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Patent Agency Ranking
公开(公告)号：KR100673622B1
公开(公告)日：2007-01-24
申请号：KR1020050070475
申请日：2005-08-02
Applicant: 제일모직주식회사
Abstract: Provided is an epoxy resin composition for sealing semiconductor devices, which is superior in flowability, warpage, continuous workability, room-temperature storage stability, and reliance. The epoxy resin composition for sealing semiconductor devices comprises an epoxy resin, a hardener, a hardening accelerator, and inorganic filler as indispensable components. The composition contains 0.01-1wt%, based on the total epoxy resin composition, of hydroxy benzophenone represented by the following formula 1, wherein m=1-3, m'=5-m, n=0-3, n'=5-n, and R=H or an alkyl or aryl group.
Abstract translation: 本发明提供一种密封半导体器件的环氧树脂组合物，其流动性，翘曲性，连续加工性，室温保存稳定性和依赖性优异。 用于密封半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，硬化促进剂和无机填料作为不可或缺的组分。 该组合物含有0.01-1重量％的总环氧树脂组合物，由下式1表示的羟基二苯甲酮，其中m = 1-3，m'= 5-m，n = 0-3，n'= 5 -n，R = H或烷基或芳基。
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公开(公告)号：KR100673612B1
公开(公告)日：2007-01-24
申请号：KR1020050070470
申请日：2005-08-02
Applicant: 제일모직주식회사
Abstract: Provided is a non-halogen epoxy resin composition for sealing semiconductor devices, which is superior in flame retardancy, flowability, and reliance, contains no halogen-based and phosphorous flame retardant, and is harmless to people. The epoxy resin composition having good flame retardancy, flowability, and reliance for sealing semiconductor devices consists of an epoxy resin, a hardener, a hardening accelerator, and inorganic filler as indispensable components. The silicon resin flame retardant represented by the following formula 1 is contained in an amount of 0.1-10wt% of the epoxy resin composition. In the formula, R is H or an alkyl group and l, m, and n each is an integer of 1 or greater.
Abstract translation: 本发明提供一种密封半导体器件的非卤素环氧树脂组合物，其阻燃性，流动性和依赖性优异，不含卤素和磷阻燃剂，对人体无害。 具有良好阻燃性，流动性和对密封半导体器件的依赖性的环氧树脂组合物由环氧树脂，硬化剂，硬化促进剂和无机填料组成，作为不可或缺的组分。 由下式1表示的硅树脂阻燃剂的含量为环氧树脂组合物的0.1-10重量％。 式中，R为H或烷基，l，m和n分别为1以上的整数。
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公开(公告)号：KR100870078B1
公开(公告)日：2008-11-25
申请号：KR1020060138660
申请日：2006-12-29
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로서, 보다 상세하게는 에폭시수지, 경화제, 경화촉진제, 무기충전제, 및 실리콘 파우더를 포함하는 에폭시 수지 조성물에 있어서, 상기 실리콘 파우더가 구형으로 평균 입경이 1 ~ 15㎛이고, 입경이 20㎛ 이상인 파우더의 함량이 0.1 중량% 이하이며, 공기 분위기, 800℃에서 TGA 측정 시 열감량이 20 중량% 이하이며, 25℃에서의 비중이 1.1 ~ 1.5이며, 알킬트리알콕시실란 또는 아릴트리알콕시실란을 원료로 사용하여 산성 분위기 하에서 가수분해 과정을 거쳐 생성된 실리콘 파우더인 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다.
본 발명에 의해 흐름성과 신뢰성이 우수한 반도체 소자 밀봉용 에폭시 수지 조성물을 제공할 수 있다.
에폭시, 실리콘 파우더, 흐름성, 신뢰성-
公开(公告)号：KR1020080062635A
公开(公告)日：2008-07-03
申请号：KR1020060138660
申请日：2006-12-29
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for packaging a semiconductor device, and a semiconductor device packaged with the composition are provided to improve reliance and flowability. An epoxy resin composition for packaging a semiconductor device comprises an epoxy resin; a curing agent; a curing accelerator; a coupling agent; an inorganic filler; and a silicone powder which is a spherical powder having an average diameter of 1-15 micrometers, contains 0.1 wt% or less of a powder having a diameter of 20 micrometers or more, is prepared by the hydrolysis of an alkyltrialkoxysilane or an aryltrialkoxysilane under the acidic condition, and has a heat loss of 20 wt% or less in case of the measurement of TGA at 800 deg.C under air atmosphere and a specific gravity of 1.1-1.5 at 25 deg.C.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物和与该组合物一起包装的半导体器件，以改善依赖性和流动性。 用于包装半导体器件的环氧树脂组合物包括环氧树脂; 固化剂; 固化促进剂; 偶联剂; 无机填料; 通过水解烷基三烷氧基硅烷或芳基三烷氧基硅烷制备平均粒径为1-15微米的球形粉末的硅酮粉末，其含有0.1重量％以下的直径为20微米以上的粉末。 酸性条件下，在空气气氛下测定TGA 800℃，25℃比重1.1-1.5时，热损失为20重量％以下。
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公开(公告)号：KR100696880B1
公开(公告)日：2007-03-20
申请号：KR1020050136076
申请日：2005-12-30
Applicant: 제일모직주식회사
Abstract: Provided is an epoxy resin composition for the package of a semiconductor device which is excellent in flame retardancy, moisture resistance, adhesion, bending property and reliance. The epoxy resin composition comprises an epoxy resin which is at least one epoxy compound of the benzimidine-based structure containing a xyloc or biphenyl derivative represented by the formula 1, 2 or 3; a curing agent which is at least one selected from novolac type, xyloc type, multifunctional, polyaromatic, naphthalene type and dicyclopentadiene type phenol resins; a curing accelerator; and 70-92 wt% of an inorganic filler, wherein R1, R4, R5, R8, R9, R10, R11 and R12 are H, an alkyl group or an aryl group; R2, R3, R6 and R7 are H, an alkyl group or an aryl group and can contain 1-2 epoxy groups; a1, d1, a2, d2, a3, b3, c3 and d3 are an integer of 1-4; and b1, c1, b2 and c2 are an integer of 1-5.
Abstract translation: 本发明提供阻燃性，耐湿性，粘合性，弯曲性，依赖性优异的半导体装置的封装用环氧树脂组合物。 环氧树脂组合物包含环氧树脂，其为含有由式1,2或3表示的xyloc或联苯衍生物的至少一种基于苯胺的结构的环氧化合物; 固化剂，其为选自酚醛清漆型，木酮型，多官能，多芳族，萘型和二环戊二烯型酚醛树脂中的至少一种; 固化促进剂; 和70-92重量％的无机填料，其中R1，R4，R5，R8，R9，R10，R11和R12是H，烷基或芳基; R2，R3，R6和R7是H，烷基或芳基，可以含1-2个环氧基; a1，d1，a2，d2，a3，b3，c3和d3为1-4的整数; b1，c1，b2，c2为1-5的整数。
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