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公开(公告)号：KR1020140079755A
公开(公告)日：2014-06-27
申请号：KR1020140070855
申请日：2014-06-11
Applicant: 제일모직주식회사
Abstract: Acrylic fine particles of the present invention are acrylic fine particles formed by polymerizing a cross-linker to a monomer comprising (meta)acrylate. The cross-linker comprises a first cross-linker containing more than three (meta)acryl groups and at least one kind of functional group among OH and -COOH. The acrylic particles have 20- 60% of dispersion index (C.V). The acrylic particles have high heat resistance and solvent resistance wherein compatibility with a binder and solvent is increased thereby having significantly increased dispersion on a film such as a diffusion film so as to be properly used in a diffusing agent.
Abstract translation: 本发明的丙烯酸类微粒是通过使交联剂与包含（甲基）丙烯酸酯的单体聚合形成的丙烯酸系细颗粒。 交联剂包含含有多于三个（甲基）丙烯酰基的第一交联剂和在OH和-COOH中的至少一种官能团。 丙烯酸颗粒具有20-60％的分散指数（C.V）。 丙烯酸类颗粒具有高的耐热性和耐溶剂性，其中与粘合剂和溶剂的相容性增加，从而在诸如扩散膜的膜上显着增加分散，以便适当地用于扩散剂。
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公开(公告)号：KR101234843B1
公开(公告)日：2013-02-19
申请号：KR1020080127462
申请日：2008-12-15
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로, 보다 상세하게는 에폭시수지, 경화제, 경화촉진제, 무기 충전제 및 난연제를 포함하는 에폭시 수지 조성물에 있어서, 상기 난연제로 화학식 1로 표시되는 트리페닐포스페이트(triphenylphosphate)를 사용하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로 본 발명의 에폭시 수지 조성물은 연소 시 인체 및 환경에 유해한 부산물을 발생시키는 할로겐계, 삼산화 안티몬 등의 난연제를 사용하지 않고서도 우수한 난연성을 달성할 수 있으며 성형성 및 신뢰성도 우수한 에폭시 수지 조성물을 제공할 수 있다.
트리페닐포스페이트, 난연성, 성형성, 신뢰성Abstract translation: 本发明涉及用于半导体元件封装用环氧树脂组合物，更具体地，环氧树脂，硬化剂，硬化促进剂，在环氧树脂组合物含有无机填料和阻燃剂，由通式表示的磷酸三苯酯（1）在阻燃 本发明的环氧树脂组合物涉及一种用于半导体器件，其特征在于在密封的使用（磷酸三苯酯）的环氧树脂组合物是不使用阻燃剂例如卤素型，三氧化锑，其副产物产生有害于人体并在燃烧的环境 它也可以实现良好的阻燃性，并能提供优良的环氧树脂组合物也可模塑性和可靠性。
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公开(公告)号：KR101422666B1
公开(公告)日：2014-07-25
申请号：KR1020140070855
申请日：2014-06-11
Applicant: 제일모직주식회사
Abstract: 본 발명의 아크릴계 미립자는 (메타)아크릴레이트를 포함하는 단량체에 가교제를 중합하여 형성된 아크릴계 미립자로서, 상기 가교제는 (메타)아크릴기를 3개 이상 함유하면서 -OH 및 -COOH 중 최소한 1종의 관능기를 함유하는 제1 가교제를 포함하고, 상기 아크릴계 미립자는 분산지수(CV)가 20~60%인 것을 특징으로 한다. 상기 아크릴계 미립자는 고내열 및 내용제성을 가지며 동시에 바인더 및 용매와의 상용성이 증대되어 확산필름과 같은 필름에 분산성이 획기적으로 증가하여 확산제에 적합하게 사용될 수 있다.
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公开(公告)号：KR100882333B1
公开(公告)日：2009-02-11
申请号：KR1020070140039
申请日：2007-12-28
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent flame retardancy without the use of a halogen-based flame retardant, bending property, moldability and reliability. An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resin, curing agent, curing accelerator and inorganic filler. The curing agent is a hydroxyl naphthalene-containing modified phenol novolac type phenol resin indicated as the chemical formula 1. In the chemical formula 1, the average of m and n is respectively 1-10. The order of two repeating units can be arranged in the chemical formula 1 randomly.
