公开(公告)号：EP1995271A4

公开(公告)日：2012-03-28

申请号：EP07708197

申请日：2007-02-08

Applicant: ADEKA CORP

Inventor： TAKAHATA YOSHINORI ,  MORI TAKAHIRO ,  SAITO SEIICHI ,  IDE MITSUNORI ,  FUKUDA YOSHIHIRO

IPC: C08J5/24 ,  C08G59/40 ,  C08G59/46 ,  C08L63/00 ,  C08L77/00 ,  H05K1/03

CPC classification number: C08J5/24 ,  C08G59/46 ,  C08J2377/00 ,  C08K3/013 ,  C08L63/00 ,  C08L77/00 ,  H05K1/0326 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31725 ,  C08L2666/22

Abstract: An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E): (A): a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl group in a position adjacent to an amino group; (B): an epoxy resin; (C): an epoxy resin curing agent; (D): a filler; and (E): a solvent.

公开(公告)号：JP2011074298A

公开(公告)日：2011-04-14

申请号：JP2009229185

申请日：2009-10-01

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： MORI TAKAHIRO ,  FUKUDA YOSHIHIRO ,  FUJII ASUKA ,  DEGUCHI YUICHIRO

IPC: C09J163/00 ,  C09J11/06 ,  C09J161/12 ,  C09J175/02 ,  C09J177/06 ,  H01L21/52 ,  H01L23/29 ,  H01L23/31

CPC classification number: C08G18/3225 ,  C08G59/4021 ,  C08G59/44 ,  C08L77/00 ,  C08L2666/20 ,  C09J163/00

Abstract: PROBLEM TO BE SOLVED: To provide a thermosetting resin composition exhibiting an excellent adhesivity to silicon wafers after cured. SOLUTION: The adhesive resin composition for silicon wafers includes a compound having a urea structure in an amount that the urea structure portion of the compound accounts for 0.1-50 pts.mass to 100 pts.mass of an epoxy resin. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种在固化后对硅晶片具有优异粘附性的热固性树脂组合物。 解决方案：用于硅晶片的粘合剂树脂组合物包括具有尿素结构的化合物，其量为化合物的尿素结构部分为0.1-50质点至100质量份环氧树脂。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008307762A

公开(公告)日：2008-12-25

申请号：JP2007156893

申请日：2007-06-13

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： MORI TAKAHIRO ,  FUKUDA YOSHIHIRO ,  TAKAHATA YOSHINORI

IPC: B32B27/34 ,  B32B1/08 ,  C08G59/62 ,  C08K5/5399 ,  C08K7/18 ,  C08L63/00 ,  H05K1/03

CPC classification number: H05K1/036 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/34 ,  B32B27/38 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/062 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/105 ,  B32B2307/21 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/00 ,  C08G59/44 ,  H05K1/0346 ,  H05K2201/0154 ,  Y10T428/263 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31511 ,  Y10T428/31721 ,  Y10T428/31725

Abstract: PROBLEM TO BE SOLVED: To provide a composite material having an epoxy resin adhesive layer at the interface of a polyimide layer and an epoxy resin layer. SOLUTION: The composite material is formed by laminating a layer (B) comprising a polyimide on a layer (A) comprising an epoxy resin curable composition containing a polyamide compound which has a structure having a phenolic hydroxyl group represented by the general formula (I) or the general formula (II). In the formulae (I) and (II), rings A and B are each a 6-18C arylene group or a 13-25C alkylidenediarylene group. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供在聚酰亚胺层和环氧树脂层的界面处具有环氧树脂粘合剂层的复合材料。 解决方案：复合材料通过在包含含有具有由通式表示的酚羟基的结构的聚酰胺化合物的环氧树脂固化性组合物的层（A）上层叠包含聚酰亚胺的层（B）而形成 （I）或通式（II）。 在式（I）和（II）中，环A和B各自为6-18C亚芳基或13-25个亚烷基亚芳基。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2007246668A

