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    Optical fiber
    6.
    发明专利
    Optical fiber 有权
    光纤

    公开(公告)号：JP2013057732A

    公开(公告)日：2013-03-28

    申请号：JP2011194856

    申请日：2011-09-07

    Applicant: Adeka Corp ,  株式会社Adeka ,  Sumitomo Electric Ind Ltd ,  住友電気工業株式会社

    Inventor： SOMA KAZUYUKI ,  HATTORI TOMOYUKI ,  SUEYOSHI TAKASHI ,  SAITO SEIICHI

    IPC: G02B6/44

    Abstract: PROBLEM TO BE SOLVED: To provide an optical fiber in which excellent heat resistance and productivity are provided and a microbend loss is suppressed even in a high temperature environment.SOLUTION: An optical fiber 1 has a covering layer 5 formed by crosslinking an energy curable resin composition containing a silicon compound on the outer periphery of a glass fiber 4 made of a core part 2 and a cladding part 3. The silicon compound contains a compound (A) represented by a specific general formula and a compound (B) represented by another specific general formula, and the content of the compound (B) relative to 100 parts by mass of the total amount of the compound (A) and compound (B) is in a range of 10-30 parts by mass.

    Abstract translation: 要解决的问题：提供一种提供优异的耐热性和生产率并且即使在高温环境中也能抑制微弯损耗的光纤。 解决方案：光纤1具有通过在由芯部2和包层部3构成的玻璃纤维4的外周交联含有硅化合物的能量固化树脂组合物形成的覆盖层5.硅化合物 含有由特定通式表示的化合物（A）和由另一具体通式表示的化合物（B），化合物（B）的含量相对于化合物（A）的总量100质量份， 化合物（B）的浓度范围为10〜30质量份。 版权所有（C）2013，JPO＆INPIT

    Method for manufacturing optical waveguide having optical path conversion function
    7.
    发明专利
    Method for manufacturing optical waveguide having optical path conversion function 有权
    具有光学路径转换功能的光波导的制造方法

    公开(公告)号：JP2012237778A

    公开(公告)日：2012-12-06

    申请号：JP2011104851

    申请日：2011-05-10

    Applicant: Adeka Corp ,  株式会社Adeka

    Inventor： SAITO SEIICHI ,  ISHIKAWA YOSHIHIRO ,  IWASHIMA TOMOYUKI

    IPC: G02B6/13 ,  G02B6/12

    Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method capable of forming an optical waveguide with an optical path conversion function directly on a substrate by a simple process, the optical waveguide allowing fine processing and having high surface accuracy, and to provide the optical waveguide manufactured by the manufacturing method.SOLUTION: In a method for manufacturing an optical waveguide whose clad part is formed of a positive photosensitive resin, an inclined surface which is formed by film loss in a process of developing the positive photosensitive resin is set to an optical path conversion mirror surface. Preferably, a polysiloxane-based positive photosensitive resin is used as the positive photosensitive resin, and a core part surrounded by the clad part is formed of a negative photosensitive resin.

    Abstract translation: 解决的问题：为了提供一种能够通过简单的工艺在基板上直接形成具有光路转换功能的光波导的制造方法，该光波导允许精细加工并具有高的表面精度，并且提供 光波导通过制造方法制造。 解决方案：在一种制造其包层部分由正性感光树脂形成的光波导的方法中，将在正型感光性树脂显影过程中由薄膜损失形成的倾斜表面设置为光路转换镜 表面。 优选使用基于聚硅氧烷的正性感光性树脂作为正性感光性树脂，由包层部包围的芯部由负性感光性树脂形成。 版权所有（C）2013，JPO＆INPIT

    Silicon-containing curable resin composition
    8.
    发明专利
    Silicon-containing curable resin composition 有权
    含硅的可固化树脂组合物

    公开(公告)号：JP2012144678A

    公开(公告)日：2012-08-02

    申请号：JP2011006116

    申请日：2011-01-14

    Applicant: Adeka Corp ,  株式会社Adeka

    Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

    IPC: C08G59/20

    CPC classification number: C08G77/38 ,  C08G77/12

    Abstract: PROBLEM TO BE SOLVED: To provide a curable composition capable of providing a cured film which is free from surface tackiness, is excellent in heat resistance, and hardly causes crack even when used at high temperature for a long time.SOLUTION: The silicon-containing curable resin composition includes: an epoxysiloxane compound having at least two epoxy-containing groups and a group represented by general formula (1) in one molecule as a component (A); an epoxy siloxane compound having 1-10 silicon atoms and at least two epoxy-containing group in one molecule as a component (B); and an epoxy curable compound as a component (C). In general formula (1), R-R, which may be the same or different, each represent 1-4C alkyl or 6-10C aryl, and a represents an integer of 20-10,000.

