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    반도체 소자 봉지용 자기소화성 에폭시 수지 조성물
    3.
    发明授权
    반도체 소자 봉지용 자기소화성 에폭시 수지 조성물 有权
    用于封装半导体器件的环氧树脂组合物

    公开(公告)号：KR101195873B1

    公开(公告)日：2012-10-30

    申请号：KR1020100117702

    申请日：2010-11-24

    Applicant: 한국화학연구원 ,  금호피앤비화학 주식회사

    Inventor： 김영철 ,  김경만 ,  차옥자 ,  정영호 ,  김종생 ,  김도훈 ,  김미숙

    IPC: C08L63/00 ,  C08L61/06 ,  C08G59/18 ,  C08K3/36

    Abstract: 본 발명은 성형성이 우수하고, 자기소화성을 나타내는 반도체 소자 봉지용 에폭시 수지 조성물에 관한 것으로서, 보다 구체적으로는 하기 화학식 1의 에폭시 수지, 경화제 및 무기충전제를 포함하여 이루어지는 에폭시 수지 조성물에 관한 것으로서, 본 발명에 따른 반도체 소자 봉지용 에폭시 수지 조성물은 환경에 유해한 물질로 알려진 할로겐계 유기 난연제 및 삼산화안티몬 등과 같은 무기 난연제를 사용하지 않고서도 우수한 자기소화성을 나타내며, 난연성 및 내열성이 우수한 특성을 나타낸다.
    [화학식 1]

    상기 화학식 1에서, R 은 각각 독립적으로 수소, C
    1
    내지 C
    12 의 알킬이며; n은 0 내지 10의 정수이다.

    반도체 소자 봉지용 자기소화성 에폭시 수지 조성물
    4.
    发明公开
    반도체 소자 봉지용 자기소화성 에폭시 수지 조성물 有权
    用于封装半导体器件的环氧树脂组合物

    公开(公告)号：KR1020120056135A

    公开(公告)日：2012-06-01

    申请号：KR1020100117702

    申请日：2010-11-24

    Applicant: 한국화학연구원 ,  금호피앤비화학 주식회사

    Inventor： 김영철 ,  김경만 ,  차옥자 ,  정영호 ,  김종생 ,  김도훈 ,  김미숙

    IPC: C08L63/00 ,  C08L61/06 ,  C08G59/18 ,  C08K3/36

    Abstract: PURPOSE: An epoxy resin composition is provided to have excellent moldability, flame retardance, and heat resistance, thereby having excellent self-extinguishability without using halogen based organic flame retardants which are harmful for the environment, or inorganic flame retardants like antimony trioxide, etc. CONSTITUTION: An epoxy resin composition comprises an epoxy resin, a hardener, and inorganic filler. The epoxy resin is a 4,4"-dihydroxy-5"-phenyl-meta-terphenyl type epoxy resin, or a mixture of one or more epoxy resin selected from a group consisting of the materials in chemical formula 2 and chemical formula 3, which are mixed with the 4,4"-dihydroxy-5"-phenyl-meta-terphenyl type epoxy resin. A hardener is a phenol resin as shown in chemical formula 4, the non-phenyl type phenol resin of chemical formula 5, or a mixture thereof.

    Abstract translation: 目的：提供环氧树脂组合物以具有优异的成型性，阻燃性和耐热性，从而在不使用对环境有害的卤素类有机阻燃剂的情况下，或者无机阻燃剂如三氧化锑等，具有优异的自熄性。 构成：环氧树脂组合物包含环氧树脂，硬化剂和无机填料。 环氧树脂是4,4“ - 二羟基-5” - 苯基 - 间三联苯型环氧树脂，或选自化学式2中的一种或多种环氧树脂和化学式3的混合物， 它们与4,4“ - 二羟基-5” - 间 - 三联苯型环氧树脂混合。 固化剂是化学式4所示的酚醛树脂，化学式5的非苯基型酚醛树脂或其混合物。

    신규의치환된이미다졸유도체및그의제조방법
    5.
    发明授权
    신규의치환된이미다졸유도체및그의제조방법 失效
    新的取代的咪唑衍生物及其制备方法

