公开(公告)号：KR1020120077648A

公开(公告)日：2012-07-10

申请号：KR1020100139686

申请日：2010-12-30

Applicant: 제일모직주식회사

Inventor： 송규석 ,  이덕수 ,  어동선 ,  송기태 ,  오귀정

IPC: C09J7/02 ,  C09J133/04 ,  H01L21/58 ,  B32B27/00

CPC classification number: C09J7/29 ,  B32B27/00 ,  C09J7/22 ,  C09J7/35 ,  C09J7/38 ,  C09J133/04 ,  C09J2201/16 ,  C09J2201/61 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327

Abstract: PURPOSE: A semiconductor assembling adhesive tape is provided to maintain stability of winding form in the pre-cut roll winding method and to solve defects of imprint mark generated by a multi-laminated layer of an insulating adhesive layer. CONSTITUTION: A semiconductor assembling adhesive tape comprises a base film(1), a photo-crosslinkable adhesion layer(2), an insulating adhesive layer(3), a protection film(4) and a spacer base film(5). The base film, the photo-crosslinkable adhesion layer, the insulating adhesive layer, the protection film and the spacer base film are consecutively laminated. The storage modulus of the spacer base film at 25 deg. Celsius is 100-400 MPa. The spacer base film is one or more which are selected from polyethylene, polypropylene, copolymers of propylene and ethylene, poly-1-butene, copolymer of vinyl acetate and ethylene, a mixture of polyethylene and styrene-butadiene rubber and a polyvinyl chloride film. The thickness of the spacer base film is 5-100 micro meters. A thermosetting adhesive layer is additionally included between the protection film and the spacer base film.

Abstract translation: 目的：提供半导体组装胶带，以保持卷绕形式在预切割卷绕方法中的稳定性，并且解决由绝缘粘合剂层的多层叠层产生的压印标记的缺陷。 构成：半导体组装胶带包括基膜（1），光可交联粘合层（2），绝缘粘合剂层（3），保护膜（4）和间隔基底膜（5）。 基膜，光交联性粘合层，绝缘粘合剂层，保护膜和隔离基材层连续层叠。 间隔基底膜在25度时的储能模量。 摄氏100-400兆帕。 间隔基膜是选自聚乙烯，聚丙烯，丙烯和乙烯的共聚物，聚-1-丁烯，乙酸乙烯酯和乙烯的共聚物，聚乙烯和苯乙烯 - 丁二烯橡胶的混合物以及聚氯乙烯膜中的一种或多种。 间隔基膜的厚度为5-100微米。 在保护膜和间隔基底膜之间另外包含热固性粘合剂层。

公开(公告)号：KR100874566B1

公开(公告)日：2008-12-16

申请号：KR1020070073951

申请日：2007-07-24

Applicant: 제일모직주식회사

Inventor： 오귀정 ,  김철영

IPC: H01L21/301 ,  H01L21/60

CPC classification number: H01L21/6836 ,  H01L21/67253 ,  H01L22/12

Abstract: The dicing die bond film is provided to improve the yield by measuring the thickness without the direct impact being given to the product. The dicing die bond film(100) comprises the support base layer(130), the adhesion layer, the glue layer(120), one or more measuring units(150a, 150b, 150c, 150d). The measuring unit measures the thickness of the total layer of the dicing die bond film. The manufacturing method of the dicing die bond film comprises as follows. A step is for forming the adhesion layer on the support base the glue layer on the protective film. The first cutting stage is for removing the section except the region for adhering the wafer and thickness measurement region to the glue layer with a cutter. A step is for adhering the glue layer on the adhesion layer on the support base and protective film. The second cutting stage is for removing the section except the region for adhering the wafer and thickness measurement region to the support base and adhesion layer.

Abstract translation: 提供切割模接合膜以通过测量厚度来提高产量，而不会直接影响产品。 切割模接合膜（100）包括支撑基层（130），粘合层，胶层（120），一个或多个测量单元（150a，150b，150c，150d）。 测量单元测量切割模片接合薄膜的总层的厚度。 切割模具接合薄膜的制造方法如下。 一个步骤是在保护膜上的胶层上在支撑基底上形成粘附层。 第一切割阶段用于除去用于将晶片和厚度测量区域粘附到胶层的区域之外的部分。 步骤是将胶层粘附在支撑基底和保护膜上的粘合层上。 第二切割阶段用于除去用于将晶片和厚度测量区域粘附到支撑基底和粘附层的区域之外的部分。