    Abstract translation: 解决的问题：为了提供能够提供无表面粘性的固化膜的固化性组合物，耐热性优异，即使长时间在高温下使用也难以引起龟裂。 解决方案：含硅可固化树脂组合物包括：具有至少两个含环氧基团的环氧硅氧烷化合物和在一个分子中由通式（1）表示的基团作为组分（A）; 在一个分子中具有1-10个硅原子和至少两个含环氧基团的环氧硅氧烷化合物作为组分（B）; 和作为（C）成分的环氧固化性化合物。 在通式（1）中，可以相同或不同的R 1 -R 4 分别表示1-4C 烷基或6-10C芳基，和a表示20-10,000的整数。 版权所有（C）2012，JPO＆INPIT

    New compound, epoxy resin composition and its hardened product
    9.
    发明专利
    New compound, epoxy resin composition and its hardened product 审中-公开
    新化合物，环氧树脂组合物及其硬化产品

    公开(公告)号：JP2008007566A

    公开(公告)日：2008-01-17

    申请号：JP2006177259

    申请日：2006-06-27

    Applicant: Adeka Corp ,  株式会社Adeka

    Inventor： SAITO SEIICHI ,  MORI TAKAHIRO ,  FUKUDA YOSHIHIRO ,  TAKAHATA YOSHINORI

    IPC: C08G59/14 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

    Abstract: PROBLEM TO BE SOLVED: To provide a compound which gives an epoxy resin composition excellent effects in terms of properties of toughness, a high glass transition temperature and a low thermal linear expansion coefficient.
    SOLUTION: The compound is obtained by reacting (a) an epoxy compound expressed by formula (1) with (b) a modified rubber. The epoxy resin composition contains the compound, has high adhesivity, a low thermal linear expansion coefficient, low hygroscopicity, a high glass transition temperature and excellent properties in toughness such as in tensile properties and elongation.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种赋予环氧树脂组合物在韧性，高玻璃化转变温度和低热线膨胀系数方面具有优异效果的化合物。 解决方案：通过（a）由式（1）表示的环氧化合物与（b）改性橡胶反应获得化合物。 环氧树脂组合物含有化合物，粘合性高，热线膨胀系数低，吸湿性低，玻璃化转变温度高，拉伸性能和伸长率等韧性优异。 版权所有（C）2008，JPO＆INPIT

    Silicon-containing curable composition
    10.
    发明专利
    Silicon-containing curable composition 审中-公开
    含硅的可固化组合物

    公开(公告)号：JP2012067286A

    公开(公告)日：2012-04-05

    申请号：JP2011180344

    申请日：2011-08-22

    Applicant: Adeka Corp ,  株式会社Adeka

    Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

    IPC: C08L83/05 ,  C08G77/20 ,  C08L83/07

    Abstract: PROBLEM TO BE SOLVED: To provide a curable composition which has excellent heat resistance, toughness and adhesion.SOLUTION: The curable composition contains: (A) a compound having at least two vinyl groups in the molecule; (B) a compound having at least two Si-H groups in the molecule; and (C) a hydrosilylating catalyst, and the compound in the (A) component and/or the compound in the (B) component is the compound having groups expressed by general formula (1) (in the formula, Xdenotes a residue obtained by removing two hydroxyl groups from a 2 to 25C dihydroxyl compound).

    Abstract translation: 待解决的问题：提供耐热性，韧性和粘合性优异的固化性组合物。 解决方案：可固化组合物包含：（A）在分子中具有至少两个乙烯基的化合物; （B）分子中具有至少两个Si-H基团的化合物; 和（C）氢化硅烷化催化剂，（A）成分和/或（B）成分中的化合物中的化合物是具有通式（1）表示的基团的化合物（式中，X 1 表示通过从2至25℃的二羟基化合物除去两个羟基而获得的残基）。 版权所有（C）2012，JPO＆INPIT

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