-
公开(公告)号：KR1020150066969A
公开(公告)日：2015-06-17
申请号：KR1020130152655
申请日：2013-12-09
Applicant: 제일모직주식회사
CPC classification number: C08K5/5403 , C08G77/20 , C08K5/56 , H01L33/56 , H01L2224/48091 , H01L2924/0002 , C08L83/04 , C08K5/54 , H01L23/29 , H01L33/52 , H01L2924/00014 , H01L2924/00
Abstract: 말단에규소결합된알케닐기(Si-Vi)를가지는적어도 1 종의제1 실록산화합물및 경화제로서말단에규소결합된수소(Si-H)를갖는카르보실란(carbonsilane) 화합물을포함하는봉지재용조성물, 상기봉지재용조성물을경화시켜얻은봉지재, 및상기봉지재를포함하는전자소자가제공된다.
Abstract translation: 提供一种密封剂组合物，其包含：在末端具有与硅（Si-Vi）结合的烯基的第一硅氧烷化合物中的至少一种; 和作为固化剂的碳硅烷化合物，其末端具有与硅（Si-H）结合的氢，以及通过固化该密封剂组合物而获得的密封剂，以及包含密封剂的电子器件。
-
公开(公告)号：KR101423539B1
公开(公告)日：2014-07-25
申请号：KR1020100130786
申请日：2010-12-20
IPC: G03F7/039 , G03F7/016 , H01L21/027
CPC classification number: G03F7/0233 , H01L23/293 , H01L2924/0002 , H01L2924/00
Abstract: (A) 하기 화학식 1의 반복단위를 포함하는 폴리벤조옥사졸 전구체; (B) 감광성 디아조퀴논 화합물; (C) 실란 화합물; (D) 페놀 화합물; 및 (E) 용매를 포함하는 것인 포지티브형 감광성 수지 조성물이 제공된다.
[화학식 1]
상기 식에서, 각 치환기의 정의는 명세서에 정의된 것과 동일하다.-
公开(公告)号：KR1020140083908A
公开(公告)日：2014-07-04
申请号：KR1020130163102
申请日：2013-12-24
Applicant: 제일모직주식회사
IPC: C08L83/04 , C08K5/5415 , C08G77/04 , H01L23/29
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: The present invention relates to a curable polysiloxane composition for an optical device, an encapsulant obtained by curing the same, and an optical device including the encapsulant. The curable polysiloxane composition includes: at least one kind of a first polysiloxane compound presented by chemical formula 1; at least one kind of a second polysiloxane compound having hydrogen bound to silicon (Si-H) on an end thereof; and at least one kind of a third polysiloxane compound having an alkenyl group bound to silicon on an end thereof. [Chemical formula 1] (R^1R^2R^3SiO_1/2)_M1(R^4R^5SiO_2/2)_D1(R^6R^7SiO_2/2)_D2(R^8SiO_2/_2-Y^1-SiO_2/_2R^9)_D3(R^10SiO_3/_2)_T1(R^11SiO_3/_2)_T2(R^12SiO_3/_2)_T3(SiO_3/_2-Y^2-SiO_3/_2)_T4(SiO_4/_2)_Q1.
Abstract translation: 本发明涉及一种用于光学器件的可固化聚硅氧烷组合物，通过其固化获得的密封剂，以及包括该密封剂的光学器件。 可固化聚硅氧烷组合物包括：由化学式1表示的至少一种第一聚硅氧烷化合物; 至少一种在其一端具有与硅（Si-H）结合的氢的第二聚硅氧烷化合物; 和在其末端具有与硅结合的烯基的至少一种第三聚硅氧烷化合物。 [化学式1]（R 1，R 2，R 3，SiO 2/2）_M1（R 4 4R 5 SiO 2/2）_D 1（R 6 R 17 SiO 2/2）_D 2（R 8）8 SiO 2 / _2R ^ 9）_D3（R ^ 10SiO_3 / _2）_T1（R ^ 11SiO_3 / _2）_T2（R ^ 12SiO_3 / _2）_T3（SiO_3 / _2-Y ^ 2-SiO_3 / _2）_T4（SiO_4 / _2）_Q1。
-
公开(公告)号：KR1020140074241A
公开(公告)日：2014-06-17
申请号：KR1020130151834
申请日：2013-12-06
Applicant: 제일모직주식회사
CPC classification number: C08L83/06 , C08G77/12 , C08G77/20 , C08K5/56 , C08L83/00 , C08L83/04 , C08L83/14 , H01L33/501 , H01L33/56 , H01L2224/48091 , H01L2924/00014
Abstract: The present invention relates to: a curable polysiloxane composition for an optical device, the composition including at least one type of first siloxane compound represented by Chemical Formula 1 below, at least one type of second siloxane compound having silicon-bonded hydrogen (Si-H) on a terminal thereof, and at least one type of third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) on a terminal thereof; an encapsulating material obtained by curing the curable polysiloxane composition for an optical device; and an optical device comprising the encapsulating material. According to an embodiment of the present invention, provided is the curable polysiloxane composition for an optical device which: has enhanced adhesion strength to adhere to a lower substrate; prevents gas and moisture from being entering; and thus can increase reliability.
