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公开(公告)号：KR101469265B1
公开(公告)日：2014-12-04
申请号：KR1020110142833
申请日：2011-12-26
Applicant: 제일모직주식회사
IPC: C08L63/00 , C08K5/5415 , C08K5/5455 , H01L23/29
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: 본발명의반도체소자밀봉용에폭시수지조성물은에폭시수지; 경화제; 무기충전제; 실록산화합물및 테트라키스[메틸렌-3-(3,5-디-터셔리부틸-4-하이드록시페닐)프로피오네이트]메탄을포함하며, 상기실록산화합물은옥타메틸사이클로테트라실록산및 하기화학식 1로표시되는아민변성실록산을포함하는것을특징으로한다: [화학식 1](상기에서, R및 R는각각독립적으로탄소수 1~4의알킬기, 탄소수 6~12의아릴기이며, n은 1~4의정수임).
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公开(公告)号：KR1020140082527A
公开(公告)日：2014-07-02
申请号：KR1020120152619
申请日：2012-12-24
Applicant: 제일모직주식회사
CPC classification number: C08L63/00 , C08K3/04 , C08K3/22 , C08K3/34 , C08K2003/2241 , C08K2003/2265 , H01L23/295
Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device including epoxy resin, a curing agent, an inorganic filler, and a colorant containing titanium oxide, iron oxide, and a mixture of mica and the semiconductor device manufactured using the epoxy resin composition. The present invention provides the epoxy resin composition for sealing the semiconductor device capable of implementing excellent marking properties to a carbon dioxide laser in which output is low, reducing the generation of soot during laser marking by reducing the content of carbon black which is an existing colorant, and increasing electric insulation.
Abstract translation: 本发明涉及一种用于密封半导体器件的环氧树脂组合物，其包括环氧树脂，固化剂，无机填料和包含二氧化钛，氧化铁和云母混合物的着色剂和使用环氧树脂制造的半导体器件 组成。 本发明提供一种用于密封半导体器件的环氧树脂组合物，该半导体器件能够对输出低的二氧化碳激光器实现优异的标记性能，通过降低作为现有着色剂的炭黑的含量来减少激光打标期间的烟灰产生 ，并增加电绝缘。
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公开(公告)号：KR1020120072161A
公开(公告)日：2012-07-03
申请号：KR1020100133982
申请日：2010-12-23
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition for sealing semiconductor device is provided to improve adhesion with various materials like a semiconductor device, a lead frame, thereby improving reliability, and crack resistance of a semiconductor device. CONSTITUTION: An epoxy resin composition for sealing semiconductor comprises an epoxy resin, a hardener, a curing accelerator, a coupling agent, inorganic filler, and adhesion improved. The adhesion improved comprises aromatic propionate-based compound in chemical formula 1. In chemical formula 1, R1, R2, R3, R4, R5, R6, R7 , R8 and R9 are same or different each other, and is respectively and independently hydrogen, or C1-C9 alkyl group. The aromatic propionate-based compound is 0.01-5 weight% of based on the epoxy resin.
Abstract translation: 目的：提供一种用于密封半导体器件的环氧树脂组合物，以改善与诸如半导体器件，引线框架的各种材料的粘附性，从而提高半导体器件的可靠性和抗裂纹性。 构成：用于密封半导体的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，偶联剂，无机填料和改进粘合剂。 在化学式1中，R 1，R 2，R 3，R 4，R 5，R 6，R 7，R 8和R 9相同或不同，分别独立地为氢， 或C 1 -C 9烷基。 芳族丙酸酯类化合物为0.01-5重量％，基于环氧树脂。
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公开(公告)号：KR1020130093742A
公开(公告)日：2013-08-23
申请号：KR1020110142833
申请日：2011-12-26
Applicant: 제일모직주식회사
IPC: C08L63/00 , C08K5/5415 , C08K5/5455 , H01L23/29
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: An epoxy resin composition is provided to improve storage stability at room temperature and low temperature, to have excellent adhesion without generating internal pore in plastic leaded chip carrier, and to improve adhesion with photo image-able solder resist mask (PSR) layer of PCB. CONSTITUTION: An epoxy resin composition for sealing semiconductor device compirses: epoxy resin, curing agent, inorganic filling, siloxane compound, and tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane. The siloxane compound comprises: octamethylcyclotetrasiloxane; and amine-modified siloxane indicated as the chemical formula 1. In the formula 1, R1 and R2 are C1-4 alkyl group or C6-12 aryl group independently, and n is a fixed number of 1-4.
Abstract translation: 目的：提供环氧树脂组合物，以提高室温和低温下的储存稳定性，具有优异的粘附性，而不会在塑料引线芯片载体中产生内孔，并提高与可光成像的阻焊掩模（PSR）层的粘附性 PCB。 构成：用于密封半导体器件的环氧树脂组合物：环氧树脂，固化剂，无机填充物，硅氧烷化合物和四[亚甲基-3-（3,5-二叔丁基-4-羟基苯基）丙酸酯]甲烷。 硅氧烷化合物包括：八甲基环四硅氧烷; 在化学式1中表示的胺改性的硅氧烷。在式1中，R 1和R 2分别是C 1-4烷基或C 6-12芳基，n是1-4的固定数。
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Patent Agency Ranking
公开(公告)号：KR1020120073017A
公开(公告)日：2012-07-04
申请号：KR1020100134991
申请日：2010-12-24
Applicant: 제일모직주식회사
Inventor： 조용한
IPC: C08L63/00 , C08K5/5415 , C08K5/5445 , H01L21/00
Abstract: PURPOSE: An epoxy resin composition for sealing semiconductor devices and a semiconductor device using thereof are provided to enhance adhesive force with a PSR(photo image-able solder resist mask) layer of PCB and to maintain mobility, moldability, and fire retardance. CONSTITUTION: An epoxy resin composition for sealing semiconductor devices comprises an epoxy resin, a hardener, inorganic filler, and a siloxane compound. The siloxane compound comprises octamethylcyclotetrasiloxane. 0.01-2 weight% of the octamethyltetrasiloxane is used based on total weight of the epoxy resin composition. The siloxane compound additionally includes amine modified siloxane which is represented as chemical formula 1. In the chemical formula 1, R1 and R2 respectively and independently indicate C1-4 alkyl group or C6-12 aryl group, and n indicates integer of 1-4.
