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公开(公告)号：WO2013168831A1
公开(公告)日：2013-11-14
申请号：PCT/KR2012/003553
申请日：2012-05-07
CPC classification number: H05K1/0274 , G06F2203/04103 , H01L31/022466 , H05K3/0041 , H05K3/28 , H05K2201/015 , H05K2201/0326 , H05K2201/10977 , H05K2201/2054
Abstract: 투명전도성 기판 및 그 제조방법이 개시된다. 본 발명에 의하면, 빛의 투과가 가능한 베이스 기판; 투명전도성 물질의 증착에 의해 형성되는, 투명전도층; 및 반사방지층을 포함하되, 상기 반사방지층은, 건식 에칭 방법을 이용하여 형성되는, 복수의 돌기형 구조체 및 무기물 입자의 증착에 의해 형성되는 반사방지 구조체를 포함하는 것을 특징으로 하는 투명전도성 기판 및 그 제조 방법이 제공된다.
Abstract translation: 公开了一种透明导电基板及其制造方法。 提供一种透明导电基板及其制造方法，本发明的透明导电基板包括：允许光穿透的基底基板; 通过沉积透明导电物质形成的透明导电层; 和抗反射层，其中抗反射层包括通过干蚀刻方法形成的多个突出结构和通过沉积无机颗粒形成的抗反射结构。
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公开(公告)号：KR101205006B1
公开(公告)日：2012-11-27
申请号：KR1020120047098
申请日：2012-05-03
Applicant: 한국기계연구원
Abstract: PURPOSE: A transparent conductive substrate and a manufacturing method thereof are provided to improve transmittance by forming a conductive anti-reflection layer and an anti-reflection layer on the sides of a base substrate. CONSTITUTION: A base substrate(100) includes a reinforced coating layer. An anti-reflection structure(140) or a conductive anti-reflection structure(260) is laminated on the base substrate. An index matching coating layer improves the optical properties of the base substrate. A conductive anti-reflection layer(220) is formed on a first side of the base substrate. The conductive anti-reflection layer includes a plurality of protruded structures(230) and an anti-reflection transparent conductive layer(240).
Abstract translation: 目的：提供一种透明导电性基板及其制造方法，通过在基底侧面形成导电性防反射层和抗反射层来提高透射率。 构成：基底（100）包括增强涂层。 防反射结构（140）或导电抗反射结构（260）层叠在基底基板上。 折射率匹配涂层改善了基底的光学性能。 导电抗反射层（220）形成在基底基板的第一侧上。 导电抗反射层包括多个突出结构（230）和抗反射透明导电层（240）。
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公开(公告)号：KR101492240B1
公开(公告)日：2015-02-16
申请号：KR1020120152819
申请日：2012-12-26
Applicant: 한국기계연구원
Abstract: 본 발명에 의한 투명전도성기판은, 투명 폴리머 기판으로 이루어진 투명모재와; 상기 투명모재 일면에 PVD법(Physical Vapor Deposition ; 물리증착법)으로 투명하게 형성된 제1박막과, 상기 제1박막 일측에 PVD법(Physical Vapor Deposition ; 물리증착법)으로 형성되고 금속 및 금속산화물로 이루어진 제2박막과, 상기 제2박막 일측에 PVD법(Physical Vapor Deposition ; 물리증착법)으로 투명하게 형성된 제3박막으로 이루어진 전도성박막을 포함하여 구성됨을 특징으로 한다.
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公开(公告)号：KR101205005B1
公开(公告)日：2012-11-27
申请号：KR1020120047097
申请日：2012-05-03
Applicant: 한국기계연구원
Abstract: PURPOSE: A transparent conductive substrate and a manufacturing method thereof are provided to protect a base substrate by forming a protective layer on a second side of the polymer base substrate. CONSTITUTION: A transparent conductive substrate includes a base substrate(100), a conductive anti-reflection layer(220) and a protective layer(270). The conductive anti-reflection layer is formed on a first side of the base substrate. The conductive anti-reflection layer includes a plurality of protruded structures(230) and anti-reflection transparent conductive layers(240). The anti-reflection transparent conductive layer includes a continuous conductive layer(250) continuously formed on the protruded structure and a conductive anti-reflection structure(260).
