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公开(公告)号：KR1020080096264A
公开(公告)日：2008-10-30
申请号：KR1020070041498
申请日：2007-04-27
Applicant: 한국과학기술원
CPC classification number: B23K1/0016 , B23K35/262 , B23K2201/40 , H01L2224/03464 , H01L2224/0401 , H01L2224/05155 , H01L2224/05644 , H01L2224/05664 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/16503 , H01L2924/01004 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H05K3/244 , H05K3/3463 , H05K2203/072 , H01L2924/00 , H01L2924/00014 , H01L2924/014
Abstract: A solder joint method of electronic components is provided to improve the reliability of electronic device by preventing the brittle fracture in solder joint and spall of metal compounds. A method for preventing the brittle fracture in a solder joint of electronic components includes the step of forming an electroless NiXP metal layer(14) in a metal wire of electronic component; the step of reflowing and joining the lead free solder on an electroless NiXP layer. The junction of the electronic component is used for a semiconductor chip and a package component, and the package component and a printed circuit board(22) or the semiconductor chip and the printed circuit board.
Abstract translation: 提供电子部件的焊接方法，以通过防止焊点中的脆性断裂和金属化合物的剥落来提高电子器件的可靠性。 防止电子部件的焊点的脆性断裂的方法包括在电子部件的金属线中形成无电镀NiXP金属层（14）的工序; 在无电NiXP层上回流焊接无铅焊料的步骤。 电子部件的接点用于半导体芯片和封装部件，以及封装部件和印刷电路板（22）或半导体芯片和印刷电路板。
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Patent Agency Ranking
公开(公告)号：KR1020080087350A
公开(公告)日：2008-10-01
申请号：KR1020070029440
申请日：2007-03-26
IPC: H01L23/28
CPC classification number: H01L23/3735 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/2919 , H01L2224/32225 , H01L2224/8385 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/3512
Abstract: An integrated circuit chip and a manufacturing method thereof are provided to minimize generation of cracks and to protect interconnection lines by preventing reduction of adhesive strength and reducing stress. An integrated circuit package includes an interface layer(210). The interface layer is inserted between an integrated circuit chip and an adhesive(203). The interface layer has a thermal expansion coefficient similar to the thermal expansion coefficient of the integrated circuit chip. The adhesive is an adhesive epoxy. The integrated circuit chip is composed of a silicon chip(204). A target is a printed circuit board. The thermal expansion coefficient of the interface layer is 3 to 55 ppm/°C.
Abstract translation: 提供一种集成电路芯片及其制造方法，以通过防止粘合强度的降低和应力降低来最小化裂纹产生和保护互连线。 集成电路封装包括界面层（210）。 界面层插入集成电路芯片和粘合剂（203）之间。 界面层的热膨胀系数与集成电路芯片的热膨胀系数相似。 粘合剂是粘合剂环氧树脂。 集成电路芯片由硅芯片（204）组成。 目标是印刷电路板。 界面层的热膨胀系数为3〜55ppm /℃。
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公开(公告)号：KR100902163B1
公开(公告)日：2009-06-10
申请号：KR1020070030556
申请日：2007-03-28
Applicant: 한국과학기술원
IPC: H01L23/48
CPC classification number: B23K1/0016 , B23K2201/34 , B23K2201/40 , B23K2203/18 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/05655 , H01L2224/13 , H01L2224/16503 , H01L2224/8181 , H01L2924/00014 , H05K3/244 , H05K3/3463 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 본 발명은 무연솔더와 니켈이나 구리의 금속층을 합금원소에 의하여 표면처리간의 계면반응 조절에 따른 취성파괴 방지에 관한 방법에 관한 것이다. 보다 상세하게는 니켈 혹은 구리로 처리된 전자부품의 접합시 무연솔더에 합금원소(M)를 첨가하여 무연솔더의 조성을 조절하거나 니켈 혹은 구리표면위에 합금원소(M) 중 한 가지 원소를 도금함으로써 솔더 접합부에서 생성되는 금속간화합물의 상(phase)을 변화시켜 취성파괴를 막을 수 있는 접합방법에 관한 것이다.
본 발명의 특징은 전자부품간의 접합에 있어서, 무전해 니켈 혹은 구리로 표면 처리된 부분에 적절한 함량의 합금원소는 Zn, Al, Be, Si, Ge, Mg로 구성되며 한 가지 이상을 가지는 무연솔더를 사용하거나 상기의 원소 중 하나를 니켈 혹은 구리 표면위에 도금함으로써 리플로우를 거쳤을 때 금속간 화합물의 생성을 억제하는 대신 새로운 금속간 화합물을 나타나게 함으로써 솔더와 표면처리간의 기계적 특성을 크게 증가시킬 수 있는 전자부품의 접합방법을 제공한다. 또한 본 발명은 전자부품과 전자부품을 솔더링 접합시 기존의 무연솔더에서 나타나는 금속간화합물의 변화를 유도하여 취성파괴를 방지함으로써 전자기기의 신뢰성을 보장할 수 있다.Abstract translation: 公开了一种连接电子封装部件的方法，包括以下步骤：在具有用铜或镍处理的表面的每个电子封装部件的顶部上回流含有合金元素的无铅焊料; 并将表面处理的电子部件安装在无铅焊料上，然后回流无铅焊料，以在无铅焊料和每个电子部件的表面处理部分之间产生金属间化合物。 或者，根据本发明的接合电子封装部件的方法包括以下步骤：在具有用铜或镍处理的表面的每个电子部件的顶部上形成由合金元件制成的镀层和回流无铅焊料 ; 并将表面处理的电子部件安装在无铅焊料上，然后回流无铅焊料，使包含在镀层中的合金元素扩散到无铅焊料中，并在无铅焊料与无铅焊料之间产生金属间化合物 每个电子部件的表面处理部分。 本发明可以通过在电子器件的电子封装部件焊接在一起时导致由现有的无铅焊料产生的金属间化合物的变化来防止电子封装部件的脆性断裂，从而确保电子器件的可靠性。
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公开(公告)号：KR100876646B1
公开(公告)日：2009-01-09
申请号：KR1020070041498
申请日：2007-04-27
Applicant: 한국과학기술원
CPC classification number: B23K1/0016 , B23K35/262 , B23K2201/40 , H01L2224/03464 , H01L2224/0401 , H01L2224/05155 , H01L2224/05644 , H01L2224/05664 , H01L2224/131 , H01L2224/13111 , H01L2224/16 , H01L2224/16503 , H01L2924/01004 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H05K3/244 , H05K3/3463 , H05K2203/072 , H01L2924/00 , H01L2924/00014 , H01L2924/014
Abstract: A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly.