Abstract translation: 目的：提供用于密封半导体器件的环氧树脂组合物和使用它的半导体器件，以通过PCB的PSR（可光致抗蚀剂掩模掩模）层增强粘合力并保持迁移率，成型性和阻燃性。 构成：用于密封半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，无机填料和硅氧烷化合物。 硅氧烷化合物包括八甲基环四硅氧烷。 基于环氧树脂组合物的总重量使用0.01-2重量％的八甲基四硅氧烷。 硅氧烷化合物另外包括以化学式1表示的胺改性硅氧烷。在化学式1中，R 1和R 2分别独立地表示C 1-4烷基或C 6-12芳基，n表示1-4的整数。
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公开(公告)号：KR1020110078407A
公开(公告)日：2011-07-07
申请号：KR1020090135211
申请日：2009-12-31
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition for encapsulating a semiconductor device is provided to maintain fluidity, moldability and fire retardancy, to ensure excellent adhesive force to various lead frames and cracking resistance. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device comprises an epoxy resin, hardener, curing accelerator, inorganic filler, coupling agent, and 4-tert-butylphenol of chemical formula 1. The 4-tert-butylphenol is used in the amount of 0.01-2 weight% based on the total weight of the epoxy resin composition. The epoxy resin comprises one or more of a phenolaralkyl type epoxy resin represented by chemical formula 2 and a biphenyl type epoxy resin represented by chemical formula 3.
Abstract translation: 目的：提供用于封装半导体器件的环氧树脂组合物以保持流动性，成型性和阻燃性，以确保对各种引线框具有优异的粘合力和抗开裂性。 构成：用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，无机填料，偶联剂和化学式1的4-叔丁基苯酚。4-叔丁基苯酚的用量为 0.01-2重量％，基于环氧树脂组合物的总重量。 环氧树脂包含一种或多种由化学式2表示的酚烷基型环氧树脂和由化学式3表示的联苯型环氧树脂。
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公开(公告)号：KR1020140133178A
公开(公告)日：2014-11-19
申请号：KR1020130052901
申请日：2013-05-10
Applicant: 제일모직주식회사
Abstract: 본 발명은 에폭시 수지, 경화제, 무기충전제, 및 착색제를 포함하고, 상기 착색제는 티탄질화물과 티탄블랙의 혼합물을 포함하는, 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자에 관한 것이다.
Abstract translation: 本发明涉及一种包封环氧树脂，固化剂，无机填料和着色剂的半导体器件的环氧树脂组合物，其中着色剂包括硝酸钛和钛黑的混合物，以及半导体器件 通过使用它们进行封装。 本发明的目的是提供一种用于封装半导体的环氧树脂组合物，其具有优异的标记性能。 可以减少作为现有着色剂的炭黑的含量，以减少激光打标期间的烟灰并提高绝缘性能。
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公开(公告)号：KR1020140082522A
公开(公告)日：2014-07-02
申请号：KR1020120152613
申请日：2012-12-24
Applicant: 제일모직주식회사
CPC classification number: C08L63/00 , C08G59/62 , C08K5/0025 , C08K5/3445 , C08K5/521 , H01L23/295
Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, which comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a dispersing agent; and to a semiconductor device sealed by using the same, wherein the epoxy resin comprises an epoxy resin expressed as chemical formula 1; the curing agent comprises a curing agent expressed as checmical formula 2; the curing accelerator comprises an imidazole-based curing accelerator; the dispersing agent comprises a dispersing agent having a phosphate ester bond.
Abstract translation: 本发明涉及一种用于密封半导体器件的环氧树脂组合物，其包含环氧树脂，固化剂，固化促进剂，无机填料和分散剂; 以及通过使用其密封的半导体器件，其中环氧树脂包含以化学式1表示的环氧树脂; 固化剂包括以化学式2表示的固化剂; 固化促进剂包括咪唑基固化促进剂; 分散剂包括具有磷酸酯键的分散剂。
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公开(公告)号：KR101570558B1
公开(公告)日：2015-11-19
申请号：KR1020120152613
申请日：2012-12-24
Applicant: 제일모직주식회사
Abstract: 본발명은에폭시수지, 경화제, 경화촉진제, 무기충전제, 분산제를포함하는반도체소자밀봉용에폭시수지조성물에있어서, 상기에폭시수지는화학식 1로표시되는에폭시수지를포함하고, 상기경화제는화학식 2로표시되는경화제를포함하고, 상기경화촉진제는이미다졸계경화촉진제를포함하고, 상기분산제는인산에스테르결합을가진분산제를포함하는, 반도체소자밀봉용에폭시수지조성물및 이를사용하여밀봉된반도체소자에관한것이다.
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