Abstract translation: 目的：提供一种透明导电性基板及其制造方法，通过在聚合物基材的第二面上形成保护层来保护基材。 构成：透明导电基板包括基底（100），导电抗反射层（220）和保护层（270）。 导电性抗反射层形成在基底基板的第一面上。 导电抗反射层包括多个突出结构（230）和抗反射透明导电层（240）。 防反射透明导电层包括在突出结构上连续形成的连续导电层（250）和导电抗反射结构（260）。
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Patent Agency Ranking
公开(公告)号：KR1020140084392A
公开(公告)日：2014-07-07
申请号：KR1020120152819
申请日：2012-12-26
Applicant: 한국기계연구원
Abstract: A transparent conductive substrate according to the present invention includes a transparent base material which is made of a transparent polymer substrate; a first thin film which is transparent and is formed by performing physical vapor deposition (PVD) on one surface of the transparent base material; a second thin film which is made of metal and metal oxide and is formed by performing PVD on one surface of the first thin film; and a third thin film which is transparent and is formed by performing PVD on one surface of the second thin film.
Abstract translation: 根据本发明的透明导电性基材包括由透明聚合物基材制成的透明基材; 第一薄膜，其是透明的并且通过在透明基材的一个表面上进行物理气相沉积（PVD）而形成; 由金属和金属氧化物制成并通过在第一薄膜的一个表面上进行PVD而形成的第二薄膜; 以及透明的第三薄膜，并且通过在第二薄膜的一个表面上进行PVD而形成。
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公开(公告)号：KR101297432B1
公开(公告)日：2013-08-19
申请号：KR1020110146648
申请日：2011-12-30
Applicant: 한국기계연구원
Abstract: 본 발명에 의한 내굴곡성박막과 투명전도성박막이 구비된 투명유연기판은, 폴리머로 이루어지며 이온빔에 의해 표면이 전처리된 투명모재와, 상기 투명모재에 스퍼터링법을 이용하여 ITO, IZO, AZO, GZO 중 어느 하나로 이루어져 증착된 투명전도성박막과, 상기 투명전도성박막 외측에 형성된 내굴곡성박막을 포함하여 구성됨을 특징으로 한다. 본 발명에 의한 내굴곡성박막과 투명전도성박막이 구비된 투명유연기판의 제조 방법은, 폴리머로 이루어진 투명모재의 표면을 이온빔으로 전처리하는 전처리단계와, 상기 투명모재의 외면에 스퍼터링법을 이용하여 ITO, IZO, AZO, GZO 중 어느 하나로 이루어진 투명전도성박막을 형성하는 투명전도성박막형성단계와, 상기 투명전도성박막 외면에 Ag 나노 와이어가 포함된 전도성 페이스트, 전도성 잉크, 전도성 고분자 중 어느 하나 이상으로 형성된 내굴곡성박막을 형성하는 내굴곡성박막형성단계로 이루어지는 것을 특징으로 한다.
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公开(公告)号：KR101398967B1
公开(公告)日：2014-05-27
申请号：KR1020120150733
申请日：2012-12-21
Applicant: 한국기계연구원
CPC classification number: C23C16/513 , C23C16/401
Abstract: The present invention relates to a silicon compound thin film-based flexible protection film having a functional layer interposed between silicon compound thin films and a manufacturing method thereof for not only having an excellent gas barrier function which is necessary for a flexible display but also satisfying the aspect of a mass production. The silicon compound thin film-based flexible protection film having a functional layer interposed between silicon compound thin films according to the present invention includes: a first silicon compound thin film which is formed through a plasma-enhanced chemical vapor deposition (PECVD) on a substrate; a first functional layer which is formed on the first silicon compound thin film; a second silicon compound thin film which is formed through the PECVD on the first functional layer; a second functional layer which is formed on the second silicon compound thin film; and a third silicon compound thin film which is formed through the PECVD on the second functional layer. The first silicon compound thin film, the second silicon compound thin film, and the third silicon compound thin film are formed with any one which is selected from SiOx, SiOxNy, and SiCxHyOz while at least one of the compound thin films is formed with a silicon inorganic compound thin film. The first functional layer is formed to include an alkali metal or an alkali earth metal and the second functional layer is formed to include a parylene compound, wherein at least one part is formed in a structure for filling an opening gap between particles of the second silicon compound thin film.
