PAD CONDITIONER WITH SPACER AND WAFER PLANARIZATION SYSTEM

    公开(公告)号:WO2018116122A1

    公开(公告)日:2018-06-28

    申请号:PCT/IB2017/058053

    申请日:2017-12-18

    Abstract: A pad conditioner includes a carrier, at least one abrasive element, and a spacer. The carrier includes a surface with an exposed region and a plurality of mounting regions. The abrasive element is disposed on the mounting region of the carrier, and at least one abrasive element has a working surface including a plurality of features each having a distal end. The spacer is disposed on the surface of the carrier and covers at least a portion of the exposed region. The spacer has a first surface and a second surface, wherein the second surface is opposed to the first surface and adjacent to the surface of the carrier. The distance D1 between the distal end of the highest feature of the at least one abrasive element and the surface of the carrier is greater than the distance D2 between the first surface of the spacer and the surface of the carrier.

Patent Agency Ranking