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    HIGH-VOLTAGE-TRANSFORMER
    2.
    发明申请
    HIGH-VOLTAGE-TRANSFORMER 审中-公开
    高压变压器

    公开(公告)号：WO2013107479A1

    公开(公告)日：2013-07-25

    申请号：PCT/EP2012/004995

    申请日：2012-12-04

    Applicant: ABB TECHNOLOGY AG

    Inventor： HABERT, Mathieu ,  DROFENIK, Uwe

    IPC: H01F27/08 ,  H01F27/245

    CPC classification number: H01F27/08 ,  H01F27/085 ,  H01F27/245 ,  H01F41/0226

    Abstract: The invention is related to a high-voltage-transformer (10) comprising at least one transformer-core (12, 30) wound from an amorphous band-like material (32, 52) around at least one inner hollow (14, 16, 44, 46), wherein two opposed laminated front sides are formed by the edges of the wound band-like material (32, 52) and wherein at least two opposed limb areas (34, 36, 38) and an upper (40, 98) and lower (42, 64) yoke area are formed. At least one hollow-cylindrical transformer coil (18, 20, 22) is arranged around a limb area (34, 36, 38) of the at least one transformer-core (12, 30). Cooling means (54, 58, 72, 94, 96) are connected with at least a section of at least one of the laminated front sides.

    Abstract translation: 本发明涉及一种高压变压器（10），其包括至少一个从非晶带状材料（32,52）缠绕的变压器芯（12,30），其围绕至少一个内部中空部分（14,16） 44,46），其中两个相对的层叠前侧由所述缠绕带状材料（32,52）的边缘形成，并且其中至少两个相对的肢体区域（34,36,38）和上部（40,98） ）和下（42,46）磁轭区域。 至少一个中空圆柱形变压器线圈（18,20,22）被布置在所述至少一个变压器芯（12,30）的肢体区域（34,36,38）周围。 冷却装置（54,58,72,94,96）与至少一个层叠前侧的至少一部分连接。

    ELECTRO-MAGNETIC DEVICE COMPRISING A COOLING ARRANGEMENT INCLUDING A SPECIFICALLY ARRANGED THERMOSYPHON
    3.
    发明申请
    ELECTRO-MAGNETIC DEVICE COMPRISING A COOLING ARRANGEMENT INCLUDING A SPECIFICALLY ARRANGED THERMOSYPHON 审中-公开
    包含特定安定温控器的冷却装置的电磁装置

    公开(公告)号：WO2014005806A1

    公开(公告)日：2014-01-09

    申请号：PCT/EP2013/062041

    申请日：2013-06-11

    Applicant: ABB TECHNOLOGY AG

    Inventor： AGOSTINI, Bruno ,  KEARNEY, Daniel ,  AGOSTINI, Francesco ,  HABERT, Mathieu

    IPC: H01F27/08 ,  H01F27/18 ,  H01F27/24

    CPC classification number: H01F27/085 ,  F28D15/0266 ,  H01F27/18 ,  H01F27/24

    Abstract: A cooledelectro-magnetic device (1) such as a medium frequency transformer or an inductor having improved cooling characteristics is proposed. The electro-magnetic device comprises a core (3), an electrically conductive winding (5) and a cooling arrangement (7). The cooling arrangement (7) comprises at least one thermosyphon(9, 21) and a blower (11). The thermosyphon(9, 21) comprises an evaporator (13), a condenser (15) and connection piping (17). The thermosyphon(9, 21) and the blower (11) are arranged such that the evaporator (13) is in thermal conductive contact with the core (3) and the condenser and the electrically conductive winding (5) are arranged in relation to the blower (11) such that cooling gas of a gas flow (19) generated by the blower (11) cools both the condenser (15) and the winding (5). Accordingly, particularly in electro-magnetic devices such as medium frequency transformers where thermal losses are not limited to occur in a single component but are typically distributed and partly occur in the core (3) and in the winding(5), the proposed cooling arrangement (7) enables to fulfillcooling requirements of both components by providing a single airflow (19) directly cooling the winding (5) and indirectly cooling the core (3) via the thermosyphon(9, 21).

