MEMS 소자의 칩규모 패키지 및 이의 제조방법
    2.
    发明公开
    MEMS 소자의 칩규모 패키지 및 이의 제조방법 无效
    MEMS器件的芯片尺寸封装及其制造方法

    公开(公告)号:KR1020040010923A

    公开(公告)日:2004-02-05

    申请号:KR1020020043962

    申请日:2002-07-25

    CPC classification number: H01L2224/48091 H01L2224/97 H01L2924/00014

    Abstract: PURPOSE: A chip scale package of an MEMS(Micro-Electro-Mechanical-System) device and a manufacturing method thereof are provided to be capable of easily carrying out a mounting process at the minimum surface area of an outer circuit board. CONSTITUTION: A chip scale package of an MEMS device is provided with a lower substrate(500) having a plurality of via holes, an upper substrate(400), a plurality of conductive material parts(540) formed at the via holes, and a plurality of MEMS devices(550) loaded at the predetermined portions of the lower substrate. The chip scale package further includes a connection part for electrically connecting the conductive material part with the MEMS device and an adhesive part(430) for attaching the upper substrate to the lower substrate.

    Abstract translation: 目的:提供一种MEMS(微电子机械系统)装置的芯片级封装及其制造方法,能够容易地在外部电路板的最小表面积处进行安装处理。 构成:MEMS器件的芯片级封装设置有具有多个通孔的下基板(500),上基板(400),形成在通孔处的多个导电材料部件(540),以及 多个MEMS器件(550)装载在下基板的预定部分。 芯片级封装还包括用于将导电材料部件与MEMS器件电连接的连接部件和用于将上基板连接到下基板的粘合部件(430)。

    탄소나노튜브를 이용한 3극구조를 가지는 평판형전계방출램프 및 그 제조방법
    3.
    发明公开
    탄소나노튜브를 이용한 3극구조를 가지는 평판형전계방출램프 및 그 제조방법 失效
    使用碳纳米管的三角形结构的平面型排放灯及其制造方法

    公开(公告)号:KR1020030062739A

    公开(公告)日:2003-07-28

    申请号:KR1020020003098

    申请日:2002-01-18

    Abstract: PURPOSE: A flat type field emission lamp and a method for manufacturing the same are provided to achieve improved luminous efficiency and obtain a uniform luminous area even when the thickness of the lamp is thin. CONSTITUTION: A field emission lamp comprises a rear substrate(21) and a front substrate opposed with each other; a cathode electrode(22) arranged on the rear substrate; a grid electrode(23) arranged on the rear substrate in such a manner that the grid electrode crosses with the cathode electrode; a spacer(25) for heating and sealing the space formed between the rear substrate and the front substrate; a cathode electrode arranged all over the front substrate; a phosphor deposited on the anode electrode; a carbon nanotube(24) arranged on the cathode electrode and which serves as an electron emitting member; a grid(27) interposed between the cathode electrode and the anode electrode so as to control the electron emitted from the carbon nanotube; a support board(26) disposed on the rear substrate so as to install the grid; and a conductive paste deposited on the outer surface of the support board so as to electrically ground the grid to the grid electrode disposed on the rear substrate.

    Abstract translation: 目的:提供扁平型场致发射灯及其制造方法,以便即使当灯的厚度较薄时,也可实现发光效率的提高并获得均匀的发光面积。 构成:场致发射灯包括后基板(21)和彼此相对的前基板; 布置在所述后基板上的阴极电极; 以所述栅电极与所述阴极电极交叉的方式配置在所述后基板上的栅电极(23) 用于加热和密封形成在后基板和前基板之间的空间的间隔件(25) 设置在前基板整个上的阴极电极; 沉积在阳极上的荧光体; 布置在阴极电极上并用作电子发射部件的碳纳米管(24); 插入在所述阴极电极和所述阳极电极之间以控制从所述碳纳米管发射的电子的栅极(27); 设置在后基板上以便安装格栅的支撑板(26); 以及沉积在所述支撑板的外表面上以将所述栅格电电接到设置在所述后基板上的栅电极的导电膏。

    정전열접합을 이용한 진공실장방법
    4.
    发明授权
    정전열접합을 이용한 진공실장방법 失效
    采用静电热粘合的真空安装方法

    公开(公告)号:KR100356691B1

    公开(公告)日:2002-10-18

    申请号:KR1020000016605

    申请日:2000-03-30

    Abstract: 본 발명은 정전 열 접합(Electrostatic bonding)을 이용한 진공실장방법에 관한 것으로, 구체적으로는 반도체 기판과 유리 기판 또는 유리기판과 유리기판간의 정전 열 접합을 이용하여 디스플레이나 마이크로 소자를 진공 실장하는 기술에 관한 것이다. 본 발명은 기존의 배기용 세관 공정에 비해 저온에서 체적이 작은 패널 내부의 진공 효율을 극대화시키고, 실리콘 기판의 입자투과율과 물리적 강도등의 단점을 극복하며, 마이크로 소자의 피드쓰루(Feed-through)를 효율적으로 형성하는 고진공실장방법을 제공한다.

