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公开(公告)号：KR101541233B1
公开(公告)日：2015-08-03
申请号：KR1020140010980
申请日：2014-01-29
Applicant: 한국광기술원
CPC classification number: H01L33/44 , H01L33/502 , H01L33/62 , H01L2933/0025
Abstract: 발광디바이스제조장치가개시된다. 이는하나이상의발광칩과액상의광경화물질을수용가능한하나이상의욕조홈을구비하는몸체와, 몸체내에수용된칩에각각전류를인가하도록설치되는전원인가부를포함한다. 욕조홈에발광칩과액상의광경화물질을수용한상태에서전원인가부를통해발광칩에전원을인가하면해당발광칩으로부터발광된광에의해경화된광경화물질이발광칩을피복한다. 안착된발광칩에용이하고정확하게전원을인가하기위해하나이상의프로브를구비하는상부인가부와금속성지지구를구비하는하부인가부를포함한다.
Abstract translation: 公开了一种用于制造发光器件的设备。 其包括具有用于接收液化光硬化材料的至少一个浴槽和至少一个发光芯片的主体，以及将每个电流施加到接收在主体中的芯片的功率施加部。 当发光芯片和液化光硬化材料是在发光芯片和液化光硬化材料的条件下，当通过电力施加部件向发光芯片施加电力时，由从相应的发光芯片发出的光硬化的光硬化材料覆盖发光芯片 在浴槽里收到。 它包括具有金属支撑单元的下部施加部分和由至少一个探针组成的上部应用部分，以准确且容易地向发光芯片施加电力。
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Patent Agency Ranking
公开(公告)号：KR1020140120744A
公开(公告)日：2014-10-14
申请号：KR1020130036997
申请日：2013-04-04
Applicant: 한국광기술원
CPC classification number: H01L33/54 , H01L25/0753 , H01L33/58 , H01L2933/0033
Abstract: 측면 발광이 강조된 발광 디바이스가 개시된다. 이러한 발광 디바이스는 발광칩과, 발광칩의 발광면의 일부 또는 전부를 덮도록 배치되고 상면부위에 함몰부를 가지는, 광투과성의 광학구조물을 포함하고, 광학구조물은 발광칩으로부터 방출된 광에 의해 경화된 것이다. 이러한 발광 디바이스는 반사체를 발광칩의 상부에 배치하고 광경화물질을 발광칩의 발광면을 덮은 후에 발광칩으로부터 발광된 광을 이용하여 경화시킴으로써 얻어질 수 있다.
Abstract translation: 公开了能够强调侧面发光的发光装置。 发光器件包括发光芯片和具有透光性的光学结构，其被布置为部分地或全部地覆盖发光芯片的发光表面，并且在其上侧包括凹部。 光学结构由从发光芯片发出的光固化。 发光装置是通过在发光芯片的上侧布置反射器，用光固化材料覆盖发光芯片的发光表面，并使用从发光芯片发出的光来固化光固化材料而获得的。
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公开(公告)号：KR1020140105902A
公开(公告)日：2014-09-03
申请号：KR1020130019640
申请日：2013-02-25
Applicant: 한국광기술원
CPC classification number: H01L33/502 , H01L25/0753 , H01L33/58 , H01L2933/0091
Abstract: The present invention discloses a semiconductor light emitting device that has light color rendering properties and emits white light. The semiconductor light emitting device includes a submount element which has two or more mounting areas; and light emitting parts independently arranged on each mounting area. The submount element includes a light blocking structure, which is arranged between the mounting areas and prevents the light emitting part arranged on one mounting area from being directly exposed by light of another light emitting part.
