公开(公告)号：KR1020090109969A

公开(公告)日：2009-10-21

申请号：KR1020080035488

申请日：2008-04-17

Applicant: 한국전자통신연구원

Inventor： 문종태 ,  엄용성 ,  이민지 ,  유현규

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L23/10 ,  B81B7/007 ,  B81C2203/0118 ,  H01L24/45 ,  H01L24/48 ,  H01L24/94 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2224/05599

Abstract: PURPOSE: A wafer level package and method for manufacturing the same are provided to form the telecommunication line of the package internal unit without the separate via process of passing through a substrate. CONSTITUTION: The wafer level package includes the first substrate(220), the input-output pad(222), the second substrate(210), and the solder. The first substrate includes the common duct in which the first internal units are positioned. The input-output pad is formed in the first top of the substrates. The input-output pad is electrically connected to the first internal units. The second substrate is positioned on the first substrate. The second substrate corresponds to the input-output pad is removed. The solder joins the first substrate and the second substrate.

Abstract translation: 目的：提供晶片级封装及其制造方法，以形成封装内部单元的电信线路，而不需要通过基板的单独的通孔工艺。 构成：晶片级封装包括第一衬底（220），输入 - 输出焊盘（222），第二衬底（210）和焊料。 第一基板包括第一内部单元所在的公共管道。 输入 - 输出焊盘形成在基板的第一顶部。 输入 - 输出焊盘电连接到第一内部单元。 第二基板位于第一基板上。 第二个衬底对应于输入 - 输出垫被去除。 焊料与第一基板和第二基板接合。