公开(公告)日：2007-09-27

申请号：JP2006071417

申请日：2006-03-15

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： TAKAHATA YOSHINORI ,  MORI TAKAHIRO ,  SAITO SEIICHI ,  IDE MITSUNORI ,  FUKUDA YOSHIHIRO

IPC: C08J5/24 ,  H05K1/03

CPC classification number: C08J5/24 ,  C08G59/46 ,  C08J2377/00 ,  C08K3/013 ,  C08L63/00 ,  C08L77/00 ,  H05K1/0326 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31725 ,  C08L2666/22

Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin curing composition for prepreg having a high glass transition temperature and affording the prepreg having a low coefficient of linear expansion.
SOLUTION: The epoxy resin curing composition for the prepreg comprises the following components (A) to (E). (A) a polyamide compound having a structure derived from a phenolic hydroxy group-containing aromatic diamine having the phenolic hydroxy group at a position adjacent to the amino group, (B) an epoxy resin, (C) an epoxy resin curing agent, (D) a filler and (E) a solvent.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供具有高玻璃化转变温度的预浸料的环氧树脂固化组合物，并提供具有低线膨胀系数的预浸料。 解决方案：预浸料的环氧树脂固化组合物包括以下组分（A）至（E）。 （A）具有衍生自在与氨基相邻的位置处具有酚羟基的含酚羟基的芳族二胺的结构的聚酰胺化合物，（B）环氧树脂，（C）环氧树脂固化剂（ D）填料和（E）溶剂。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2008143813A

公开(公告)日：2008-06-26

申请号：JP2006330954

申请日：2006-12-07

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： NANBU YOKO ,  FUKUDA YOSHIHIRO

IPC: C07F9/6587 ,  C08K5/521 ,  C08L101/00

Abstract: PROBLEM TO BE SOLVED: To obtain a triazine-based aromatic phosphate compound that exhibits an excellent flame retardance with a small amount of addition without reducing physical properties such as resin strength, etc., when mixed with a synthetic resin.
SOLUTION: The triazine-based aromatic phosphate compound is produced by a method for reacting 4-hydroxybenzonitrile in a methylene chloride solvent by using a trifluorosulfonic acid catalyst to produce a tris(hydroxyphenyl)triazine compound and reacting the tris(hydroxyphenyl)triazine compound with a diphenylphosphoric acid chloride compound.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：当与合成树脂混合时，获得具有少量添加而显示出优异的阻燃性并且不降低树脂强度等物理性能的三嗪系芳族磷酸酯化合物。 解决方案：通过使用三氟磺酸催化剂使4-羟基苄腈在二氯甲烷溶剂中反应以制备三（羟基苯基）三嗪化合物并使三（羟基苯基）三嗪反应生成三嗪基芳族磷酸酯化合物 与二苯基磷酰氯化合物的化合物。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008007566A

公开(公告)日：2008-01-17

申请号：JP2006177259

申请日：2006-06-27

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SAITO SEIICHI ,  MORI TAKAHIRO ,  FUKUDA YOSHIHIRO ,  TAKAHATA YOSHINORI

IPC: C08G59/14 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a compound which gives an epoxy resin composition excellent effects in terms of properties of toughness, a high glass transition temperature and a low thermal linear expansion coefficient.
SOLUTION: The compound is obtained by reacting (a) an epoxy compound expressed by formula (1) with (b) a modified rubber. The epoxy resin composition contains the compound, has high adhesivity, a low thermal linear expansion coefficient, low hygroscopicity, a high glass transition temperature and excellent properties in toughness such as in tensile properties and elongation.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种赋予环氧树脂组合物在韧性，高玻璃化转变温度和低热线膨胀系数方面具有优异效果的化合物。 解决方案：通过（a）由式（1）表示的环氧化合物与（b）改性橡胶反应获得化合物。 环氧树脂组合物含有化合物，粘合性高，热线膨胀系数低，吸湿性低，玻璃化转变温度高，拉伸性能和伸长率等韧性优异。 版权所有（C）2008，JPO＆INPIT