公开(公告)号：KR1020040010923A

公开(公告)日：2004-02-05

申请号：KR1020020043962

申请日：2002-07-25

Applicant: 한국과학기술연구원

Inventor： 주병권 ,  이윤희 ,  박윤권 ,  박흥우 ,  이덕중

IPC: H01L23/28

CPC classification number: H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014

Abstract: PURPOSE: A chip scale package of an MEMS(Micro-Electro-Mechanical-System) device and a manufacturing method thereof are provided to be capable of easily carrying out a mounting process at the minimum surface area of an outer circuit board. CONSTITUTION: A chip scale package of an MEMS device is provided with a lower substrate(500) having a plurality of via holes, an upper substrate(400), a plurality of conductive material parts(540) formed at the via holes, and a plurality of MEMS devices(550) loaded at the predetermined portions of the lower substrate. The chip scale package further includes a connection part for electrically connecting the conductive material part with the MEMS device and an adhesive part(430) for attaching the upper substrate to the lower substrate.

Abstract translation: 目的：提供一种MEMS（微电子机械系统）装置的芯片级封装及其制造方法，能够容易地在外部电路板的最小表面积处进行安装处理。 构成：MEMS器件的芯片级封装设置有具有多个通孔的下基板（500），上基板（400），形成在通孔处的多个导电材料部件（540），以及 多个MEMS器件（550）装载在下基板的预定部分。 芯片级封装还包括用于将导电材料部件与MEMS器件电连接的连接部件和用于将上基板连接到下基板的粘合部件（430）。