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公开(公告)号：KR1020140133178A
公开(公告)日：2014-11-19
申请号：KR1020130052901
申请日：2013-05-10
Applicant: 제일모직주식회사
Abstract: 본 발명은 에폭시 수지, 경화제, 무기충전제, 및 착색제를 포함하고, 상기 착색제는 티탄질화물과 티탄블랙의 혼합물을 포함하는, 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자에 관한 것이다.
Abstract translation: 本发明涉及一种包封环氧树脂，固化剂，无机填料和着色剂的半导体器件的环氧树脂组合物，其中着色剂包括硝酸钛和钛黑的混合物，以及半导体器件 通过使用它们进行封装。 本发明的目的是提供一种用于封装半导体的环氧树脂组合物，其具有优异的标记性能。 可以减少作为现有着色剂的炭黑的含量，以减少激光打标期间的烟灰并提高绝缘性能。
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公开(公告)号：KR1020140082522A
公开(公告)日：2014-07-02
申请号：KR1020120152613
申请日：2012-12-24
Applicant: 제일모직주식회사
CPC classification number: C08L63/00 , C08G59/62 , C08K5/0025 , C08K5/3445 , C08K5/521 , H01L23/295
Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, which comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a dispersing agent; and to a semiconductor device sealed by using the same, wherein the epoxy resin comprises an epoxy resin expressed as chemical formula 1; the curing agent comprises a curing agent expressed as checmical formula 2; the curing accelerator comprises an imidazole-based curing accelerator; the dispersing agent comprises a dispersing agent having a phosphate ester bond.
Abstract translation: 本发明涉及一种用于密封半导体器件的环氧树脂组合物，其包含环氧树脂，固化剂，固化促进剂，无机填料和分散剂; 以及通过使用其密封的半导体器件，其中环氧树脂包含以化学式1表示的环氧树脂; 固化剂包括以化学式2表示的固化剂; 固化促进剂包括咪唑基固化促进剂; 分散剂包括具有磷酸酯键的分散剂。
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公开(公告)号：KR101309817B1
公开(公告)日：2013-09-23
申请号：KR1020100131031
申请日：2010-12-20
Applicant: 제일모직주식회사
Abstract: 에폭시 수지, 경화제, 무기 충전제 및 착색제를 포함하는 조성물이고, 0.05 중량 % 내지 1 중량 % 포함되는 카본 블랙(carbon black); 및 0.01 중량% 내지 3 중량% 포함되는 철산화물-운모 혼합물을 상기 착색제로 포함하는 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉한 반도체 소자를 제시한다.
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公开(公告)号：KR101570558B1
公开(公告)日：2015-11-19
申请号：KR1020120152613
申请日：2012-12-24
Applicant: 제일모직주식회사
Abstract: 본발명은에폭시수지, 경화제, 경화촉진제, 무기충전제, 분산제를포함하는반도체소자밀봉용에폭시수지조성물에있어서, 상기에폭시수지는화학식 1로표시되는에폭시수지를포함하고, 상기경화제는화학식 2로표시되는경화제를포함하고, 상기경화촉진제는이미다졸계경화촉진제를포함하고, 상기분산제는인산에스테르결합을가진분산제를포함하는, 반도체소자밀봉용에폭시수지조성물및 이를사용하여밀봉된반도체소자에관한것이다.
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公开(公告)号：KR1020140083788A
公开(公告)日：2014-07-04
申请号：KR1020120153913
申请日：2012-12-26
Applicant: 제일모직주식회사
CPC classification number: C08L63/00 , C08K3/04 , C08K3/22 , C08K3/32 , C08K5/0041 , C08K2201/005 , H01L23/295
Abstract: With regard to an epoxy resin composition for encapsulating a semiconductor device which comprises epoxy resin, a hardener, an inorganic filler, and a coloring agent, the present invention relates to an epoxy resin composition for encapsulating a semiconductor device, which includes modified copper hydroxide phosphate as the coloring agent, and to a semiconductor device encapsulated using the epoxy resin composition.
Abstract translation: 关于包含环氧树脂，固化剂，无机填料和着色剂的半导体装置的环氧树脂组合物，本发明涉及用于封装半导体装置的环氧树脂组合物，其包括改性的氢氧化铜磷酸盐 作为着色剂，以及使用环氧树脂组合物包封的半导体器件。
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Patent Agency Ranking
公开(公告)号：KR1020090042165A
公开(公告)日：2009-04-29
申请号：KR1020080103105
申请日：2008-10-21
Applicant: 제일모직주식회사
IPC: C08J5/18 , C08L33/14 , C08L63/00 , C09J133/08
CPC classification number: C09J163/00 , C08G59/621 , C08L33/08 , C08L61/06 , C08L63/00 , C08L2666/02 , C08L2666/04 , C09J133/08 , Y10T428/2848
Abstract: An adhesive composition for die bonding in semiconductor assembly is provided to satisfy heat resistance, wetproof property, resin mobility and minimization of insulation property by crack. An adhesive composition for die bonding in semiconductor assembly comprises acrylic polymer 10-85 weight% which contains cross-linkable epoxy radical having the epoxy equivalent of 1,000-10,000 and has the average molecular weight of 100,000-1,000,000; epoxy resin 5-40 weight% including multifunctional epoxy radical 5-40 weight%; phenol type hardened resin 5-40 weight%; curing catalyst 0.01-10 weight%; silane coupling agent 0.01-10 weight%; and filler 0.1-60 weight%.