Abstract translation: 提供用于封装半导体器件的环氧树脂组合物，以确保优异的阻燃性，而不使用卤素阻燃剂，弯曲性，成型性和可靠性。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，固化剂，固化促进剂和无机填料。 固化剂是化学式1表示的含羟基萘的改性酚醛清漆型酚醛树脂。在化学式1中，m和n的平均值分别为1-10。 两个重复单元的顺序可以随机排列在化学式1中。
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公开(公告)号：KR100870078B1
公开(公告)日：2008-11-25
申请号：KR1020060138660
申请日：2006-12-29
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것으로서, 보다 상세하게는 에폭시수지, 경화제, 경화촉진제, 무기충전제, 및 실리콘 파우더를 포함하는 에폭시 수지 조성물에 있어서, 상기 실리콘 파우더가 구형으로 평균 입경이 1 ~ 15㎛이고, 입경이 20㎛ 이상인 파우더의 함량이 0.1 중량% 이하이며, 공기 분위기, 800℃에서 TGA 측정 시 열감량이 20 중량% 이하이며, 25℃에서의 비중이 1.1 ~ 1.5이며, 알킬트리알콕시실란 또는 아릴트리알콕시실란을 원료로 사용하여 산성 분위기 하에서 가수분해 과정을 거쳐 생성된 실리콘 파우더인 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이다.
본 발명에 의해 흐름성과 신뢰성이 우수한 반도체 소자 밀봉용 에폭시 수지 조성물을 제공할 수 있다.
에폭시, 실리콘 파우더, 흐름성, 신뢰성-
Patent Agency Ranking
公开(公告)号：KR1020080062635A
公开(公告)日：2008-07-03
申请号：KR1020060138660
申请日：2006-12-29
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for packaging a semiconductor device, and a semiconductor device packaged with the composition are provided to improve reliance and flowability. An epoxy resin composition for packaging a semiconductor device comprises an epoxy resin; a curing agent; a curing accelerator; a coupling agent; an inorganic filler; and a silicone powder which is a spherical powder having an average diameter of 1-15 micrometers, contains 0.1 wt% or less of a powder having a diameter of 20 micrometers or more, is prepared by the hydrolysis of an alkyltrialkoxysilane or an aryltrialkoxysilane under the acidic condition, and has a heat loss of 20 wt% or less in case of the measurement of TGA at 800 deg.C under air atmosphere and a specific gravity of 1.1-1.5 at 25 deg.C.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物和与该组合物一起包装的半导体器件，以改善依赖性和流动性。 用于包装半导体器件的环氧树脂组合物包括环氧树脂; 固化剂; 固化促进剂; 偶联剂; 无机填料; 通过水解烷基三烷氧基硅烷或芳基三烷氧基硅烷制备平均粒径为1-15微米的球形粉末的硅酮粉末，其含有0.1重量％以下的直径为20微米以上的粉末。 酸性条件下，在空气气氛下测定TGA 800℃，25℃比重1.1-1.5时，热损失为20重量％以下。
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公开(公告)号：KR1020100068941A
公开(公告)日：2010-06-24
申请号：KR1020080127462
申请日：2008-12-15
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition for encapsulating a semiconductor device is provided to obtain excellent fire retardant property without using a fire retardant including halogen and antimony trioxide which generate by-products harmful to human body. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device includes an epoxy resin, a hardener, a curing accelerator, inorganic filler, and a fire retardant. The retardant is triphenylphosphate which is marked as a chemical formula 1. In the chemical formula 1, R1 - R3 are hydrogen or an alkyl group having carbon number of 1-4. The triphenylphosphate is tri(tert-butyl-phenyl)phosphate which is marked as a chemical formula 2.