    반도체기판의정전열접합방법
    5.
    发明授权
    반도체기판의정전열접합방법 失效
    半导体基板的静电热粘结方法

    公开(公告)号:KR100270611B1

    公开(公告)日:2001-01-15

    申请号:KR1019970046677

    申请日:1997-09-11

    Abstract: PURPOSE: A method for electrostatic thermal bonding is provided to obtain reduction of manufacturing cost, stability and reliability of the product by bonding a semiconductor substrate and a glass substrate after a hydrophilic treatment. CONSTITUTION: A glass substrate and a semiconductor substrate are cleaned by immersing the same in a hydrophilic solution for a few minutes. The hydrophilic solution is provided by mixing ammonia, peroxide and deionized water with one another in a ratio of 4:1:6 and annealing the mixed solution in a range of from 45deg.C to 100deg.C. The hydrophilic-treated glass substrate and semiconductor substrate are dried in the next step. The dried substrates are firstly bonded directly each other. The directly bonded substrates are finally bonded by applying a voltage ranging from 200V to 700V and a temperature ranging from 200deg.C to 500deg.C.

    Abstract translation: 目的:提供一种用于静电热粘合的方法,以在亲水处理之后通过粘合半导体衬底和玻璃衬底来降低制造成本,稳定性和可靠性。 构成:将玻璃基板和半导体基板浸渍在亲水性溶液中清洗几分钟。 通过将氨,过氧化物和去离子水以4:1:6的比例混合并将混合溶液在45℃至100℃范围内退火而提供亲水性溶液。 亲水处理的玻璃基板和半导体基板在下一步骤中干燥。 干燥的基材首先直接接合。 通过施加200V〜700V的电压和200〜500℃的温度,直接键合的基板最终结合。

    MEMS 구조물을 이용한 탄소나노튜브 가스센서 및 그제작방법
    6.
    发明公开
    MEMS 구조물을 이용한 탄소나노튜브 가스센서 및 그제작방법 失效
    碳纳米管基于气体传感器的MEMS结构及其制造方法

    公开(公告)号:KR1020050032821A

    公开(公告)日:2005-04-08

    申请号:KR1020030068792

    申请日:2003-10-02

    Abstract: A carbon nano tube gas sensor and a method for manufacturing the same are provided to minimize the size of the carbon nano tube gas sensor by directly growing the carbon nano tube in an MEMS structure. A carbon nano tube gas sensor includes a substrate, an insulation layer formed at an upper portion of the substrate and a protective layer formed at a lower portion of the substrate. A heater(3-3) and a heater electrode are formed on the insulation layer. Another insulation layer is formed on the heater(3-3). A carbon nano tube electrode(3-6) and an electrode line are formed on the insulation layer. A catalyst metal(3-8) is formed on the carbon nano tube electrode(3-6). A lower portion of the substrate is anisotropically etched.

    Abstract translation: 提供碳纳米管气体传感器及其制造方法,以通过在MEMS结构中直接生长碳纳米管来最小化碳纳米管气体传感器的尺寸。 碳纳米管气体传感器包括基板,形成在基板的上部的绝缘层和形成在基板的下部的保护层。 在绝缘层上形成加热器(3-3)和加热电极。 在加热器(3-3)上形成另一绝缘层。 在绝缘层上形成碳纳米管电极(3-6)和电极线。 在碳纳米管电极(3-6)上形成催化剂金属(3-8)。 各向异性蚀刻基板的下部。

    탄소나노튜브를 이용한 3극구조를 가지는 평판형전계방출램프 및 그 제조방법
    7.
    发明授权
    탄소나노튜브를 이용한 3극구조를 가지는 평판형전계방출램프 및 그 제조방법 失效
    탄소나노튜브를이용한3극구조를가지는는는지는는형전계방출램프및그제조방탄

    公开(公告)号:KR100450025B1

    公开(公告)日:2004-09-24

    申请号:KR1020020003098

    申请日:2002-01-18

    Abstract: PURPOSE: A flat type field emission lamp and a method for manufacturing the same are provided to achieve improved luminous efficiency and obtain a uniform luminous area even when the thickness of the lamp is thin. CONSTITUTION: A field emission lamp comprises a rear substrate(21) and a front substrate opposed with each other; a cathode electrode(22) arranged on the rear substrate; a grid electrode(23) arranged on the rear substrate in such a manner that the grid electrode crosses with the cathode electrode; a spacer(25) for heating and sealing the space formed between the rear substrate and the front substrate; a cathode electrode arranged all over the front substrate; a phosphor deposited on the anode electrode; a carbon nanotube(24) arranged on the cathode electrode and which serves as an electron emitting member; a grid(27) interposed between the cathode electrode and the anode electrode so as to control the electron emitted from the carbon nanotube; a support board(26) disposed on the rear substrate so as to install the grid; and a conductive paste deposited on the outer surface of the support board so as to electrically ground the grid to the grid electrode disposed on the rear substrate.