    Abstract translation: 提出了一种诸如中频变压器或具有改进的冷却特性的电感器的冷却电磁装置（1）。 电磁装置包括芯（3），导电绕组（5）和冷却装置（7）。 冷却装置（7）包括至少一个热虹吸管（9,21）和鼓风机（11）。 热虹吸管（9,21）包括蒸发器（13），冷凝器（15）和连接管道（17）。 热虹吸管（9,21）和鼓风机（11）被布置成使得蒸发器（13）与芯（3）导热接触，并且冷凝器和导电绕组（5）相对于 鼓风机（11）使得由鼓风机（11）产生的气流（19）的冷却气体冷凝冷凝器（15）和绕组（5）。 因此，特别是在诸如中频变压器的电磁装置中，其中热损耗不限于在单个部件中发生，而是通常在芯部（3）和绕组（5）中分布和部分地发生，所提出的冷却装置 （7）能够通过提供直接冷却绕组（5）并经由热虹吸（9,21）间接冷却芯（3）的单个气流（19）来实现两个部件的冷却要求。

    SEMICONDUCTOR STACK ARRANGEMENT AND SEMICONDUCTOR MODULE
    4.
    发明申请
    SEMICONDUCTOR STACK ARRANGEMENT AND SEMICONDUCTOR MODULE 审中-公开
    半导体堆栈布置和半导体模块

    公开(公告)号：WO2015086184A1

    公开(公告)日：2015-06-18

    申请号：PCT/EP2014/070729

    申请日：2014-09-29

    Applicant: ABB TECHNOLOGY AG

    Inventor： SCHUDERER, Jürgen ,  COTTET, Didier ,  HABERT, Mathieu ,  KICIN, Slavo ,  KEARNEY, Daniel ,  CANALES, Francisco

    IPC: H01L25/07 ,  H01L23/46 ,  H01L23/473

    CPC classification number: H01L25/074 ,  H01L23/3735 ,  H01L23/427 ,  H01L23/473 ,  H01L23/49811 ,  H01L24/36 ,  H01L24/40 ,  H01L24/41 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/37099

    Abstract: A semiconductor stack arrangement (100, 100') and a power semiconductor module with such stack arrangement (100, 100') is proposed. The stack arrangement (100, 100') comprises a first semiconductor chip (102) with a planar terminal (106) mounted to a side (108) of the first semiconductor chip (102) and a second semiconductor chip (104) with a planar terminal (116) mounted to a side (118) of the second semiconductor chip (104). The stack arrangement (100, 100') further comprises an interposer (128, 128') arranged between the first semiconductor chip (102) and the second semiconductor chip (104), which interposer (128, 128) is adapted for electrically connecting the planar terminal (106) of the first semiconductor chip (102) and the planar terminal (116) of the second semiconductor chip (104). A first side (130) of the interposer (128, 128') is in thermal contact with the planar terminal (106) of the first semiconductor chip (102) and a second side (132) of the interposer (128, 128') is in thermal contact with the planar terminal (116) of the second semiconductor chip (104), and the interposer (128, 128') comprises a at least one channel or a plurality of channels (134) adapted for cooling the first semiconductor chip (102) and the second semiconductor chip (104). The interposer is manufactured from an electrically and thermally conductive material and/or alloy.

    Abstract translation: 提出了一种具有这种堆叠装置（100,100'）的半导体堆叠装置（100,100'）和功率半导体模块。 堆叠装置（100,100'）包括第一半导体芯片（102），其具有安装到第一半导体芯片（102）的侧面（108）的平面端子（106）和具有平面的第二半导体芯片（104） 端子（116）安装到第二半导体芯片（104）的侧面（118）。 堆叠装置（100,100'）还包括布置在第一半导体芯片（102）和第二半导体芯片（104）之间的插入器（128,128'），该插入器（128,128）适于电连接 第一半导体芯片（102）的平面端子（106）和第二半导体芯片（104）的平面端子（116）。 插入器（128,128'）的第一侧（130）与第一半导体芯片（102）的平面端子（106）和插入件（128,128'）的第二侧（132）热接触， 与第二半导体芯片（104）的平面端子（116）热接触，并且插入器（128,128'）包括适于冷却第一半导体芯片的至少一个通道或多个通道（134） （102）和第二半导体芯片（104）。 插入器由导电和导热材料和/或合金制成。

    HEAT EXCHANGE DEVICE BASED ON A PULSATING HEAT PIPE
    5.
    发明申请
    HEAT EXCHANGE DEVICE BASED ON A PULSATING HEAT PIPE 审中-公开
    基于喷管热管的热交换装置

    公开(公告)号：WO2015049388A1

    公开(公告)日：2015-04-09

    申请号：PCT/EP2014/071318

    申请日：2014-10-06

    Applicant: ABB TECHNOLOGY AG

    Inventor： AGOSTINI, Francesco ,  TORRESIN, Daniele ,  AGOSTINI, Bruno ,  HABERT, Mathieu ,  MORASCHINELLI, Francesco ,  ANTONIAZZI, Antonello