Abstract translation: 本发明涉及一种硅化合物薄膜基柔性保护膜，其具有介于硅化合物薄膜之间的功能层及其制造方法，其不仅具有优异的气体屏障功能，这对于柔性显示器是必需的，而且还满足 方面大量生产。 具有介于本发明的硅化合物薄膜之间的功能层的硅化合物薄膜基柔性保护膜包括：通过基板上的等离子体增强化学气相沉积（PECVD）形成的第一硅化合物薄膜 ; 形成在第一硅化合物薄膜上的第一功能层; 通过第一功能层上的PECVD形成的第二硅化合物薄膜; 形成在第二硅化合物薄膜上的第二功能层; 以及通过第二功能层上的PECVD形成的第三硅化合物薄膜。 第一硅化合物薄膜，第二硅化合物薄膜和第三硅化合物薄膜由选自SiOx，SiOxNy和SiCxHyOz中的任一种形成，而至少一种化合物薄膜由硅形成 无机化合物薄膜。 第一功能层形成为包括碱金属或碱土金属，第二功能层形成为包括对二甲苯化合物，其中至少一部分形成为用于填充第二硅颗粒之间的开口间隙的结构 复合薄膜。
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公开(公告)号：KR1020130077963A
公开(公告)日：2013-07-10
申请号：KR1020110146648
申请日：2011-12-30
Applicant: 한국기계연구원
Abstract: PURPOSE: Transparent flexible board and manufacturing method thereof having a flexure resistance thin film and a transparent conductive thin film are provided to improve conductivity and flexure resistance by forming an oxide transparent conductive thin film and a flexure resistant thin film with a bending property through a physical vapor deposition method. CONSTITUTION: A transparent flexible board (100) includes a transparent base material (120) made with polymer, a transparent conductive thin film (140) formed on the top of the base material and providing electric conductivity and a flexure resistant thin film (160) formed on the outer surface of the transparent flexible board. The transparent base material, transparent conductive thin film and flexure resistance thin film are transparently formed.
Abstract translation: 目的：提供具有抗挠曲薄膜和透明导电薄膜的透明柔性板及其制造方法，以通过形成具有弯曲性的氧化物透明导电薄膜和抗挠曲薄膜通过物理 气相沉积法。 构成：透明柔性板（100）包括由聚合物制成的透明基材（120），形成在基材顶部上并提供导电性和抗弯曲薄膜（160）的透明导电薄膜（140） 形成在透明柔性板的外表面上。 透明基材，透明导电薄膜和耐弯曲薄膜透明地形成。
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公开(公告)号：KR101205004B1
公开(公告)日：2012-11-27
申请号：KR1020120047093
申请日：2012-05-03
Applicant: 한국기계연구원
Abstract: PURPOSE: A transparent conductive substrate and a manufacturing method thereof are provided to prevent the fingerprint of a user by forming a fingerprint prevention layer. CONSTITUTION: A transparent conductive layer(110) is formed by depositing transparent conductive materials on a first side of a base substrate(100). An anti-reflection layer(120) is formed on a second side of the base substrate. The anti-reflection layer includes a plurality of protruded structures(130) and anti-reflection structures(140). The distance between the protruded structures is controlled by plasma power or etching exposure time. A fingerprint prevention layer(160) has a water repellence function.
Abstract translation: 目的：提供透明导电基板及其制造方法，以通过形成指纹防止层来防止使用者的指纹。 构成：通过在基底（100）的第一侧上沉积透明导电材料来形成透明导电层（110）。 在基底基板的第二面上形成防反射层（120）。 防反射层包括多个突出结构（130）和防反射结构（140）。 突出结构之间的距离由等离子体功率或蚀刻曝光时间控制。 指纹防止层（160）具有防水功能。
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