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    SEMICONDUCTOR STACK ARRANGEMENT AND SEMICONDUCTOR MODULE
    1.
    发明申请
    SEMICONDUCTOR STACK ARRANGEMENT AND SEMICONDUCTOR MODULE 审中-公开
    半导体堆栈布置和半导体模块

    公开(公告)号：WO2015086184A1

    公开(公告)日：2015-06-18

    申请号：PCT/EP2014/070729

    申请日：2014-09-29

    Applicant: ABB TECHNOLOGY AG

    Inventor： SCHUDERER, Jürgen ,  COTTET, Didier ,  HABERT, Mathieu ,  KICIN, Slavo ,  KEARNEY, Daniel ,  CANALES, Francisco

    IPC: H01L25/07 ,  H01L23/46 ,  H01L23/473

    CPC classification number: H01L25/074 ,  H01L23/3735 ,  H01L23/427 ,  H01L23/473 ,  H01L23/49811 ,  H01L24/36 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/37099

    Abstract: A semiconductor stack arrangement (100, 100') and a power semiconductor module with such stack arrangement (100, 100') is proposed. The stack arrangement (100, 100') comprises a first semiconductor chip (102) with a planar terminal (106) mounted to a side (108) of the first semiconductor chip (102) and a second semiconductor chip (104) with a planar terminal (116) mounted to a side (118) of the second semiconductor chip (104). The stack arrangement (100, 100') further comprises an interposer (128, 128') arranged between the first semiconductor chip (102) and the second semiconductor chip (104), which interposer (128, 128) is adapted for electrically connecting the planar terminal (106) of the first semiconductor chip (102) and the planar terminal (116) of the second semiconductor chip (104). A first side (130) of the interposer (128, 128') is in thermal contact with the planar terminal (106) of the first semiconductor chip (102) and a second side (132) of the interposer (128, 128') is in thermal contact with the planar terminal (116) of the second semiconductor chip (104), and the interposer (128, 128') comprises a at least one channel or a plurality of channels (134) adapted for cooling the first semiconductor chip (102) and the second semiconductor chip (104). The interposer is manufactured from an electrically and thermally conductive material and/or alloy.

    Abstract translation: 提出了一种具有这种堆叠装置（100,100'）的半导体堆叠装置（100,100'）和功率半导体模块。 堆叠装置（100,100'）包括第一半导体芯片（102），其具有安装到第一半导体芯片（102）的侧面（108）的平面端子（106）和具有平面的第二半导体芯片（104） 端子（116）安装到第二半导体芯片（104）的侧面（118）。 堆叠装置（100,100'）还包括布置在第一半导体芯片（102）和第二半导体芯片（104）之间的插入器（128,128'），该插入器（128,128）适于电连接 第一半导体芯片（102）的平面端子（106）和第二半导体芯片（104）的平面端子（116）。 插入器（128,128'）的第一侧（130）与第一半导体芯片（102）的平面端子（106）和插入件（128,128'）的第二侧（132）热接触， 与第二半导体芯片（104）的平面端子（116）热接触，并且插入器（128,128'）包括适于冷却第一半导体芯片的至少一个通道或多个通道（134） （102）和第二半导体芯片（104）。 插入器由导电和导热材料和/或合金制成。

    POWER DISTRIBUTION SYSTEM FOR AUTONOMOUS FACILITIES
    2.
    发明申请
    POWER DISTRIBUTION SYSTEM FOR AUTONOMOUS FACILITIES 审中-公开

    公开(公告)号：WO2014037583A3

    公开(公告)日：2014-03-13

    申请号：PCT/EP2013/068735

    申请日：2013-09-10

    Applicant: ABB TECHNOLOGY AG

    Inventor： KIEFERNDORF, Frederick ,  DUJIC, Drazen ,  CANALES, Francisco

    IPC: H02J3/36

    Abstract: The present invention relates to a power distribution system (1) for an autonomous facility, such as an offshore platform, having a plurality of loads (7) to be supplied, comprising: - a DC distribution bus for conveying electrical energy to one or more loads, wherein the DC distribution bus is configured to carry a low or medium DC voltage; - a converter for converting generated AC power to DC voltage on the DC distribution bus; and - for at least one of the loads, a galvanically isolated converter to supply one of DC power, single phase AC power or multiple-phase AC power to the load wherein the galvanically isolated converter (6) comprises a medium-frequency transformer (12), which is inherently built inside the structure of the converter (6).

    ELECTRICAL POWER DISTRIBUTION SYSTEM FOR DATA CENTERS
    4.
    发明申请
    ELECTRICAL POWER DISTRIBUTION SYSTEM FOR DATA CENTERS 审中-公开
    数据中心电力分配系统

    公开(公告)号：WO2014026840A2

    公开(公告)日：2014-02-20

    申请号：PCT/EP2013/065754

    申请日：2013-07-25

    Applicant: ABB TECHNOLOGY AG

    Inventor： DUJIC, Drazen ,  KIEFERNDORF, Frederick ,  CANALES, Francisco

    IPC: H02J1/10 ,  H02J5/00 ,  H02J9/06 ,  H02M3/335 ,  H02M7/219 ,  H02M7/48

    CPC classification number: H02J1/102 ,  H02J5/00 ,  H02J9/061 ,  H02M3/33523 ,  H02M7/219 ,  H02M7/4807 ,  H02M7/49 ,  H02M2001/007 ,  H02M2001/0074 ,  H02M2001/325

    Abstract: The present invention relates to a power distribution system (1) for supplying electrical power to a plurality of low-voltage DC loads in a data center, comprising: -a galvanically isolated converter arrangement (3) for transforming a medium-voltage AC power provided on an utility line (2) to a low/medium DC voltage provided on a first DC bus (5); and -a plurality of DC loads to be supplied with a low DC voltage generated from the low/medium DC voltage on the first DC bus (5) by means of one or more additional DC/DC converters, characterized in that the converter arrangement (3) has one converter unit (21) per phase, wherein each of the converter units (21) has a plurality of converter cells (22), and wherein each converter cell (22) has an AC/DC converter stage (23, 31) followed by a DC/DC converter stage (24, 32), wherein the DC/DC converter stage (24, 32) has a DC/AC converter and an AC/DC converter coupled to a medium-or high-frequency transformer for galvanic isolation.

    Abstract translation: 本发明涉及一种用于向数据中心中的多个低压DC负载供电的配电系统（1），包括： - 电流隔离的转换器装置（3），用于 将在公用线路（2）上提供的中压AC电力转换为在第一DC总线（5）上提供的低/中DC电压; 以及 - 借助于一个或多个额外的DC / DC转换器在所述第一DC总线（5）上由所述低/中DC电压产生的低DC电压供应多个DC负载，其特征在于所述转换器装置（ 3）每相具有一个转换器单元（21），其中每个转换器单元（21）具有多个转换器单元（22），并且其中每个转换器单元（22）具有AC / DC转换器级（23,31 ）之后是DC / DC转换器级（24,32），其中DC / DC转换器级（24,32）具有DC / AC转换器和耦合到中频或高频变压器的AC / DC转换器，用于 电隔离。

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