    公开(公告)号：KR100303944B1

    公开(公告)日：2001-11-22

    申请号：KR1019930026610

    申请日：1993-12-06

    Applicant: 한국화학연구원

    Inventor： 유성은 ,  이규양 ,  이상희 ,  김혜령 ,  서지희 ,  김낙정 ,  김선주 ,  차옥자 ,  신영아 ,  신화섭 ,  이승호 ,  정이숙 ,  이병호 ,  서호원

    IPC: C07D403/10

    Abstract: PURPOSE: Provided are novel substituted imidazole derivatives, represented by the formula(1) and their pharmaceutically acceptable salts, a pharmaceutical composition containing them and their preparation method. The compounds are used in inhibiting the high blood pressure by inhibiting the action of Angiotensin II. CONSTITUTION: The imidazole derivatives are represented by the formula(1), wherein A and B are independently -CH2 or -CO- but not -CO- simultaneously; Z is halogen atom or trifluorophenyl, C1-C14 alkenyl group; R is X substituted phenyl or thiophenyl, furanyl and imidazoyl(where x is -(CH2)n-X' and n is an integer of 0-4), and X' is hydrogen, -N-(C1-C4 alkyl)2, C1-C4 alkyl N substituted or unsubstituted piperazine, 3-or 2-oxopiperazine, morpholine, piperidine, thiomorpholine or imidazole. The typical method of synthesis comprises the steps of: manufacturing 5-(4-((thiomorpholine-4-yl)methyl)-2-butyl-4-chloro-1-((2'-(1H- tetrazole-5-yl)bipheyl-4-yl)methyl)imidazole by dissolving 4-chlorobenzoic acid into benzene and adding thionylchloride, refluxing, concentrating and dissolving again in methylene chloride; adding this product to the methylene chloride solution of 2-butyl-4-chloro-5-(hydroxymethyl)-1-((2'-((1-ethoxyethyl)-1H-tetrazole-5-yl)biphenyl-4 -yl)methyl)imidazole and triethylamine; dissolving this compound in tetrahydrofuran(THF) and adding thiomorpholine and refluxing with heating for 20 hours and extracting with ethylacetate; and dissolving this compound in THF, adding 1N HCl, stirring at room temperature for 17 hours, neutralizing with 1N NaOH and extracting with ethyl acetate.

    패키지수지의 휨 발생 평가를 위한 시험편 제조용 금형 및 시험편 제조방법
    7.
    发明授权
    패키지수지의 휨 발생 평가를 위한 시험편 제조용 금형 및 시험편 제조방법 失效
    패키지수지의휨발생가가를위한시험편제조용금형및시험편제조방패키

    公开(公告)号：KR100732208B1

    公开(公告)日：2007-06-27

    申请号：KR1020060009772

    申请日：2006-02-01

    Applicant: 한국화학연구원 ,  주식회사 네패스신소재

    Inventor： 김영철 ,  차옥자 ,  이정흠 ,  조희재 ,  박지승

    IPC: H01L21/56

    Abstract: A mold for manufacturing a test piece for a warpage measurement of a package resin and a manufacturing method thereof are provided to control the generation of warpage by improving flow and modulus of the package resin. A lower block(21) has an internal space. An upper plate(10) has an injection hole(11) for injecting a resin. The upper plate closes an upper portion of the lower block and is assembled. A middle block(12) has a runner(13) through the injection hole. The middle block is arranged in the internal space of the lower block to form a cavity. A support block(15) is arranged on a lower portion of the middle block in the internal space of the lower block and varies cavity capacity. A driving unit is arranged in the internal space of the lower block and raises or drops the support block.

    Abstract translation: 提供一种用于制造用于封装树脂的翘曲测量的测试片的模具及其制造方法，以通过改进封装树脂的流动和模量来控制翘曲的产生。 下块（21）具有内部空间。 上板（10）具有用于注入树脂的注入孔（11）。 上部板关闭下部块的上部并被组装。 中间块（12）具有穿过注入孔的流道（13）。 中块设置在下块的内部空间中以形成空腔。 支撑块（15）布置在下部块的内部空间中的中间块的下部并且改变空腔容量。 驱动单元布置在下部块的内部空间中并且升高或降低支撑块。

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