗粒含有固体含量。 此外，半导体器件包括（a）布线基板; （b）安装在布线基板的芯片安装表面上的各向异性导电膜; 和（c）安装在各向异性导电膜上的半导体芯片。
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