THOMSON COIL DRIVEN SWITCH ASSEMBLY WITH LIGHTWIGHT PLUNGER

    公开(公告)号:EP3567621A1

    公开(公告)日:2019-11-13

    申请号:EP19167882.0

    申请日:2019-04-08

    Applicant: ABB Schweiz AG

    Abstract: An electrical switch assembly (10) comprises a contact element (14, 18) to be moved towards a further contact element (14, 18) for generating an electrical connection; and a drive (16) for moving the contact element (14, 18); wherein the drive (16) comprises a plunger (26) with a connection member (30) interconnected with the contact element (14); wherein the plunger (26) comprises a mechanical structure (34) with a top side (36) to which the connection member (30) is connected, and a bottom side (38) opposite to the top side (36); wherein the drive (16) comprises a Thomson coil (52) for moving the plunger (26) via an electrically conducting top face (48), which is provided on the top side (36) and an electrically conducting bottom face (50), which is provided on the bottom side (38). The mechanical structure (34) comprises at least one channel between the top side (36) and the bottom side (38), the at least one channel extending transverse to a movement direction (D) of the plunger (26). Furthermore, the mechanical structure (34) fills less than 50% of a volume between the top side (36) and the bottom side (38).

    TWO-PHASE HEAT TRANSFER DEVICE FOR HEAT DISSIPATION

    公开(公告)号:EP3816559A1

    公开(公告)日:2021-05-05

    申请号:EP19206017.6

    申请日:2019-10-29

    Applicant: ABB Schweiz AG

    Abstract: The invention relates to a two-phase heat transfer device (10) for dissipating heat from a heat source, for instance a power semiconductor module (26), by a heat transfer medium, wherein the two-phase heat transfer device (10) comprises a main body (12), wherein the main body (12) is formed by a body material (14) and comprises a multi-dimensional void network (16), wherein the multi-dimensional void network (16) comprises voids and is adapted for containing the heat transfer medium, wherein the multi-dimensional void network (16) is adapted such that a flow of the heat transfer medium along a path (20) through the main body (12) is based on a variation in capillary action exerted by the multi-dimensional void network (16) on the heat transfer medium along the path (20). Further the invention relates to a power semiconductor module (26) comprising the above two-phase heat transfer device (10) for heat dissipation and to a method for producing the above two-phase heat transfer device (10).

    POST-PROCESSING 3D PRINTED COMPONENTS
    5.
    发明公开

    公开(公告)号:EP3937001A1

    公开(公告)日:2022-01-12

    申请号:EP20185053.4

    申请日:2020-07-09

    Applicant: ABB Schweiz AG

    Abstract: A system and method are described for post-processing 3D printed components. Post-processing may include removing support structures for the 3D printed components and may also include other processes like assembling 3D printed components into finished products. In the system and method, post-processing strategies are iteratively generated and performed on 3D printed components. Performance metrics of the post-processing strategies are compared with a user-defined performance indicator in a learning process to improve the post-processing strategy over a number of 3D printed components.

Patent Agency Ranking