    IPC: F24D15/02

    CPC classification number: H05K7/20336 ,  F28D1/05391 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2015/0216 ,  F28D2021/0029 ,  F28F1/022 ,  F28F1/325 ,  F28F3/12 ,  F28F9/0278 ,  H01L23/4012 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

    Abstract: The invention relates to a heat exchange device based on a pulsating heat pipe and a cooling arrangement with at least one heat exchange device. A technical objective of the invention is to improve the heat performance of a heat exchange device. The objective is achieved by a heat exchange device (1) based on a pulsating heat pipe comprising a plurality of pipes (9) to provide fluid paths between a first fluid distribution element (10) and a second fluid distribution element (11) of the heat exchange device (1), wherein each pipe (9) of the plurality of pipes (9) comprises a group of channels (12), wherein each of the first fluid distribution element (10) and the second fluid distribution element (11) comprises at least a plate (13) of a first type, wherein each plate (13) of the first type comprises openings (14) for providing an alignment functionality for the plurality of pipes (9), and wherein the plates (13) of the first type have an identical thickness, and wherein the first fluid distribution element (10) comprises a plate (15) of a second type, and wherein the plate (15) of the second type comprises openings (17) for providing fluid paths between the plurality of pipes (9), and wherein the plate (15) of the second type is positioned on a side of the plate (13) of the first type of plates of the first fluid distribution element (10) that is opposite to the second fluid distribution element (11).

    Abstract translation: 本发明涉及一种基于脉动热管和具有至少一个热交换装置的冷却装置的热交换装置。 本发明的技术目的是提高热交换装置的热性能。 目的是通过一种基于包括多个管道（9）的脉动热管的热交换装置（1）实现的，以在第一流体分配元件（10）和第二流体分配元件（11）之间提供流体路径 热交换装置（1），其中多个管道（9）中的每个管道（9）包括一组通道（12），其中第一流体分配元件（10）和第二流体分配元件（11） 至少包括第一类型的板（13），其中第一类型的板（13）包括用于为多个管（9）提供对准功能的开口（14），并且其中板 第一类型具有相同的厚度，并且其中第一流体分配元件（10）包括第二类型的板（15），并且其中第二类型的板（15）包括开口（17），用于提供 所述多个管道（9），并且其中所述第二类型的板（15） 位于与第二流体分配元件（11）相对的第一流体分配元件（10）的第一类型板的板（13）的一侧上。

    POWER ELECTRONICS COOLING
    6.
    发明申请
    POWER ELECTRONICS COOLING 审中-公开

    公开(公告)号：WO2014033173A2

    公开(公告)日：2014-03-06

    申请号：PCT/EP2013/067826

    申请日：2013-08-28

    Applicant: ABB TECHNOLOGY AG

    Inventor： BLOMBERG, Anders ,  AGOSTINIi, Bruno ,  NI, Jing ,  HAFNER, Jurgen ,  HABERT, Mathieu

    IPC: F28D15/02

    CPC classification number: F25B39/02 ,  F28D15/0266 ,  F28F7/02 ,  F28F9/001 ,  F28F9/22 ,  H01L23/4012 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: According to the present disclosure, an evaporating unit (40a) for cooling a heat emitting device (10) is provided. Typically, a cooling circuit (20a) comprises a stack (22) of evaporating units (40a) arranged in alternation with heat emitting devices (10). Each evaporating unit (40a) is connected to a condenser (80) and comprises a first inlet channel (43a), a first plurality of evaporation channels (45a), and a first outlet channel (50a). The evaporating unit (40a) is designed to pre-heat the cooling fluid flowing therein.

    Abstract translation: 根据本公开，提供了一种用于冷却发热装置（10）的蒸发单元（40a）。 典型地，冷却回路（20a）包括与发热装置（10）交替布置的蒸发单元（40a）的堆叠（22）。 每个蒸发单元（40a）连接到冷凝器（80）并且包括第一入口通道（43a），第一多个蒸发通道（45a）和第一出口通道（50a）。 蒸发单元（40a）被设计成预热在其中流动的冷却流体。

    HEAT EXCHANGE DEVICE BASED ON A PULSATING HEAT PIPE
    7.
    发明公开
    HEAT EXCHANGE DEVICE BASED ON A PULSATING HEAT PIPE 有权
    热交换装置上的热管脉动的BASIS

