질화물 반도체 기판의 제조 방법
    1.
    发明授权
    질화물 반도체 기판의 제조 방법 有权
    질화물반도체기판의제조방법

    公开(公告)号:KR100461505B1

    公开(公告)日:2004-12-14

    申请号:KR1020020011404

    申请日:2002-03-04

    Abstract: PURPOSE: A method for manufacturing a nitride semiconductor substrate is provided to be capable of reducing manufacturing costs and increasing the area. CONSTITUTION: A buffer layer(11) made of an aluminum nitride(AlN) film is formed on a silicon substrate(10) for buffering lattice mismatch by using MBE(Molecular Bean Epitaxy). An oxide layer(11a) is formed on the buffer layer(11) by performing thermal oxidation processing. A nitride layer(12) is formed on the oxide layer(11a). Then, the silicon substrate(10) is removed.

    Abstract translation: 目的:提供一种用于制造氮化物半导体衬底的方法,以能够降低制造成本和增加面积。 构成:在硅衬底(10)上形成由氮化铝(AlN)膜制成的缓冲层(11),以通过使用MBE(分子束外延)缓冲晶格失配。 通过执行热氧化处理在缓冲层(11)上形成氧化物层(11a)。 在氧化物层(11a)上形成氮化物层(12)。 然后,去除硅衬底(10)。

    질화물 반도체 기판의 제조 방법
    2.
    发明公开
    질화물 반도체 기판의 제조 방법 有权
    制备氮化物半导体衬底的方法

    公开(公告)号:KR1020030072528A

    公开(公告)日:2003-09-15

    申请号:KR1020020011404

    申请日:2002-03-04

    Abstract: PURPOSE: A method for manufacturing a nitride semiconductor substrate is provided to be capable of reducing manufacturing costs and increasing the area. CONSTITUTION: A buffer layer(11) made of an aluminum nitride(AlN) film is formed on a silicon substrate(10) for buffering lattice mismatch by using MBE(Molecular Bean Epitaxy). An oxide layer(11a) is formed on the buffer layer(11) by performing thermal oxidation processing. A nitride layer(12) is formed on the oxide layer(11a). Then, the silicon substrate(10) is removed.

    Abstract translation: 目的:提供一种制造氮化物半导体衬底的方法,以能够降低制造成本并增加面积。 构成:通过使用MBE(Molecular Bean Epitaxy)在硅衬底(10)上形成由氮化铝(AlN)膜制成的缓冲层(11),用于缓冲晶格失配。 通过进行热氧化处理,在缓冲层(11)上形成氧化物层(11a)。 在氧化物层(11a)上形成氮化物层(12)。 然后,去除硅衬底(10)。

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