公开(公告)号：KR1020100007690A

公开(公告)日：2010-01-22

申请号：KR1020090011106

申请日：2009-02-11

Applicant: 한국전자통신연구원

Inventor： 엄용성 ,  문종태 ,  오상원 ,  장건수

IPC: C09J9/02 ,  C09J5/00

CPC classification number: C09J11/06 ,  C08K3/04 ,  C08K3/08 ,  C09J9/02 ,  C09J11/00 ,  C09J11/04 ,  C09J201/00 ,  H05K3/34

Abstract: PURPOSE: An anisotropic conductive adhesive composition is provided to improve the wettability of the surface of conductive pattern, to impart excellent electrical characteristic to an electronic device, and to easily restore a damaged contact unit. CONSTITUTION: An anisotropic conductive adhesive composition comprises a low melting solder(136), a thermosetting polymer resin, and a curing agent of an anhydride-based material. The thermosetting polymer resin comprises a hydroxyl group and the low melting solder actuates as a curing catalyst. The composition further comprises a deforming agent for reducing the surface tension of the thermosetting polymer resin.

Abstract translation: 目的：提供各向异性导电粘合剂组合物以改善导电图案的表面的润湿性，从而赋予电子设备优异的电特性，并且容易地恢复损坏的接触单元。 构成：各向异性导电粘合剂组合物包含低熔点焊料（136），热固性聚合物树脂和基于酸酐的材料的固化剂。 热固性聚合物树脂包含羟基，低熔点焊料作为固化催化剂起作用。 组合物还包含用于降低热固性聚合物树脂的表面张力的变形剂。

公开(公告)号：KR101175682B1

公开(公告)日：2012-08-22

申请号：KR1020090011106

申请日：2009-02-11

Applicant: 한국전자통신연구원

Inventor： 엄용성 ,  문종태 ,  오상원 ,  장건수

IPC: C09J9/02 ,  C09J5/00

Abstract: 이방성도전접착제용조성물, 및이를이용한솔더범프형성방법및 플립칩형성방법이제공된다. 상기조성물은저융점솔더입자및 열경화성고분자수지를포함한다. 상기이방성도전접착제는고분자수지및 경화제를혼합하여혼합물을형성하는단계와상기혼합물에변형제, 촉매또는환원제를혼합하는단계를포함한다.