公开(公告)号：KR100876646B1

公开(公告)日：2009-01-09

申请号：KR1020070041498

申请日：2007-04-27

Applicant: 한국과학기술원

Inventor： 유진 ,  장동민 ,  지영근

IPC: H01L21/60 ,  H05K3/30

CPC classification number: B23K1/0016 ,  B23K35/262 ,  B23K2201/40 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16503 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H05K3/244 ,  H05K3/3463 ,  H05K2203/072 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly.

公开(公告)号：KR1020080096264A

公开(公告)日：2008-10-30

申请号：KR1020070041498

申请日：2007-04-27

Applicant: 한국과학기술원

Inventor： 유진 ,  장동민 ,  지영근

IPC: H01L21/60 ,  H05K3/30

CPC classification number: B23K1/0016 ,  B23K35/262 ,  B23K2201/40 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16503 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H05K3/244 ,  H05K3/3463 ,  H05K2203/072 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A solder joint method of electronic components is provided to improve the reliability of electronic device by preventing the brittle fracture in solder joint and spall of metal compounds. A method for preventing the brittle fracture in a solder joint of electronic components includes the step of forming an electroless NiXP metal layer(14) in a metal wire of electronic component; the step of reflowing and joining the lead free solder on an electroless NiXP layer. The junction of the electronic component is used for a semiconductor chip and a package component, and the package component and a printed circuit board(22) or the semiconductor chip and the printed circuit board.

Abstract translation: 提供电子部件的焊接方法，以通过防止焊点中的脆性断裂和金属化合物的剥落来提高电子器件的可靠性。 防止电子部件的焊点的脆性断裂的方法包括在电子部件的金属线中形成无电镀NiXP金属层（14）的工序; 在无电NiXP层上回流焊接无铅焊料的步骤。 电子部件的接点用于半导体芯片和封装部件，以及封装部件和印刷电路板（22）或半导体芯片和印刷电路板。