Abstract translation: 本发明涉及：用于光学器件的可固化聚硅氧烷组合物，该组合物包含至少一种由下述化学式1表示的第一硅氧烷化合物，至少一种具有硅键合氢的第二硅氧烷化合物（Si-H ）和末端具有硅键合的烯基（Si-Vi）的至少一种第三硅氧烷化合物; 通过固化用于光学装置的可固化聚硅氧烷组合物获得的封装材料; 以及包括该封装材料的光学装置。 根据本发明的一个实施方案，提供了一种用于光学装置的可固化聚硅氧烷组合物，其具有增强的粘合强度以粘附到下基板; 防止气体和水分进入; 从而可以提高可靠性。
-
公开(公告)号：KR1020120066923A
公开(公告)日：2012-06-25
申请号：KR1020100128277
申请日：2010-12-15
CPC classification number: G03F7/0226 , C07C69/84 , G03F7/0233
Abstract: PURPOSE: A positive type photosensitive composition is provided to improve physical properties and reliability of a membrane, and to boating excellent sensitivity, resolution, pattern formation, removal of residue, high elongation, high tensile strength, and low membrane shrinkage. CONSTITUTION: A phenol compound comprises one selected from a group consisting of a compound in chemical formula 1, a compound in chemical formula 2, and combinations thereof. A positive type photosensitive composition comprises 100.0 parts by weight of polybenzoxazole precursor, 5-100 parts by weight of a photosensitive diazoquinone compound, 1-30 parts by weight of a phenol compound, 0.1-30 parts by weight of a silane compound, and 50-300 parts by weight of a solvent. The polybenzoxazole precursor has the weight average molecular weight of 3,000-300,000.
Abstract translation: 目的：提供一种正型感光组合物，以改善膜的物理性能和可靠性，并且具有优异的灵敏度，分辨率，图案形成，残留物的去除，高伸长率，高拉伸强度和低膜收缩率。 构成：酚化合物包括选自化学式1中的化合物，化学式2中的化合物及其组合的一种酚化合物。 正型感光性组合物包含100.0重量份聚苯并恶唑前体，5-100重量份光敏重氮醌化合物，1-30重量份酚化合物，0.1-30重量份硅烷化合物和50 -300重量份溶剂。 聚苯并恶唑前体的重均分子量为3,000-300,000。
-
Patent Agency Ranking6.发明公开인쇄회로기판용 전도성 페이스트 조성물, 이를 이용한 양면연성회로기판 제조 방법 및 그 방법에 의해 제조된 양면 연성회로기판 无效印刷电路板用导电性组合物，制造双面柔性电路板和双面柔性电路板的方法制造方法
公开(公告)号：KR1020100077800A
公开(公告)日：2010-07-08
申请号：KR1020080135843
申请日：2008-12-29
Applicant: 제일모직주식회사
Abstract: PURPOSE: A conductive paste composition for a printed circuit board is provided to have excellent heat resistance and high adhesive force using a phenolic binder resin and to obtain superior flexibility, proper thixotropy, and high conductivity. CONSTITUTION: A conductive paste composition for a printed circuit board includes 50-90 weight% of a conductive material, 5-30 weight% of a phenolic resin, 0.1-10 weight% of a hardener, and a solvent. A method for manufacturing a double-sided flexible circuit board comprises: a step(S110) of printing the composition on one side of the flexible circuit board; a step(S120) of forming a hole on the flexible board requiring up-down electrical connection; and a step(S130) of coating the inner wall of the hole while printing the composition on the other side of the flexible board.
Abstract translation: 目的：提供一种用于印刷电路板的导电性糊剂组合物，其具有优异的耐热性和使用酚类粘合剂树脂的高粘合力，并且获得优异的柔韧性，适当的触变性和高导电性。 构成：用于印刷电路板的导电糊剂组合物包括50-90重量％的导电材料，5-30重量％的酚醛树脂，0.1-10重量％的硬化剂和溶剂。 一种制造双面柔性电路板的方法包括：在柔性电路板的一侧上印刷组合物的步骤（S110）; 在柔性板上形成需要上下电连接的孔的台阶（S120） 以及在将柔性板的另一侧打印组合物的同时涂覆孔的内壁的台阶（S130）。
-
-
公开(公告)号：KR101714715B1
公开(公告)日：2017-03-09
申请号：KR1020140028467
申请日：2014-03-11
Applicant: 제일모직주식회사
CPC classification number: H01L33/56 , C08G77/12 , C08G77/20 , C08G77/80 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/501 , H01L2224/48091 , H01L2924/00014
Abstract: 23℃, 대기압하에서 Brookfield (DV-II+pro) 스핀들 52번을사용하여토오크(Torque)가 90% 일때 측정한점도가 4,000 내지 9,500 mPa·s이고, 형광체를혼합하여 23℃에서 2 시간이상방치시, 그안에포함되는형광체의침전율을 18% 이내로억제하며, 말단에규소결합된수소(Si-H)를가지는적어도 1종의제1 실록산화합물, 및말단에규소결합된알케닐기(Si-Vi)를가지는적어도 1종의제2 실록산화합물을포함하는봉지재조성물, 상기조성물을경화하여얻어지는봉지재, 및상기봉지재를포함하는전자소자를제공한다.