Abstract translation: 本发明公开了一种具有浅色显影特性并发出白光的半导体发光器件。 半导体发光器件包括具有两个或更多个安装区域的基座元件; 以及独立地布置在每个安装区域上的发光部件。 副安装座元件包括遮光结构，其布置在安装区域之间，并且防止布置在一个安装区域上的发光部件被另一个发光部件的光直接曝光。
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公开(公告)号：KR101372068B1
公开(公告)日：2014-03-07
申请号：KR1020130019733
申请日：2013-02-25
Applicant: 한국광기술원
CPC classification number: G01J1/08 , G01J3/443 , G01J2001/083 , G01J2003/4435 , H01L31/035236
Abstract: Disclosed is a method for testing performance of an illumination apparatus using light emitting diodes as a light source. The method comprises the steps of: setting a target spectrum which is close to blackbody radiation light or daylight, or shows the distribution of a specific spectrum identical to the spectrum of a standard light source; drawing a comparison spectrum acquired by measuring manufactured illumination apparatus; commonizing two spectrums into conversion spectrums by using a commonization coefficient so that the units and scales of the two conversion spectrums are synchronized; integrating and comparing the two conversion spectrums with each other through a specific section; and calculating the comparison result to draw a synchronization rate and comparing the drawn result with a reference synchronization rate. [Reference numerals] (AA) Start; (BB) End; (S100) Set a target spectrum; (S110) Set a comparison spectrum; (S120) Perform communization; (S130) Draw a synchronization rate through the calculation of a difference value; (S140) Compare the synchronization rate with a reference synchronization rate
Abstract translation: 公开了一种使用发光二极管作为光源的照明装置的性能测试方法。 该方法包括以下步骤：设置接近黑体辐射光或日光的目标光谱，或显示与标准光源的光谱相同的特定光谱的分布; 绘制通过测量制造的照明装置获得的比较光谱; 通过使用公共系数将两个频谱公平化为转换频谱，使得两个转换频谱的单位和比例是同步的; 通过特定部分将两个转换谱相互整合和比较; 并计算比较结果以画出同步率并将绘图结果与参考同步率进行比较。 （附图标记）（AA）开始; （BB）结束; （S100）设定目标光谱; （S110）设定比较光谱; （S120）执行社会化; （S130）通过计算差值绘制同步速率; （S140）将同步速率与参考同步速率进行比较
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公开(公告)号：KR101290507B1
公开(公告)日：2013-07-26
申请号：KR1020120059543
申请日：2012-06-04
Applicant: 한국광기술원
CPC classification number: H01L33/56 , H01L33/502 , H01L2933/0033 , H01L2933/0041
Abstract: PURPOSE: A method for manufacturing a light emitting diode package including a magnetic phosphor and the light emitting diode package manufactured by the same are provided to improve the uniformity of color coordinates after the magnetic phosphor is moved in a molding unit in a desired direction. CONSTITUTION: A package body (110) mounting a light emitting diode chip is prepared. A molding unit (200) is formed by coating the light emitting diode chip with transmissive resins (250). A magnetic field is applied to a magnetic phosphor (210). The magnetic phosphor is moved in the molding unit in a desired direction. The transmissive resins are hardened.
Abstract translation: 目的：提供一种用于制造包括磁性荧光体的发光二极管封装的方法和由其制造的发光二极管封装，以在磁性荧光体沿着所需方向在成形单元中移动之后提高色坐标的均匀性。 构成：准备安装发光二极管芯片的封装体（110）。 通过用发射树脂（250）涂覆发光二极管芯片来形成模制单元（200）。 向磁性荧光体（210）施加磁场。 磁性荧光体在成型单元中沿所需方向移动。 透光树脂硬化。
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公开(公告)号：KR101466477B1
公开(公告)日：2014-12-02
申请号：KR1020130036997
申请日：2013-04-04
Applicant: 한국광기술원
Abstract: 측면발광이강조된발광디바이스가개시된다. 이러한발광디바이스는발광칩과, 발광칩의발광면의일부또는전부를덮도록배치되고상면부위에함몰부를가지는, 광투과성의광학구조물을포함하고, 광학구조물은발광칩으로부터방출된광에의해경화된것이다. 이러한발광디바이스는반사체를발광칩의상부에배치하고광경화물질을발광칩의발광면을덮은후에발광칩으로부터발광된광을이용하여경화시킴으로써얻어질수 있다.
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