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公开(公告)号：KR1020140133178A
公开(公告)日：2014-11-19
申请号：KR1020130052901
申请日：2013-05-10
Applicant: 제일모직주식회사
Abstract: 본 발명은 에폭시 수지, 경화제, 무기충전제, 및 착색제를 포함하고, 상기 착색제는 티탄질화물과 티탄블랙의 혼합물을 포함하는, 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자에 관한 것이다.
Abstract translation: 本发明涉及一种包封环氧树脂，固化剂，无机填料和着色剂的半导体器件的环氧树脂组合物，其中着色剂包括硝酸钛和钛黑的混合物，以及半导体器件 通过使用它们进行封装。 本发明的目的是提供一种用于封装半导体的环氧树脂组合物，其具有优异的标记性能。 可以减少作为现有着色剂的炭黑的含量，以减少激光打标期间的烟灰并提高绝缘性能。
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公开(公告)号：KR1020140129922A
公开(公告)日：2014-11-07
申请号：KR1020130048884
申请日：2013-04-30
Applicant: 제일모직주식회사
IPC: C09J11/04 , C09J163/00 , C09J7/02 , H01L21/60
CPC classification number: C09J11/04 , C09J7/22 , C09J7/30 , C09J7/35 , C09J163/00 , C09J2201/61 , C09J2201/622 , C09J2203/326 , C09J2205/102
Abstract: 본 발명은 하기 식 1의 금속 이온 포착제를 포함하는 것을 특징으로 하는 반도체용 접착 조성물 혹은 반도체용 접착 필름, 및 상기 반도체용 접착 필름에 의해 접속된 반도체 장치에 관한 것이다.
[식 1]
X
(m) Y
(n) Z
(1-mn) · (H
2 O)
p
상기 식 1에서,
X, Y 및 Z는 각각 서로 상이하고, Zr, Sn, Mg, Ti, Al, Bi 및 Sb 중 어느 하나, 혹은 상기 금속의 산화물, 탄산염 또는 인산염이며, m 및 n은 서로 독립적으로 0 초과 1 미만의 수이고, 1-mn은 0이 아니며, p는 0 이상의 수이다.Abstract translation: 本发明涉及一种用于半导体的粘合剂组合物，其特征在于包括式1的金属离子清除剂，用于半导体用粘合剂膜，以及通过使用半导体用粘合膜制造的半导体器件。 式1：X_（m）Y_（n）Z_（1-m-n）·（H_2O）_p。 在式1中，X，Y和Z彼此不同，是Zr，Sn，Mg，Ti，Al，Bi和Sb中的一种，或金属的碳酸盐，磷酸盐或氧化物中的一种; m和n分别是大于0但小于1的数字; 1-m-n不满足0; p是0以上的数。
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公开(公告)号：KR1020140082522A
公开(公告)日：2014-07-02
申请号：KR1020120152613
申请日：2012-12-24
Applicant: 제일모직주식회사
CPC classification number: C08L63/00 , C08G59/62 , C08K5/0025 , C08K5/3445 , C08K5/521 , H01L23/295
Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, which comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a dispersing agent; and to a semiconductor device sealed by using the same, wherein the epoxy resin comprises an epoxy resin expressed as chemical formula 1; the curing agent comprises a curing agent expressed as checmical formula 2; the curing accelerator comprises an imidazole-based curing accelerator; the dispersing agent comprises a dispersing agent having a phosphate ester bond.
Abstract translation: 本发明涉及一种用于密封半导体器件的环氧树脂组合物，其包含环氧树脂，固化剂，固化促进剂，无机填料和分散剂; 以及通过使用其密封的半导体器件，其中环氧树脂包含以化学式1表示的环氧树脂; 固化剂包括以化学式2表示的固化剂; 固化促进剂包括咪唑基固化促进剂; 分散剂包括具有磷酸酯键的分散剂。
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公开(公告)号：KR1020100069849A
公开(公告)日：2010-06-25
申请号：KR1020080128390
申请日：2008-12-17
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition and a semiconductor device using thereof are provided to prevent the curving of the semiconductor device including an asymmetric flat structure, and to improve the fire retardant property, and the reliability of the semiconductor device. CONSTITUTION: An epoxy resin composition for sealing a semiconductor device contains an epoxy resin, a hardener, a curing accelerator, an inorganic filler, and an additive. The epoxy resin is either a polyaromatic epoxy resin marked with chemical formula 1, or a phenol aralkyl type epoxy resin marked with chemical formula 2. The inorganic filler is molten silica in which the content of a particle with the particle diameter more than 53 microns is less than 0.4wt%. The additive is a phenolic antioxidant marked with chemical formula 3.