    公开(公告)号：EP3052864A1

    公开(公告)日：2016-08-10

    申请号：EP14780871.1

    申请日：2014-10-06

    Applicant: ABB Technology AG

    Inventor： AGOSTINI, Francesco ,  TORRESIN, Daniele ,  AGOSTINI, Bruno ,  HABERT, Mathieu ,  MORASCHINELLI, Francesco ,  ANTONIAZZI, Antonello

    IPC: F24D15/02

    CPC classification number: H05K7/20336 ,  F28D1/05391 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2015/0216 ,  F28D2021/0029 ,  F28F1/022 ,  F28F1/325 ,  F28F3/12 ,  F28F9/0278 ,  H01L23/4012 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20927 ,  H01L2924/00

    Abstract: The invention relates to a heat exchange device based on a pulsating heat pipe and a cooling arrangement with at least one heat exchange device. A technical objective of the invention is to improve the heat performance of a heat exchange device. The objective is achieved by a heat exchange device based on a pulsating heat pipe (1) comprising a plurality of pipes (9) to provide fluid paths between a first fluid distribution element (10) and a second fluid distribution element (11) of the heat exchange device (1), wherein each pipe (9) of the plurality of pipes (9) comprises a group of channels (12), wherein each of the first fluid distribution element (10) and the second fluid distribution element (11) comprises at least a plate (13) of a first type, wherein each plate (13) of the first type comprises openings (14) for providing an alignment functionality for the plurality of pipes (9); and wherein the first fluid distribution element (10) comprises a plate (15) of a second type, and wherein the plate (15) of the second type comprises openings (17) for providing fluid paths between the plurality of pipes (9), and wherein the plate (15) of the second type is positioned on a side of the plate (13) of the first type of plates of the first fluid distribution element (10) that is opposite to the second fluid distribution element (11).

    MODULAR COOLING SYSTEM
    9.
    发明公开
    MODULAR COOLING SYSTEM 审中-公开
    模块化冷却系统

    公开(公告)号：EP2893561A1

    公开(公告)日：2015-07-15

    申请号：EP13756111.4

    申请日：2013-08-28

    Applicant: ABB Technology AG

    Inventor： BLOMBERG, Anders ,  AGOSTINI, Bruno ,  NI, Jing ,  HAFNER, Jurgen ,  HABERT, Mathieu

    IPC: H01L23/427 ,  H01L23/473 ,  F28D15/02 ,  H05K7/20 ,  H01L23/467

    Abstract: According to the present disclosure, a modular cooling system 10 for cooling a plurality of electronic components 20 is provided. The cooling system comprises a plurality of cooling modules 30 and a clamping arrangement 40. Each cooling module 30 comprises an evaporator unit, a condenser, a first pipe system 70 and a second pipe system 80. The clamping arrangement 40 is adapted for holding and pressing an alternation stack 90 in which the evaporator units 50 are stacked in alternation with the power electronic components 20.

    POWER ELECTRONICS COOLING
    10.
    发明公开
    POWER ELECTRONICS COOLING 有权
    LEISTUNGSELEKTRONIKKÜHLUNG

    公开(公告)号：EP2893273A2

    公开(公告)日：2015-07-15

    申请号：EP13753322.0

    申请日：2013-08-28

    Applicant: ABB Technology AG

    Inventor： BLOMBERG, Anders ,  AGOSTINIi, Bruno ,  NI, Jing ,  HAFNER, Jurgen ,  HABERT, Mathieu

    IPC: F25B39/02 ,  F28F9/00 ,  F28F9/22

    CPC classification number: F25B39/02 ,  F28D15/0266 ,  F28F7/02 ,  F28F9/001 ,  F28F9/22 ,  H01L23/4012 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: According to the present disclosure, an evaporating unit (40a) for cooling a heat emitting device (10) is provided. Typically, a cooling circuit (20a) comprises a stack (22) of evaporating units (40a) arranged in alternation with heat emitting devices (10). Each evaporating unit (40a) is connected to a condenser (80) and comprises a first inlet channel (43a), a first plurality of evaporation channels (45a), and a first outlet channel (50a). The evaporating unit (40a) is designed to pre-heat the cooling fluid flowing therein.

    Abstract translation: 根据本公开，提供了一种用于冷却散热装置（10）的蒸发单元（40a）。 通常，冷却回路（20a）包括与发热装置（10）交替布置的蒸发单元（40a）的堆叠（22）。 每个蒸发单元（40a）连接到冷凝器（80）并且包括第一入口通道（43a），第一多个蒸发通道（45a）和第一出口通道（50a）。 蒸发单元（40a）被设计成预加热在其中流动的冷却流体。

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