Abstract translation: 目的：提供一种用于封装半导体器件的环氧树脂组合物，以获得优异的阻燃性能，而不使用包含卤素和三氧化锑的阻燃剂，其产生对人体有害的副产物。 构成：用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，无机填料和阻燃剂。 阻燃剂是标记为化学式1的磷酸三苯酯。在化学式1中，R 1 -R 3是氢或碳数为1-4的烷基。 磷酸三苯酯是标记为化学式2的三（叔丁基 - 苯基）磷酸酯。
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公开(公告)号：KR1020090070137A
公开(公告)日：2009-07-01
申请号：KR1020070138032
申请日：2007-12-26
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure high fluidity and excellent molding characteristic in molding a semiconductor device and to secure excellent reflow-resistant property. An epoxy resin composition for encapsulating a semiconductor device comprises an epoxy resin, hardener, curing accelerator and inorganic filler. The hardener comprises a modified triphenolmethane-based phenol resin. The inorganic filler includes the amount of 80 weight% or more of spherical silica based on inorganic filler. The spherical silica has 0.2 weight% or less of a weight ratio of the particles with 45 micron or more size and 0.85 or more of an average sphered degree. The modified triphenolmethane-based phenol resin has a structure represented by chemical formula I. In chemical formula I, m and n are respectively independent; m is an average value of 1-4; and n is an average value of 0-4.
Abstract translation: 提供了一种用于封装半导体器件的环氧树脂组合物，以确保半导体器件成型时的高流动性和优异的成型特性，并确保优异的耐回流性能。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂和无机填料。 固化剂包括改性的三酚甲基酚树脂。 无机填料包括基于无机填料的球形二氧化硅的80重量％以上的量。 球形二氧化硅的平均粒径为45微米以上，粒径为0.85以上的粒子的重量比为0.2重量％以下。 改性三酚甲基酚树脂具有化学式I表示的结构。在化学式I中，m和n分别独立; m的平均值为1-4; n为0-4的平均值。
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公开(公告)号：KR100882332B1
公开(公告)日：2009-02-11
申请号：KR1020070139954
申请日：2007-12-28
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent flame retardancy without the use of a halogen-based flame retardant, good moldability in the semiconductor device packaging and excellent bending property and reliability of package. An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resin, curing agent, curing accelerator and inorganic filler. The curing agent is a biphenyl-containing modified phenol novolac type phenol resin indicated as the chemical formula 1. In the chemical formula 1, the average of m and n is respectively 1-10. The order of two repeating units can be arranged in the chemical formula 1 randomly.
Abstract translation: 提供用于封装半导体器件的环氧树脂组合物，以确保优异的阻燃性，而不需要使用卤素类阻燃剂，在半导体器件封装中具有良好的成型性和优异的弯曲性能和封装的可靠性。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，固化剂，固化促进剂和无机填料。 固化剂是化学式1表示的联苯型改性酚醛清漆型酚醛树脂。在化学式1中，m和n的平均值分别为1-10。 两个重复单元的顺序可以随机排列在化学式1中。
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公开(公告)号：KR1020120078553A
公开(公告)日：2012-07-10
申请号：KR1020110043613
申请日：2011-05-09
Applicant: 제일모직주식회사
Abstract: PURPOSE: Acryl-based particles are provided to have excellent compatibility with binder and solvent, maintaining high cross-linking degree, and capable of remarkably increasing dispersity in case applied to a diffusion film. CONSTITUTION: Acryl-based particles are formed by polymerizing a (meth)acrylate-containing monomer with a crosslinking agent. The crosslinking agent comprises a first crosslinking agent comprising a first cross-linking agent which contains -OH and/or-COOH, containing three or more (meth)acryl group. The dispersion index of the acrylic particles is 20-60%. A manufacturing method of the acrylic particles comprises: a step of manufacturing a monomer mixed solution by mixing the (meth)acrylate-containing monomer with the crosslinking agent and an initiator, and a step of suspension polymerization of the monomer-mixed solution.
Abstract translation: 目的：提供丙烯酸类颗粒以与粘合剂和溶剂具有优异的相容性，保持高交联度，并且在扩散膜应用的情况下能够显着增加分散性。 构成：通过使含有（甲基）丙烯酸酯的单体与交联剂聚合而形成丙烯酸类颗粒。 交联剂包含含有含有三个以上（甲基）丙烯酰基的-OH和/或-COOH的第一交联剂的第一交联剂。 丙烯酸颗粒的分散指数为20-60％。 丙烯酸类颗粒的制造方法包括：通过混合含（甲基）丙烯酸酯的单体与交联剂和引发剂来制备单体混合溶液的步骤和单体混合溶液的悬浮聚合步骤。
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