Abstract translation: 目的：提供一种环氧树脂组合物和使用其的半导体器件，以防止包括不对称平面结构的半导体器件的弯曲，并提高阻燃性能和半导体器件的可靠性。 构成：用于密封半导体装置的环氧树脂组合物含有环氧树脂，硬化剂，固化促进剂，无机填料和添加剂。 环氧树脂是用化学式1标记的多芳族环氧树脂，或者化学式为2的苯酚芳烷基型环氧树脂。无机填料是熔融二氧化硅，其中粒径大于53微米的颗粒的含量为 小于0.4wt％。 添加剂是用化学式3标记的酚类抗氧化剂。
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公开(公告)号：KR100896794B1
公开(公告)日：2009-05-11
申请号：KR1020070137940
申请日：2007-12-26
Applicant: 제일모직주식회사
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자에 관한 것으로, 에폭시수지, 경화제, 경화촉진제, 무기 충전제, 및 커플링제를 포함하는 에폭시 수지 조성물에 있어서, 상기 에폭시수지로 다방향족 에폭시수지와 페놀아랄킬형 에폭시수지를 병용하고, 상기 커플링제로 에폭시계 실란 커플링제와 아미노계 실란 커플링제를 병용함으로써, 패키지의 휨 특성과 신뢰성이 양호하고, 우수한 성형성과 난연성을 갖는 반도체 소자를 제공할 수 있다.
반도체, 에폭시, 다방향족 에폭시수지, 페놀아랄킬형 에폭시수지, 에폭시계 실란 커플링제, 아미노계 실란 커플링제, 휨 특성, 신뢰성, 성형성, 난연성Abstract translation: 本发明是在，环氧树脂，固化剂，固化促进剂，无机填料，并在环氧树脂组合物中的偶合剂，含有环氧树脂涉及一种使用环氧树脂组合物，密封的半导体器件和本，用于半导体器件的密封 芳香族环氧树脂和组合使用环氧树脂的苯酚芳烷基型，所述基于氨基的偶联剂环氧系硅烷偶联剂和组合使用的硅烷偶联剂，具有优异的成型性和阻燃性的包和可靠性好，以及半导体器件的弯曲特性 可以提供。
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Patent Agency Ranking
公开(公告)号：KR100882336B1
公开(公告)日：2009-02-11
申请号：KR1020070137912
申请日：2007-12-26
Applicant: 제일모직주식회사
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent flame retardancy without the use of a halogen-based flame retardant, bending property, moldability and reliability by using an epoxy resin mixed with polyaromatic epoxy resin and phenolaralkyl type epoxy resin. An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resin, curing agent, curing accelerator and inorganic filler. The epoxy resin is a mixture of a polyaromatic epoxy resin indicated as the chemical formula 1 and a phenolaralkyl type epoxy resin indicated as the following chemical formula 2. The inorganic filler is a fused silica of which the content of the particles having a particle diameter of 53 micron or more is 0.3 weight% or less. In the chemical formula 1, R^1-R^10 are independently hydrogen atom or C1-6 alkyl group and the average of m is 1-7. In the chemical formula 2, the average of n is 1-5.
Abstract translation: 提供用于封装半导体器件的环氧树脂组合物，以通过使用与多芳族环氧树脂和酚烷基型环氧树脂混合的环氧树脂，而不使用卤素类阻燃剂，弯曲性，成型性和可靠性来确保优异的阻燃性。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，固化剂，固化促进剂和无机填料。 环氧树脂是化学式1所示的多芳族环氧树脂和如下述化学式2所示的酚醛烷基型环氧树脂的混合物。无机填料是熔融二氧化硅，其粒径为 53微米以上为0.3重量％以下。 在化学式1中，R 1〜R 10独立地为氢原子或C 1-6烷基，m的平均值为1-7。 在化学式2中，n的平均值为1-5。
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公开(公告)号：KR100814705B1
公开(公告)日：2008-03-18
申请号：KR1020060137085
申请日：2006-12-28
Applicant: 제일모직주식회사
CPC classification number: H01L23/293 , B29C39/003 , B29C45/0013 , C08J3/20 , C08K3/013 , C08K3/36 , C08L61/04 , C08L63/00
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to realize excellent flame resistance without using a halogen- or phosphor-based flame retardant, to maintain excellent reflow property, and to impart excellent moldability even in a thin package. An epoxy resin composition for encapsulating a semiconductor device comprises 3-15 wt% of an epoxy resin, 0.1-10 wt% of a curing agent, 0.001-1 wt% of a curing accelerator, and 80-93 wt% of an inorganic filler. The epoxy resin is a polyaromatic epoxy resin represented by the following formula 1, wherein R1-R10 are the same or different and represent H or a C1-C6 alkyl, and n has an average of 1-7. The curing agent includes a phenolaralkyl type phenolic resin represented by the following formula 3 and a multi-functional phenolic resin represented by the following formula 4, wherein n has an average of 1-7. The inorganic filler comprises 0.3% or less of particles having a particle diameter of 53 micrometers or higher, and is silica having an average spheronization degree of 0.85 or higher.