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6.发明公开아연 입자를 함유하는 비전도성 폴리머 막, 비전도성 폴리머 페이스트, 이들을 포함하는 반도체 패키지, 및 반도체 패키지의 제조 방법 审中-实审包含锌颗粒的非导电膜，包含锌颗粒的非导电糊剂，包含锌颗粒的半导体封装及其制造方法
公开(公告)号：KR1020150042090A
公开(公告)日：2015-04-20
申请号：KR1020130120864
申请日：2013-10-10
IPC: H01L23/485
CPC classification number: C08K3/08 , C08K2003/0893 , C08K2201/011 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/91 , H01L25/0657 , H01L2224/0401 , H01L2224/0557 , H01L2224/05647 , H01L2224/05655 , H01L2224/1134 , H01L2224/13111 , H01L2224/16145 , H01L2224/16146 , H01L2224/16503 , H01L2224/17181 , H01L2224/2732 , H01L2224/27436 , H01L2224/2929 , H01L2224/29318 , H01L2224/32505 , H01L2224/33181 , H01L2224/48091 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/9211 , H01L2224/94 , H01L2224/97 , H01L2924/15311 , H01L2924/3651 , H01L2924/00014 , H01L2924/0665 , H01L2924/00012 , H01L2224/27 , H01L2224/11 , H01L2224/81 , H01L2224/83 , H01L2924/01047 , H01L2924/01029 , H01L2224/8211
Abstract: 본발명은비전도성폴리머막, 비전도성폴리머페이스트및 이들을포함하는반도체패키지에관한것이다. 본발명은막 형태의비전도성폴리머기재내에평균입경이약 1 nm 내지약 200 nm인아연(Zn) 입자를함유하는비전도성폴리머막 및이를포함하는반도체패키지를제공한다. 본발명의비전도성폴리머막 및비전도성폴리머페이스트를이용하면전기적접속특성이우수하고신뢰성이높은반도체패키지를간단한공정을통하여저렴하게제조할수 있는효과가있다.
Abstract translation: 本发明涉及非导电聚合物膜，非导电聚合物膏和包含该非导电聚合物的半导体封装。 本发明提供了一种非导电聚合物膜，其包含平均粒径为约1nm至200nm的Zn颗粒，在非导电聚合物基材中为薄膜型，其半导体封装包括该非导电聚合物膜。 如果使用根据本发明的非导电聚合物膜和非导电聚合物膏，则通过简单的工艺以低成本制造具有高电连接性和高可靠性的半导体封装。
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公开(公告)号：KR1020080088116A
公开(公告)日：2008-10-02
申请号：KR1020070030556
申请日：2007-03-28
Applicant: 한국과학기술원
IPC: H01L23/48
CPC classification number: B23K1/0016 , B23K2201/34 , B23K2201/40 , B23K2203/18 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/05655 , H01L2224/13 , H01L2224/16503 , H01L2224/8181 , H01L2924/00014 , H05K3/244 , H05K3/3463 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A method for joining lead-free solders and alloy elements of a metallic surface for prevention of a brittle fracture is provided to prevent causes of the brittle fracture by inducing a change of an intermetal compound. An alloy element joining method includes a process for joining electronic components with each other. One or more metal selected from alloy elements is added to lead-free solders of Cu or Ni surface-processed electronic components, or one of the alloy elements is plated on Cu or Ni surfaces of the electronic components, to generate an intermetal compound. The lead-free solders are selected from Sn-Ag, Sn-Cu, or Sn-Ag-Cu. The alloy elements are one or more elements selected from Zn, Al, Be, Si, Ge, and Mg.
Abstract translation: 提供一种用于接合无铅焊料和用于防止脆性断裂的金属表面的合金元素的方法，以通过引起金属间化合物的改变来防止脆性断裂的原因。 合金元件接合方法包括将电子部件彼此接合的工序。 将一种或多种选自合金元素的金属添加到Cu或Ni表面处理电子部件的无铅焊料中，或者将一种合金元素镀在电子部件的Cu或Ni表面上，以产生金属间化合物。 无铅焊料选自Sn-Ag，Sn-Cu或Sn-Ag-Cu。 合金元素是选自Zn，Al，Be，Si，Ge和Mg中的一种或多种元素。
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