Abstract:
본 발명에 의한 유기발광다이오드는 기판, 상기 기판 위에 형성된 절연층, 상기 절연층 위에 형성된 하부전극, 상기 하부전극 위에 형성된 유기물층, 상기 유기물층 위에 형성된 상부 반투명 전극 및 상기 상부 반투명 전극 위에 폴리머층을 포함하고, 상기 폴리머층은 다수의 돔 형태의 열경화성 폴리머이며, 내부에 미세구조체을 포함한다.
Abstract:
본 발명은 반사기판을 포함하는 유기 발광 다이오드에 관한 것으로, 보다 상세하게는 반사기판상에 유기물 활성층이 형성되어 있고, 상기 유기물 활성층 상에 투명 전극층이 형성되어 있는 층 구조를 갖는 유기 발광 다이오드를 사용함으로써, 추가적인 평탄화 및 절연용 박막과 반사 박막이 필요없어, 구조를 단순화시켜 공정의 효율성을 증가시킬 수 있도록 한 유기 발광 다이오드에 관한 것이다.
Abstract:
PURPOSE: A front light emitting type organic light emitting diode and a manufacturing method thereof are provided to improve light emission efficiency by using a lithography process. CONSTITUTION: A lower electrode is formed on a first substrate(S10). An organic light emitting layer is formed on the lower electrode(S20). An upper electrode is formed on the organic light emitting layer(S30). An auxiliary electrode is bonded to the upper electrode(S40). An aperture pattern is formed on the auxiliary electrode. [Reference numerals] (AA) Start; (BB) End; (S10) Form a lower electrode on a first substrate; (S20) Form an organic light emitting layer on the lower electrode; (S30) Form an upper electrode on the organic light emitting layer; (S40) Bond an auxiliary electrode to the upper electrode formed on a second substrate; (S50) Separate the second substrate from the auxiliary electrode
Abstract:
PURPOSE: A flexible metal substrate using a mother substrate having a protective layer and a method for manufacturing a flexible electronic device and the flexible metal substrate and the flexible electronic device manufactured by the method are provided to reduce process time. CONSTITUTION: A protective layer(110) which has anticorrosion against acidic plating solution or basic plating solution is formed on a mother substrate(100). A flexible metal substrate(200) is formed on the protective layer by electroplating. The flexible metal substrate is separated from the protective layer. An electric device is formed on the flexible metal substrate. The flexible metal substrate is a cathode. [Reference numerals] (100) Mother substrate; (110) Protective layer; (200) Flexible metal substrate; (300) Electric device; (400) Sealing layer
Abstract:
본 발명은 유기발광다이오드 및 그 제조방법에 관한 것으로서, 더욱 상세하게는 낮은 광 추출 효율을 증가시킬 수 있는 투명 폴리머를 유기발광다이오드 소자에 부착하여 높은 광 추출 효율을 얻을 수 있는 유기발광다이오드 제조방법 및 그 방법에 의해 제조된 유기발광다이오드에 관한 것이다. 본 발명에 따른 유기발광다이오드는 투명 또는 불투명 기판과, 상기 기판 위에 형성된 평탄한 절연막과, 상기 절연막 위에 형성된 반사전극인 양극과, 상기 양극 위에 유기물을 증착하여 형성된 유기발광층과, 상기 유기발광층 위에 형성된 반투명전극인 음극과, 상기 음극 위에 형성된 굴절률 조절층 및 상기 굴절률 조절층 위에 형성된 굴곡 구조의 나노 구조체를 포함하는 폴리머층을 포함하여 구성된다.
Abstract:
The present invention relates to a method of manufacturing an organic light emitting diode and, more specifically, to a method of manufacturing a high-efficiency white organic light emitting diode and improving the efficiency of a quantum point light emitting device while laminating an electrode on a substrate and forming a quantum point light emitting layer on the electrode. In order to achieve the above object, the method of manufacturing an organic light emitting diode according to the present invention comprises: a first electrode forming step of forming a first electrode on a first substrate; a first quantum point light emitting layer forming step of forming an organic light emitting layer including a quantum dot on the first electrode; a second electrode forming step of forming a second electrode on a second substrate; a second quantum dot light emitting layer forming step of forming an organic light emitting layer including an quantum dot on the second electrode; and a step of bonding the first quantum dot light emitting layer and the second quantum dot light emitting layer. The method of manufacturing an organic light emitting diode according to the present invention has a better interfacial contact between the quantum dot light emitting layer and a connected layer by bonding the first substrate and the second substrate with the organic light emitting layer by heat or pressure. As a result, the electrical and optical properties of a device are improved as well as the lifetime of the device is increased. [Reference numerals] (10) First substrate;(10a) Second substrate;(20) First electrode;(20a) Second electrode;(310) Hole inserting layer;(320) Hole transporting layer;(340) Electron transporting layer;(350) Electron inserting layer;(AA) Bond
Abstract:
The present invention relates to an organic light emitting diode and a manufacturing method thereof wherein the organic light emitting diode can acquire high photon extraction efficiency by attaching a transparent polymer capable of improving low photon extraction efficiency to an organic light emitting diode device. The organic light emitting diode comprises: a transparent or opaque substrate, a flat insulation film formed on the substrate, an anode which is a repeller and formed on the insulation film, an organic light emitting layer formed by vapor depositing an organic matter on the anode, an opaque cathode formed on the organic light emitting layer, a refractive index controlling layer formed on the cathode, and a polymer layer including a nanostructure of a bend structure formed on the refractive index controlling layer.
Abstract:
An organic light emitting diode according to the present invention includes a substrate; an insulation layer which is formed on the substrate; a bottom electrode which is formed on the insulation layer; an organic material layer which is formed on the bottom electrode; a top semitransparent electrode which is formed on the organic material layer; and a polymer layer which is formed on the top semitransparent electrode. The polymer layer is a thermosetting polymer with a dome shape and includes a fine structure inside.
Abstract:
PURPOSE: An organic light emitting diode and a method for manufacturing the same are provided to improve device efficiency by forming an organic active layer and a transparent electrode on a reflection substrate. CONSTITUTION: An organic active layer is formed on a metallic substrate. A transparent electrode is formed on the organic active layer. A planarization layer and an insulating layer are not formed between the metallic substrate and the organic active layer. The surface roughness of the metallic substrate is measured by using an AFM(Atomic Force Microscope). The metallic substrate is used as a reflection electrode. [Reference numerals] (AA) Transparent electrode; (BB) Electron(hole) injection layer; (CC) Electron(hole) transfer layer; (DD) Hole(electron) insulating layer; (EE) Light emitting layer; (FF) Electron(hole) insulating layer; (GG) Hole(electron) transfer layer; (HH) Hole(electron) injection layer; (II) Reflective substrate