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公开(公告)号：KR101466273B1
公开(公告)日：2014-11-28
申请号：KR1020110142972
申请日：2011-12-27
Applicant: 제일모직주식회사
CPC classification number: H01L2924/12044
Abstract: 말단에 규소 결합된 수소(Si-H)를 가지는 제1 폴리실록산, 그리고 말단에 규소 결합된 알케닐 기(Si-Vi)를 가지는 제2 폴리실록산을 포함하고, 상기 규소 결합된 수소(Si-H)와 상기 규소 결합된 알케닐 기(Si-Vi)의 비율(Si-H/Si-Vi)은 1 내지 1.2인 봉지재용 투광성 수지, 상기 투광성 수지를 포함하는 봉지재 및 전자 소자에 관한 것이다.
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公开(公告)号：KR1020120078614A
公开(公告)日：2012-07-10
申请号：KR1020110142972
申请日：2011-12-27
Applicant: 제일모직주식회사
CPC classification number: H01L2924/12044
Abstract: PURPOSE: A transparent resin for encapsulant resin is provided to improve physical properties of a transparent resin, thereby increasing processability, while preventing the degradation of luminous efficiency. CONSTITUTION: A transparent resin for encapsulant resin comprises a first polysiloxane having silicon-bonded hydrogen(Si-H) in terminal, and a second polysiloxane having a silicon-bonded alkenyl group(Si-Vi) in terminal. The ratio(Si-H/Si-Vi) of alkenyl group(Si-Vi) to the silicon-bonded hydrogen(Si-H) is 1-1.2. The sealant is obtained by curing the transparent resin for encapsulant. The encapsulant has transmittancy(T) of 80-100% in 450nm wavelength, and has reduction of transmittancy(ΔT) after heating at 120°C for 500 hours is lower than 15%.
Abstract translation: 目的：提供用于密封树脂的透明树脂，以改善透明树脂的物理性能，从而提高加工性能，同时防止发光效率的降低。 构成：用于密封树脂的透明树脂包括末端具有硅键合氢（Si-H）的第一聚硅氧烷和末端具有硅键合烯基（Si-Vi）的第二聚硅氧烷。 烯基（Si-Vi）与硅键合氢（Si-H）的比（Si-H / Si-Vi）为1-1.2。 通过固化用于密封剂的透明树脂获得密封剂。 密封剂在450nm波长下具有80-100％的透光率（T），并且在120℃加热500小时后，透射率（ΔT）降低低于15％。
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3.发明公开폴리오가노실록산 조성물, 상기 폴리오가노실록산 조성물로부터 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자 有权聚硅氧烷和聚氧乙烯醚和包含封装材料的电子器件获得的聚烯烃氧化物和封装材料
公开(公告)号：KR1020120017397A
公开(公告)日：2012-02-28
申请号：KR1020110077105
申请日：2011-08-02
Applicant: 제일모직주식회사
CPC classification number: H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08L83/04 , H01L2924/0002 , H01L2924/12044 , C08L83/00 , H01L2924/00
Abstract: PURPOSE: A polyorganosiloxane composition is provided to improve crack resistance with maintaining heat resistance and light resistance, and to secure the stability of an emitting diode, thereby improving productivity. CONSTITUTION: A polyorganosiloxane composition comprises a first portion in chemical formula 1, a second portion in chemical formula 2, a linear first polyorganosiloxane resin, which has double bonds in both ends, and a network second polyorganosiloxane resin. The number average molecular weight of the first polyorganosiloxane resin is 900-20000. The amount of the first polyorganosiloxane resin and the second polyorganosiloxane resin is 10-25 parts by weight and 40-75 parts by weight respectively.