Abstract translation: 提供了一种用于密封剂的组合物，当在约23℃的大气压下以约90％的扭矩测量时，使用布鲁克菲尔德（DV-II + pro）纺锤52号测量时粘度为约4,000至约9,500mPa·s ，其中当包含荧光体时保持荧光体沉淀度在约18％内，并允许在约23℃下静置大于或等于约2小时，并且包括至少一种具有硅键合氢的第一硅氧烷化合物 （Si-H）和具有硅键合的烯基（Si-Vi）的至少一种第二硅氧烷化合物，通过固化该组合物获得的密封剂和包含该密封剂的电子器件。
-
公开(公告)号：KR1020150106226A
公开(公告)日：2015-09-21
申请号：KR1020140028467
申请日：2014-03-11
Applicant: 제일모직주식회사
CPC classification number: H01L33/56 , C08G77/12 , C08G77/20 , C08G77/80 , C08K5/56 , C08L83/00 , C08L83/04 , H01L33/501 , H01L2224/48091 , H01L2924/00014
Abstract: 23℃, 대기압 하에서 Brookfield (DV-II+pro) 스핀들 52번을 사용하여 토오크(Torque)가 90% 일 때 측정한 점도가 4,000 내지 9,500 mPa·s이고, 형광체를 혼합하여 23℃에서 2 시간 이상 방치 시, 그 안에 포함되는 형광체의 침전율을 18% 이내로 억제하며, 말단에 규소 결합된 수소(Si-H)를 가지는 적어도 1종의 제1 실록산 화합물, 및 말단에 규소 결합된 알케닐 기(Si-Vi)를 가지는 적어도 1종의 제2 실록산 화합물을 포함하는 봉지재 조성물, 상기 조성물을 경화하여 얻어지는 봉지재, 및 상기 봉지재를 포함하는 전자 소자를 제공한다.
Abstract translation: 本发明提供了一种用于密封剂的组合物，通过固化该组合物获得的密封剂，以及包括该密封剂的电子设备。 当在约23℃的大气压下以约90％的扭矩使用Brookfield（DV-II + pro）锭子52测量时，用于密封剂的组合物具有约4,000-9,500mPa·s的粘度，保持 包含磷光体的荧光体的沉淀度在约18％以内，允许在约23℃下放置约2小时以上，并且包括至少一种具有硅键合氢（Si-; H）的第一硅氧烷化合物， 和具有硅键合的烯基（Si-Vi）的至少一种第二硅氧烷化合物。
-
公开(公告)号：KR101466149B1
公开(公告)日：2014-11-27
申请号：KR1020130163102
申请日：2013-12-24
Applicant: 제일모직주식회사
IPC: C08L83/04 , C08K5/5415 , C08G77/04 , H01L23/29
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: 화학식 1로 표현되는 적어도 1종의 제1 실록산 화합물, 말단에 규소 결합된 수소(Si-H)를 가지는 적어도 1종의 제2 실록산 화합물, 그리고 말단에 규소 결합된 알케닐 기(Si-Vi)를 가지는 적어도 1종의 제3 실록산 화합물을 포함하는 광학기기용 경화형 폴리실록산 조성물, 상기 광학기기용 경화형 폴리실록산 조성물을 경화하여 얻은 봉지재 및 상기 봉지재를 포함하는 광학기기에 관한 것이다.
[화학식 1]
(R
1 R
2 R
3 SiO
1
/2 )
M1 (R
4 R
5 SiO
2
/2 )
D1 (R
6 R
7 SiO
2
/2 )
D2 (R
8 SiO
2
/2 -Y
1 -SiO
2
/2 R
9 )
D3 (R
10 SiO
3
/2 )
T1 (R
11 SiO
3
/2 )
T2 (R
12 SiO
3
/2 )
T3 (SiO
3
/2 -Y
2 -SiO
3
/2 )
T4 (SiO
4
/2 )
Q1
상기 화학식 1에서, R
1 내지 R
12 , Y
1 , Y
2 , M1, D1, D2, D3, T1, T2, T3, T4 및 Q1은 명세서에서 정의한 바와 같다.
-
-
-
-
-
-
-
-
-
Search Results
22
records
(took 0.028 seconds)
