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公开(公告)号:EP3321959A1
公开(公告)日:2018-05-16
申请号:EP16198098.2
申请日:2016-11-10
Applicant: ABB Schweiz AG
Inventor: Hartmann, Samuel
IPC: H01L23/48 , H01L23/538 , H02B1/20 , H05K1/02 , H01L23/64
CPC classification number: H05K1/0228 , H01L23/48 , H01L23/49811 , H01L23/49844 , H01L23/5384 , H01L23/5386 , H01L23/645 , H05K1/0265 , H05K2201/09245 , H05K2201/09618 , H05K2201/09663 , H05K2201/09672 , H05K2201/097 , H05K2201/0979
Abstract: The present invention relates to a power semiconductor module, comprising an electronic circuit having a printed circuit board (10) with a substrate (12), the substrate (12) comprising a first side (36) and a second side (38), the second side (38) being arranged opposite to the first side (36) and being arranged parallel to the first side (36), wherein a first conductor (14) being designed as a gate conductor and a second conductor (16) being designed as an auxiliary emitter conductor are positioned on the printed circuit board (10), wherein the first conductor (14) proceeds partly on the first side (36) and partly on the second side (38) and that the second conductor (16) proceeds partly on the first side (36) and partly on the second side (38), such, that the first conductor (14) and the second conductor (16) are at least partly arranged opposite to each other and that the first conductor (14) proceeds on the first side (36) in a rage of ≥ 10% to ≤ 90% of its total extension on the first side (36) and the second side (38) and that the second conductor (16) proceeds on the first side (36) in a range of ≥10% to ≤ 90% of its total extension on the first side (36) and the second side (38).
Abstract translation: 本发明涉及一种功率半导体模块,其包括具有带基板(12)的印刷电路板(10)的电子电路,所述基板(12)包括第一侧面(36)和第二侧面(38),所述 所述第二侧(38)与所述第一侧(36)相对布置并且平行于所述第一侧(36)布置,其中被设计为栅极导体的第一导体(14)和被设计为第二导体 辅助发射极导体位于印刷电路板(10)上,其中第一导体(14)部分地在第一侧(36)上并且部分地在第二侧(38)上行进,并且第二导体(16)部分地进行 在第一侧(36)和部分在第二侧(38)上,使得第一导体(14)和第二导体(16)至少部分地彼此相对布置,并且第一导体(14) 在第一侧(36)以≥10%的总风险延伸率的≤90%在t上进行 第一侧(36)和第二侧(38),并且第二导体(16)在第一侧(36)上在其第一侧(36)上的总延伸的≥10%至≤90% )和第二侧(38)。
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公开(公告)号:EP2962799B8
公开(公告)日:2016-10-12
申请号:EP14175716.1
申请日:2014-07-04
Applicant: ABB Schweiz AG
Inventor: Hartmann, Samuel , Guillon, David , Hajas, David , Thut, Markus
CPC classification number: H05K5/0034 , B23K20/10 , H01L21/4853 , H01L23/047 , H01L23/3735 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/49097 , H01L2224/49111 , H01L2224/73265 , H01L2924/00014 , H01R43/0207 , H01R43/205 , H05K1/111 , H05K1/181 , H05K3/301 , H05K2203/0285 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号:EP2660863B1
公开(公告)日:2019-07-10
申请号:EP13161711.0
申请日:2013-03-28
Applicant: ABB Schweiz AG
Inventor: Hartmann, Samuel , Trüssel, Dominik
IPC: H01L25/07 , H02M7/00 , H01L23/538 , H01L25/18
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