公开(公告)号：KR1020020057507A

公开(公告)日：2002-07-11

申请号：KR1020010000571

申请日：2001-01-05

Applicant: 한국과학기술연구원

Inventor： 고석근 ,  한성 ,  조준식 ,  김기환

IPC: C23C16/54

CPC classification number: C23C18/204 ,  C23C18/1641 ,  C23C18/2066 ,  H05K3/381 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/087 ,  H05K2203/092

Abstract: PURPOSE: A method is provided to improve adhesion force between polymer and metal layer or easily form the metal layer on the polymer having low plating property without a metal seed layer, and simplify treating processes when forming the metal layer on the polymer by electroless or electrolytic plating. CONSTITUTION: The method for improving adhesion force between polymer and metal comprises the processes of partially breaking polymer bonds on the surface of the polymer by irradiating ion beams having an energy onto the polymer as injecting a reactive gas into a vacuum chamber; injecting the reactive gas into the vacuum chamber so that atoms on the surface of the bond broken polymer are reacted with the reactive gas, thereby changing the property of the surface of the polymer into hydrophilic property; and depositing a metal layer on the surface of the polymer changed into the hydrophilic property, wherein an acceleration voltage of the ion beams is 300 to 2000 V, the ion is an ionization gas such as argon, nitrogen, hydrogen, helium, oxygen, ammonia, or a mixture thereof, the reactive gas is oxygen, nitrogen, ammonia, hydrogen, or a mixture thereof, and the deposition of the metal layer is done by an electroless or electrolytic plating.

Abstract translation: 目的：提供一种提高聚合物和金属层之间的粘合力或容易在不具有金属种子层的情况下形成具有低电镀性能的聚合物上的金属层的方法，并且简化在通过无电解或电解法在聚合物上形成金属层时的处理过程 电镀。 构成：提高聚合物和金属之间的粘合力的方法包括通过在聚合物中注入具有能量的离子束将反应性气体注入真空室来部分地破坏聚合物表面上的聚合物键的方法; 将反应性气体注入真空室中，使得断裂的聚合物表面上的原子与反应性气体反应，从而将聚合物表面的性能改变为亲水性; 并且在聚合物表面上沉积金属层变为亲水性，其中离子束的加速电压为300〜2000V，离子为氩，氮，氢，氦，氧，氨等离子化气体 或其混合物，反应性气体是氧，氮，氨，氢或其混合物，并且金属层的沉积通过无电解或电解电镀进行。

公开(公告)号：KR1020010083477A

公开(公告)日：2001-09-01

申请号：KR1020000007024

申请日：2000-02-15

Applicant: 한국과학기술연구원

Inventor： 고석근 ,  백영환 ,  조준식 ,  한영건

IPC: C23C14/20

CPC classification number: C23C14/022 ,  C23C14/086 ,  C23C14/22

Abstract: PURPOSE: A deposition method is provided which manufactures a transparent conductive thin film, an IO (Indium oxide) or ITO (Indium tin oxide) thin film at a low substrate temperature, particularly at an ordinary temperature using a treatment method which damages neither transparency of the polymer substrate nor chemical stability of the surface reforming layer of the polymer substrate. CONSTITUTION: The method for depositing an IO (Indium oxide) or ITO (Indium tin oxide) thin film on a polymer substrate comprises the processes of reforming the surface of the polymer substrate by irradiating an oxygen or argon ion beam to a polymer substrate under the vacuum and oxygen atmosphere in a constant accelerated energy; and depositing an IO or ITO thin film as irradiating oxygen, argon or a mixed ion beam of oxygen and argon onto the surface reformed polymer substrate under vacuum. The method for depositing an IO (Indium oxide) or ITO (Indium tin oxide) thin film on a polymer substrate comprises the processes of reforming the surface of the polymer substrate by irradiating an oxygen or argon ion beam to a polymer substrate under the vacuum in a constant accelerated energy; and depositing an IO or ITO thin film on the surface reformed polymer substrate by generating ion beams from a cold hallow cathode ion source using an ionic gas under vacuum and sputtering the polymer substrate to a target material consisting of In2O3, or In2O3 and SnO2.