Abstract translation: 目的：提供聚有机硅氧烷组合物，以保持耐热性和耐光性，并确保发光二极管的稳定性，从而提高生产率，从而提高抗裂性。 构成：聚有机硅氧烷组合物包含化学式1的第一部分，化学式2中的第二部分，两端具有双键的线性第一聚有机硅氧烷树脂和网络第二聚有机硅氧烷树脂。 第一聚有机硅氧烷树脂的数均分子量为900-20000。 第一聚有机硅氧烷树脂和第二聚有机硅氧烷树脂的量分别为10-25重量份和40-75重量份。
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公开(公告)号：KR1020100069830A
公开(公告)日：2010-06-25
申请号：KR1020080128368
申请日：2008-12-17
Applicant: 제일모직주식회사
Abstract: PURPOSE: An epoxy resin composition and a semiconductor device using thereof are provided to obtain the excellent fire retardant property without using a flame retardant including a halogen group or antimony trioxide generating by-products which is harmful for the human body. CONSTITUTION: An epoxy resin composition for sealing a semiconductor device contains an epoxy resin, a hardener, a curing accelerator, an inorganic filler, a flame retardant, and an additive. The flame retardant includes 0.5~5wt% of calcium borate, and 1~10wt% of boron nitride as an additive. The average granularity of the calcium borate is less than 3.52 microns. The inorganic filler is crystalline silica.
Abstract translation: 目的：提供环氧树脂组合物和使用其的半导体装置，以便不使用包含对人体有害的产生副产物的卤素基或三氧化锑的阻燃剂来获得优异的阻燃性能。 构成：用于密封半导体装置的环氧树脂组合物含有环氧树脂，硬化剂，固化促进剂，无机填料，阻燃剂和添加剂。 阻燃剂包括0.5〜5wt％的硼酸钙和1〜10wt％的氮化硼作为添加剂。 硼酸钙的平均粒度小于3.52微米。 无机填料是结晶二氧化硅。
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公开(公告)号：KR1020090070431A
公开(公告)日：2009-07-01
申请号：KR1020070138444
申请日：2007-12-27
Applicant: 제일모직주식회사
IPC: H01L23/29
CPC classification number: C08L63/00 , C08G59/245 , C08G59/621 , C08K2201/005 , H01L23/29
Abstract: An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent moldability in packaging and to improve appearance of a semiconductor package. An epoxy resin composition for encapsulating a semiconductor device comprises an epoxy resin, hardener, curing accelerator and inorganic filler. The inorganic filler uses silica microspheres with an average particle diameter of 0.7 micron or less and a specific surface area of 10-40 m^2/g. The silica microspheres are used in the amount of 0.1~30 weight% based on the whole epoxy resin composition. The epoxy resin comprises a phenol aralkyl type epoxy resin represented by chemical formula 1 or a biphenyl type epoxy resin represented by chemical formula 2.
Abstract translation: 提供了用于封装半导体器件的环氧树脂组合物，以确保在封装中的优异成型性和改善半导体封装的外观。 用于封装半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂和无机填料。 无机填料使用平均粒径为0.7微米或更小，比表面积为10-40平方米/克的二氧化硅微球。 基于全部环氧树脂组合物，二氧化硅微球的用量为0.1〜30重量％。 环氧树脂包括由化学式1表示的苯酚芳烷基型环氧树脂或由化学式2表示的联苯型环氧树脂。
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Patent Agency Ranking
公开(公告)号：KR1020090068952A
公开(公告)日：2009-06-29
申请号：KR1020070136766
申请日：2007-12-24
Applicant: 제일모직주식회사
IPC: C08L63/00 , C08L63/04 , C08K5/3492 , H01L23/08
Abstract: An epoxy resin composition for sealing a semiconductor device is provided to ensure excellent flame resistance by using a fatty acid-containing melamine cyanurate as a flame retardant while not using a halogen-based flame retardant, and to ensure excellent ire retardancy, and moldability and reliability. An epoxy resin composition for sealing a semiconductor device comprises epoxy resin, hardener, curing accelerator, inorganic filler and flame retardant. The flame retardant is a fatty acid-containing melaminecyanurate. The fatty acid is C12~24 saturated fatty acid. The fatty acid-containing melaminecyanurate has electroconductivity of 50 muS/cm or less. The flame retardant uses together the fatty acid-containing melaminecyanurate and at least one selected from the group consisting of borate-based compound, Mg-based compound and alumina-based compound.
