점착 방지막을 지니는 스탬프의 구조 및 제조방법과 이에의한 나노패턴 전사방법
    1.
    发明授权
    점착 방지막을 지니는 스탬프의 구조 및 제조방법과 이에의한 나노패턴 전사방법 有权
    防粘混合掩模的结构与制造方法及其纳米方法

    公开(公告)号:KR100665038B1

    公开(公告)日:2007-01-04

    申请号:KR1020050061325

    申请日:2005-07-07

    Abstract: A structure of a stamp having an adhesion preventing layer, a manufacturing method thereof, and a nano pattern imprinting method using the same are provided to prevent an adhesion of a partial imprinting layer to a stamp by forming the adhesion preventing layer on a surface of the stamp. A nano-sized pattern is formed on a transparent substrate(11). An opaque metal layer(13) is formed corresponding to a partial surface of the transparent substrate. A first thin film layer(14) is formed on the surface of the opaque metal layer to reduce at least one of surface energy and friction coefficient. A second thin film layer(15) is formed on the first thin film layer to increase hydrophobicity. A buffer layer is formed between the opaque metal layer and the first thin film to increase adhesive strength.

    Abstract translation: 提供具有防粘附层的印模的结构,其制造方法和使用其的纳米图案压印方法,以防止部分印刷层与印模的粘合, 邮票。 在透明基板(11)上形成纳米尺寸图案。 对应于透明基板的部分表面形成不透明金属层(13)。 在不透明金属层的表面上形成第一薄膜层(14)以减少表面能和摩擦系数中的至少一个。 在第一薄膜层上形成第二薄膜层(15)以增加疏水性。 在不透明金属层和第一薄膜之间形成缓冲层以提高粘合强度。

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