Abstract translation: 目的：提供一种沉积方法，其在低衬底温度下，特别是在常温下使用不损害透明性的处理方法制造透明导电薄膜，IO（氧化铟）或ITO（氧化铟锡）薄膜） 聚合物基材和聚合物基材的表面改性层的化学稳定性。 构成：在聚合物基材上沉积IO（氧化铟）或ITO（氧化铟锡）薄膜的方法包括通过在氧气或氩离子束的下面将氧或氩离子束照射到聚合物基底上来重整聚合物基材的表面的方法 真空和氧气氛中恒定加速能量; 以及在真空下将氧，氩或氧和氩的混合离子束照射到表面改性的聚合物基底上来沉积IO或ITO薄膜。 用于在聚合物基材上沉积IO（氧化铟）或ITO（氧化铟锡）薄膜的方法包括通过在真空下将氧或氩离子束照射到聚合物基底上来重整聚合物基材的表面的方法 恒定加速能量; 以及通过在真空下使用离子气体从冷的正极阴离子源产生离子束并将聚合物衬底溅射到由In 2 O 3或In 2 O 3和SnO 2组成的靶材上，在表面改性的聚合物衬底上沉积IO或ITO薄膜。

公开(公告)号：KR100336621B1

公开(公告)日：2002-05-16

申请号：KR1020000007024

申请日：2000-02-15

Applicant: 한국과학기술연구원

Inventor： 고석근 ,  백영환 ,  조준식 ,  한영건

IPC: C23C14/20

Abstract: 본 발명은 고분자 기판 위의 인듐산화물 또는 인듐주석산화물 박막 증착 방법에 관한 것으로, 진공하에서 고분자 기판에 산소 또는 아르곤 이온빔을 일정한 가속에너지로 조사하여 상기 고분자 기판의 표면을 개질시키고, 상기 표면 개질된 고분자 기판 위에 진공하에서 산소, 아르곤 또는 산소와 아르곤의 혼합 이온빔을 조사하면서 IO 또는 ITO 박막을 증착시키는 것으로 이루어지는 고분자 기판 위의 IO 또는 ITO 박막 증착 방법을 제공한다. 또한, 본 발명은 진공하에서 아르곤, 산소 또는 이의 혼합 기체를 사용하여 냉음극이온소스로부터 이온빔을 발생시키고 In
2 O
3 또는 In
2 O
3 및 SnO
2 로 이루어진 타겟물질에 스퍼터링시켜 상기 표면 개질된 고분자 기판 위에 IO 또는 ITO 박막을 증착시키는 것도 가능하다. 본 발명에 의하면 고분자 기판의 투명도나 고분자 기판의 표면 개질층의 화학적 안정성에 손상을 주지 않고, 낮은 기판 온도, 특히 상온에서 고분자 기판 위에 투명 전도성 박막인 IO 또는 ITO 박막을 제조하는 것이 가능하다. 이렇게 제조된 IO 또는 ITO 박막은 투명도, 전기적 특성 및 고분자 기판과의 접착력이 종래의 박막 제조방법에 비하여 매우 향상된다.

公开(公告)号：KR100391778B1

公开(公告)日：2003-07-22

申请号：KR1020010000571

申请日：2001-01-05

Applicant: 한국과학기술연구원

Inventor： 고석근 ,  한성 ,  조준식 ,  김기환

IPC: C23C16/54

Abstract: PURPOSE: A method is provided to improve adhesion force between polymer and metal layer or easily form the metal layer on the polymer having low plating property without a metal seed layer, and simplify treating processes when forming the metal layer on the polymer by electroless or electrolytic plating. CONSTITUTION: The method for improving adhesion force between polymer and metal comprises the processes of partially breaking polymer bonds on the surface of the polymer by irradiating ion beams having an energy onto the polymer as injecting a reactive gas into a vacuum chamber; injecting the reactive gas into the vacuum chamber so that atoms on the surface of the bond broken polymer are reacted with the reactive gas, thereby changing the property of the surface of the polymer into hydrophilic property; and depositing a metal layer on the surface of the polymer changed into the hydrophilic property, wherein an acceleration voltage of the ion beams is 300 to 2000 V, the ion is an ionization gas such as argon, nitrogen, hydrogen, helium, oxygen, ammonia, or a mixture thereof, the reactive gas is oxygen, nitrogen, ammonia, hydrogen, or a mixture thereof, and the deposition of the metal layer is done by an electroless or electrolytic plating.

Abstract translation: 目的：提供一种提高聚合物与金属层之间的粘合力或在没有金属籽晶层的情况下容易地在具有低电镀性能的聚合物上形成金属层的方法，并简化了通过无电解或电解质在聚合物上形成金属层时的处理过程 电镀。 构成：提高聚合物与金属之间的粘附力的方法包括通过向聚合物上照射具有能量的离子束以将反应气体注入真空室中来部分地破坏聚合物表面上的聚合物键的过程; 将反应气体注入真空室，使键合断裂聚合物表面上的原子与反应气体反应，从而将聚合物表面的性质改变为亲水性; 并且在聚合物表面上沉积金属层改变为亲水性，其中离子束的加速电压为300至2000V，离子为电离气体如氩，氮，氢，氦，氧，氨 或它们的混合物，反应气体是氧气，氮气，氨气，氢气或它们的混合物，金属层的沉积通过无电镀或电解镀完成。