    Abstract translation: 目的:提供一种扁平型场致发射灯及其制造方法,以实现提高的发光效率并且即使在灯的厚度较薄时也能获得均匀的发光面积。 构成:场致发射灯包括彼此相对的后基板(21)和前基板; 设置在后基板上的阴极电极(22) 栅格电极(23),其布置在后基板上,使得栅格电极与阴极电极交叉; (25),用于加热和密封在后基板和前基板之间形成的空间; 整个前基板上布置的阴极电极; 沉积在阳极电极上的磷光体; 碳纳米管(24),其布置在所述阴极电极上并且用作电子发射构件; 介于阴极和阳极之间的栅极(27),以控制从碳纳米管发射的电子; 支撑板(26),设置在后基板上以安装网格; 以及沉积在支撑板的外表面上的导电膏,以便将栅格电接地到设置在后基板上的栅电极。

    플라즈마 디스플레이 패널과 그 제조방법 및 제조장치
    8.
    发明公开
    플라즈마 디스플레이 패널과 그 제조방법 및 제조장치 无效
    等离子显示面板及其制造方法和装置

    公开(公告)号:KR1020040037667A

    公开(公告)日:2004-05-07

    申请号:KR1020020066249

    申请日:2002-10-29

    Abstract: PURPOSE: A fabrication method and an apparatus of a plasma display panel are provided to solve a deterioration of a panel quality due to the lowering of a vacuum degree by generating gas in case of suture process. CONSTITUTION: A plasma display panel comprises a space part formed between a front glass plate(1) and a rear glass plate(2), and a plurality of fluorescent material receiving parts(5) formed between a plurality of sidewalls(4) arranged at inside of the rear glass plate. The space part is filled with an inert gas. The front glass plate and an edge part of the rear glass plate are sealed with each other by an organic binder(10).

    Abstract translation: 目的:提供等离子体显示面板的制造方法和装置,以解决由于在缝合过程中产生气体而导致真空度降低的面板质量下降。 构成:等离子体显示面板包括形成在前玻璃板(1)和后玻璃板(2)之间的空间部分,以及形成在多个侧壁(4)之间的多个荧光材料接收部分(5) 后玻璃板内侧。 空间部分填充有惰性气体。 前玻璃板和后玻璃板的边缘部分通过有机粘合剂(10)彼此密封。

    반도체 제조용 가열장치
    9.
    发明公开
    반도체 제조용 가열장치 无效
    加热装置制造半导体

    公开(公告)号:KR1020030046217A

    公开(公告)日:2003-06-12

    申请号:KR1020010076678

    申请日:2001-12-05

    Inventor: 주병권 이덕중

    Abstract: PURPOSE: A heating apparatus for fabricating a semiconductor is provided to easily install a plurality of lamps by installing a plurality of lamp sockets and by fixing a power applying connector in the connector holes of different lamp sockets. CONSTITUTION: A base plate(18) is prepared. The plurality of lamp sockets(16) are disposed at regular intervals, fixed to a side of the base plate so that power is applied to the plurality of lamp sockets. The plurality of lamps(11) include a pair of the power applying connectors inserted and fixed into a pair of the connector holes that are installed in the lamp sockets adjacent to each other.

    Abstract translation: 目的:提供一种用于制造半导体的加热装置,通过安装多个灯插座并通过将电源施加连接器固定在不同灯插座的连接器孔中来容易地安装多个灯。 构成:准备基板(18)。 多个灯插座(16)以规则的间隔设置,固定到基板的一侧,使得电力施加到多个灯插座。 多个灯具(11)包括插入并固定在彼此相邻的灯插座中的一对连接器孔中的一对电力施加连接器。

    평판 디스플레이 진공실장 방법
    10.
    发明公开
    평판 디스플레이 진공실장 방법 无效
    平板显示器的在线包装方法

    公开(公告)号:KR1020010098283A

    公开(公告)日:2001-11-08

    申请号:KR1020000023132

    申请日:2000-04-29

    Abstract: 본 발명은 평판 디스플레이 진공실장 방법에 관한 것으로, 하부 기판의 가장자리 부분에 일정 두께와 폭의 첫번째 유리프릿을 바르고, 상기 유리프릿에 미세폭의 열전달수단을 부착하고, 상기 열전달수단 위에 두번째 유리프릿을 바르고, 상기 하부 기판의 유리프릿 내부 영역에 스페이서를 형성시키고, 상기 두번째 유리프릿 위에 상부 기판을 정렬시키고, 상기 열전달수단에 전원을 인가하여 상기 유리프릿을 열처리하는 단계를 포함하여 이루어지는 평판디스플레이 진공실장 방법을 제공한다. 본 발명에 따르면 기존의 방법에 비해 저온 공정이 가능하기 때문에 디스플레이 소자 내부의 전기적 소자를 보호할 수 있으며, 미소 체적에서 게터의 효율적인 사용과 큰 종횡비의 스페이서 형성을 효과적으로 할 수 있다. 이러한 점은 제품의 안정성을 높일 수 있으며 신뢰도를 향상시키는 효과가 있다.

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