Abstract translation: 提供用于密封半导体器件的环氧树脂组合物，以通过在不使用卤素系阻燃剂的情况下使用含有脂肪酸的三聚氰胺氰脲酸酯作为阻燃剂，并且确保优异的阻燃性和成型性和可靠性来确保优异的阻燃性 。 用于密封半导体器件的环氧树脂组合物包括环氧树脂，硬化剂，固化促进剂，无机填料和阻燃剂。 阻燃剂是含脂肪酸的三聚氰胺氰尿酸酯。 脂肪酸为C12〜24饱和脂肪酸。 含脂肪酸的三聚氰胺氰尿酸酯的电导率为50μS/ cm以下。 阻燃剂一起使用含脂肪酸的三聚氰胺氰尿酸酯和选自硼酸酯基化合物，Mg基化合物和氧化铝基化合物中的至少一种。
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公开(公告)号：KR101387739B1
公开(公告)日：2014-04-21
申请号：KR1020110044204
申请日：2011-05-11
Applicant: 제일모직주식회사
Abstract: 하기 화학식 1로 표현되는 부분을 가지는 폴리실록산을 포함하는 투광성 수지 조성물을 제공한다:
[화학식 1]
*-Si-Ar-Si-*
상기 화학식 1에서, Ar은 치환 또는 비치환된 C6 내지 C30 아릴렌기이다.-
8.发明授权하이브리드 실록산 중합체, 상기 하이브리드 실록산 중합체로부터 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자 有权混合硅氧烷聚合物组合物和由硅氧烷聚合物组合物获得的包封材料和包括封装材料的电子器件
公开(公告)号：KR101277722B1
公开(公告)日：2013-06-24
申请号：KR1020100068143
申请日：2010-07-14
Applicant: 제일모직주식회사
CPC classification number: C08L83/04 , C08G77/50 , C08G77/52 , C08L83/00 , C09J183/04 , Y10T428/31663
Abstract: 하기 화학식 1a로 표현되는 부분 및 하기 화학식 1b로 표현되는 부분을 가지며 양 말단에 이중 결합을 가지는 선형의 제1 실록산 수지, 그리고 3차원 망상 구조의 제2 실록산 수지를 포함하는 하이브리드 실록산 중합체를 제공한다. 또한 상기 하이브리드 실록산 중합체로부터 형성된 봉지재 및 상기 봉지재를 포함하는 전자 소자를 제공한다.
[화학식 1a]
[화학식 1b]-
公开(公告)号：KR1020120078300A
公开(公告)日：2012-07-10
申请号：KR1020100140561
申请日：2010-12-31
Applicant: 제일모직주식회사
CPC classification number: H01L2224/48091 , H01L2924/00014 , C08L83/04 , C08G77/04 , C08K5/54 , H01L23/296 , H01L33/56 , H01L51/5246
Abstract: PURPOSE: An encapsulant is provided to lower viscosity of resin, to improve processability, and to uniformly distribute phosphors, thereby improving color uniformity and luminous efficiency. CONSTITUTION: An encapsulant comprises a first polysiloxane in chemical formula 1, a monomer in chemical formula 2a, a second polysiloxane in chemical formula 3. In chemical formula 1, the ratio of D1 to T1 is 1:1-1:10. The encapsulant has viscosity of 500-4000 cPs. The encapsulant additionally comprises a hydrosilylation catalyst and/or a phosphor. An electronic device comprises an encapsulant layer obtained by curing the encapsulant, and a luminescent part displaying color in a region of wavelength shorter than the phosphor.
Abstract translation: 目的：提供密封剂以降低树脂的粘度，改善加工性能，并均匀分布磷光体，从而提高颜色均匀性和发光效率。 构成：封装剂包括化学式1中的第一聚硅氧烷，化学式2a中的单体，化学式3中的第二聚硅氧烷。在化学式1中，D1与T1的比例为1:1-1:10。 密封剂的粘度为500-4000cPs。 密封剂另外包括氢化硅烷化催化剂和/或磷光体。 电子设备包括通过固化密封剂而获得的密封剂层和在比荧光体短的波长区域显示颜色的发光部分。
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公开(公告)号：KR101148140B1
公开(公告)日：2012-05-23
申请号：KR1020070136754
申请日：2007-12-24
Applicant: 제일모직주식회사
IPC: H01L23/29
Abstract: 본 발명은 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자에 관한 것으로, 보다 상세하게는 에폭시수지, 경화제, 경화촉진제, 무기 충전제, 및 난연제를 포함하는 에폭시 수지 조성물에 있어서, 상기 난연제로 칼슘 보레이트를 사용함으로써 난연성, 성형성 및 신뢰도가 우수한 반도체 소자를 제공한다.
반도체 소자, 난연제, 칼슘 보레이트, 난연성, 성형성, 신뢰도
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