Abstract translation: 提供半导体组件中用于芯片接合的粘合剂组合物，以满足耐热性，耐湿性，树脂迁移性和通过裂纹最小化绝缘性能。 用于半导体组件中的芯片粘合的粘合剂组合物包含10-85重量％的丙烯酸聚合物，其含有环氧当量为1,000-10,000的可交联的环氧基团，其平均分子量为100,000-1,000,000; 环氧树脂5-40重量％，包括多官能环氧基5-40重量％; 酚型硬化树脂5-40重量％; 固化催化剂0.01-10重量％; 硅烷偶联剂0.01-10重量％; 和填料0.1-60重量％。
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公开(公告)号：KR100836571B1
公开(公告)日：2008-06-10
申请号：KR1020060138280
申请日：2006-12-29
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to improve an adhesiveness with various members such as a semiconductor device and a lead frame, and to ensure crack resistance upon substrate mounting. An epoxy resin composition for encapsulating a semiconductor device includes an epoxy resin, a hardener, a hardening accelerator, a coupling agent, and an inorganic filler. A benzotriazole-based compound represented by the following formula 1 is contained in an amount 0.01-2wt% of the total epoxy resin composition. In the formula 1, each of R1 and R2 is any one selected from a hydrogen atom, a mercapto group, an amino group, a hydroxyl group, and a C1-8 hydrocarbon chain.
Abstract translation: 提供一种用于封装半导体器件的环氧树脂组合物，以提高与诸如半导体器件和引线框架的各种部件的粘合性，并且确保基板安装时的抗裂纹性。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，硬化促进剂，偶联剂和无机填料。 由下式1表示的苯并三唑系化合物的含量为总环氧树脂组合物的0.01〜2重量％。 在式1中，R 1和R 2各自为氢原子，巯基，氨基，羟基和C 1-8烃链中的任意一种。
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公开(公告)号：KR1020140082527A
公开(公告)日：2014-07-02
申请号：KR1020120152619
申请日：2012-12-24
Applicant: 제일모직주식회사
CPC classification number: C08L63/00 , C08K3/04 , C08K3/22 , C08K3/34 , C08K2003/2241 , C08K2003/2265 , H01L23/295
Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device including epoxy resin, a curing agent, an inorganic filler, and a colorant containing titanium oxide, iron oxide, and a mixture of mica and the semiconductor device manufactured using the epoxy resin composition. The present invention provides the epoxy resin composition for sealing the semiconductor device capable of implementing excellent marking properties to a carbon dioxide laser in which output is low, reducing the generation of soot during laser marking by reducing the content of carbon black which is an existing colorant, and increasing electric insulation.
Abstract translation: 本发明涉及一种用于密封半导体器件的环氧树脂组合物，其包括环氧树脂，固化剂，无机填料和包含二氧化钛，氧化铁和云母混合物的着色剂和使用环氧树脂制造的半导体器件 组成。 本发明提供一种用于密封半导体器件的环氧树脂组合物，该半导体器件能够对输出低的二氧化碳激光器实现优异的标记性能，通过降低作为现有着色剂的炭黑的含量来减少激光打标期间的烟灰产生 ，并增加电绝缘。
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公开(公告)号：KR1020120069473A
公开(公告)日：2012-06-28
申请号：KR1020100131031
申请日：2010-12-20
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition for sealing semiconductor device and a semiconductor device using thereof are provided to improve marking contrast without increasing content amount of carbon black and to reduce output of laser in marking. CONSTITUTION: An epoxy resin composition for the sealing of semiconductor device comprises an epoxy resin, hardener, inorganic filler, and coloring agent. The coloring agent comprises 0.05-1 weight% of carbon black, 0.01-3 weight% of iron oxide-mica mixture, 2 -15 weight% of the epoxy resin, 0.5 - 12 weight% of the hardener, and 70-95 weight% of the inorganic filler.
Abstract translation: 目的：提供用于密封半导体器件的环氧树脂组合物和使用它的半导体器件，以提高标记对比度而不增加炭黑的含量，并减少标记中激光的输出。 构成：用于密封半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，无机填料和着色剂。 着色剂包含0.05-1重量％的炭黑，0.01-3重量％的氧化铁 - 云母混合物，2-15重量％的环氧树脂，0.5-12重量％的硬化剂和70-95重量％ 的无机填料。
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