Abstract translation: 提供用于封装半导体器件的环氧树脂组合物，以在不使用卤素或磷光体基阻燃剂的情况下实现优异的阻燃性，以保持优异的回流性能，并且即使在薄的封装中也具有优异的成型性。 用于封装半导体器件的环氧树脂组合物包含3-15重量％的环氧树脂，0.1-10重量％的固化剂，0.001-1重量％的固化促进剂和80-93重量％的无机填料 。 环氧树脂是由下式1表示的多芳族环氧树脂，其中R1-R10相同或不同，表示H或C1-C6烷基，n的平均值为1-7。 固化剂包括由下式3表示的酚醛烷基型酚醛树脂和由下式4表示的多官能酚醛树脂，其中n的平均值为1-7。 无机填料包含0.3％以下的粒径为53微米以上的粒子，平均球形度为0.85以上的二氧化硅。
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公开(公告)号：KR100386395B1
公开(公告)日：2003-06-02
申请号：KR1020000067109
申请日：2000-11-13
Applicant: 제일모직주식회사
IPC: H01L23/29
Abstract: PURPOSE: An epoxy resin composition for sealing a semiconductor device is provided to improve reliability of a semiconductor device by improving a composition of an epoxy resin. CONSTITUTION: An epoxy resin composition is formed with a mixture of an ortho-cresol-novolac-based epoxy resin formed by the first chemical reaction formula and a hetero-bi-functional epoxy resin of 3.0 to 12 weight percents formed by the second chemical reaction formula, a hardener of 2.0 to 6.5 weight percents formed by the third chemical reaction formula, an accelerator of 0.1 to 0.3 weight percent, an amine denatured silicon oil of 0.1 to 10 weight percent, an inorganic absorbing agent of 82 to 90 weight percents. A mixed weight ratio of the mixture of the ortho-cresol-novolac-based epoxy resin and the hetero-bi-functional epoxy resin is 2 to 8 or 6 to 4.
Abstract translation: 目的：提供一种用于密封半导体器件的环氧树脂组合物，通过改善环氧树脂的组成来提高半导体器件的可靠性。 组成：环氧树脂组合物由第一化学反应配方形成的邻甲酚 - 酚醛清漆基环氧树脂和第二化学反应形成的3.0-12重量％的异双功能环氧树脂的混合物形成 配方，由第三化学反应配方形成的2.0至6.5重量％的硬化剂，0.1至0.3重量％的促进剂，0.1至10重量％的胺改性硅油，82至90重量％的无机吸收剂。 邻甲酚 - 酚醛清漆基环氧树脂和异双官能环氧树脂的混合物的混合重量比为2至8或6至4。
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公开(公告)号：KR1020000065486A
公开(公告)日：2000-11-15
申请号：KR1019990011822
申请日：1999-04-06
Applicant: 제일모직주식회사
IPC: H01L23/08
Abstract: PURPOSE: An epoxy resin composition for sealing a semiconductor device is provided to improve stability and reliability by using 2-(demethylaminomethyl)phenol or 2,4,6-tris(demethylaminomethyl)phenol as a hardening catalytic agent. CONSTITUTION: An epoxy resin composition for sealing a semiconductor device comprises an epoxy resin composition using a biphenyl epoxy resin as a necessary component, an ortho-cresol-noblock epoxy resin and a hardening agent of a phenol or a xyloc series. The epoxy resin composition uses not triphenylpospin or an imidazol catalytic agent but 2-(demethylaminomethyl)phenol or 2,4,6-tris(demethylaminomethyl)phenol as a hardening catalytic agent.
Abstract translation: 目的：提供一种用于密封半导体器件的环氧树脂组合物，以通过使用2-（去甲基氨基甲基）苯酚或2,4,6-三（去甲基氨基甲基）苯酚作为硬化催化剂来提高稳定性和可靠性。 构成：用于密封半导体器件的环氧树脂组合物包括使用联苯环氧树脂作为必需组分的环氧树脂组合物，邻甲酚 - 无嵌段环氧树脂和苯酚或xyloc系列的固化剂。 环氧树脂组合物不使用三苯基苯胺或咪唑催化剂，而是使用2-（去甲基氨基甲基）苯酚或2,4,6-三（去甲基氨基甲基）苯酚作为硬化催化剂。
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公开(公告)号：KR1020140129923A
公开(公告)日：2014-11-07
申请号：KR1020130048885
申请日：2013-04-30
Applicant: 제일모직주식회사
IPC: C09J11/00 , C09J163/00 , C09J7/02 , H01L21/60
CPC classification number: C09J11/00 , C09J7/22 , C09J7/30 , C09J7/35 , C09J163/00 , C09J2201/61 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68327
Abstract: 본 발명은 이온 포착제로서 화학식 1로 표시되는 고리 화합물을 포함하여 금속 이온과 결합되거나, 금속 이온을 산화 또는 환원시켜 금속의 이동도를 현저히 감소시켜, 반도체 공정 중 또는 공정이 끝난 후 반도체 소자의 작동 효율을 극대화시킬 수 있는 반도체용 접착 조성물 및 이를 이용한 접착 필름을 제공하는 것이다.
Abstract translation: 本发明涉及一种用于半导体的粘合剂组合物，其能够在半导体工艺期间或在该工艺之后使半导体器件的工作效率最大化，通过氧化或还原金属离子或与金属离子组合来显着降低金属的迁移率，包括 由化学式1表示的环化合物作为离子清除剂; 和使用其的粘合膜。
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