公开(公告)号：KR1020130066929A

公开(公告)日：2013-06-21

申请号：KR1020110133703

申请日：2011-12-13

Applicant: 한국전자통신연구원

Inventor： 엄용성 ,  최광성 ,  배현철 ,  노정현 ,  문종태

IPC: H01B1/22 ,  G03F7/032

CPC classification number: H05K3/1216 ,  C25D5/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K1/095 ,  H05K3/102 ,  H05K3/188 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0302 ,  H05K2203/0425

Abstract: PURPOSE: A pattern forming composition and a method thereof are provided to form an circuit pattern with excellent conductivity by low cost. CONSTITUTION: A pattern forming composition comprises a copper powder(10); a binder(11) electrically binding the copper particle; a polymer resin; a hardener; and a reducing agent. The particle diameter of the copper particle is 2-10 micron. The binder is two or more selected from Sn, Bi, In, Ag, Pb, and Cu. A pattern forming method includes a step of forming the pattern forming composition, and a step of forming a circuit pattern by printing the pattern forming composition on a substrate.

Abstract translation: 目的：提供图案形成组合物及其方法，以低成本形成具有优异导电性的电路图案。 构成：图案形成组合物包含铜粉（10）; 电结合铜颗粒的粘结剂（11）; 聚合物树脂; 硬化剂 和还原剂。 铜颗粒的粒径为2-10微米。 粘合剂是选自Sn，Bi，In，Ag，Pb和Cu中的两种以上。 图案形成方法包括形成图案形成组合物的步骤，以及通过将图案形成组合物印刷在基底上形成电路图案的步骤。

公开(公告)号：KR101940237B1

公开(公告)日：2019-01-18

申请号：KR1020120063792

申请日：2012-06-14

Applicant: 한국전자통신연구원

Inventor： 엄용성 ,  최광성 ,  노정현

IPC: H01L21/60

公开(公告)号：KR1020130140407A

公开(公告)日：2013-12-24

申请号：KR1020120063792

申请日：2012-06-14

Applicant: 한국전자통신연구원

Inventor： 엄용성 ,  최광성 ,  노정현

IPC: H01L21/60

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/11442 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/13601 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/81024 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/83192 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01029

Abstract: The present invention relates to a method for forming a solder bump on a fine pitch PCB substrate and a flip chip bonding method of a semiconductor device using same and comprises; a steps of spreading a solder bump maker (SBM) paste having regular thickness on the front side of the PCB substrate including a metal pad and a solder mask; a step of forming the solder bump by heating the SBM paste with the temperature higher than a melting point of a solder included in the SBM paste and cooling the SBM paste; and a step of washing a remaining polymer resin of the SBM paste and a remaining solder particle using a solvent.

Abstract translation: 本发明涉及一种用于在精细间距PCB基板上形成焊料凸块的方法和使用其的半导体器件的倒装芯片接合方法， 在包括金属焊盘和焊接掩模的PCB基板的正面上扩展具有规则厚度的焊料凸块制造商（SBM）浆料的步骤; 通过加热SBM糊料形成焊料凸块的步骤，该SBM糊料的温度高于包含在SBM浆料中的焊料的熔点，并冷却SBM糊料; 以及使用溶剂洗涤SBM糊料的剩余聚合物树脂和剩余的焊料颗粒的步骤。