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    New compound, epoxy resin composition and its hardened product
    4.
    发明专利
    New compound, epoxy resin composition and its hardened product 审中-公开
    新化合物，环氧树脂组合物及其硬化产品

    公开(公告)号：JP2008007566A

    公开(公告)日：2008-01-17

    申请号：JP2006177259

    申请日：2006-06-27

    Applicant: Adeka Corp ,  株式会社Adeka

    Inventor： SAITO SEIICHI ,  MORI TAKAHIRO ,  FUKUDA YOSHIHIRO ,  TAKAHATA YOSHINORI

    IPC: C08G59/14 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03

    Abstract: PROBLEM TO BE SOLVED: To provide a compound which gives an epoxy resin composition excellent effects in terms of properties of toughness, a high glass transition temperature and a low thermal linear expansion coefficient.
    SOLUTION: The compound is obtained by reacting (a) an epoxy compound expressed by formula (1) with (b) a modified rubber. The epoxy resin composition contains the compound, has high adhesivity, a low thermal linear expansion coefficient, low hygroscopicity, a high glass transition temperature and excellent properties in toughness such as in tensile properties and elongation.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种赋予环氧树脂组合物在韧性，高玻璃化转变温度和低热线膨胀系数方面具有优异效果的化合物。 解决方案：通过（a）由式（1）表示的环氧化合物与（b）改性橡胶反应获得化合物。 环氧树脂组合物含有化合物，粘合性高，热线膨胀系数低，吸湿性低，玻璃化转变温度高，拉伸性能和伸长率等韧性优异。 版权所有（C）2008，JPO＆INPIT

    Epoxy resin composition and printed board obtained by using the same
    5.
    发明专利
    Epoxy resin composition and printed board obtained by using the same 审中-公开
    环氧树脂组合物和使用它的印刷板

    公开(公告)号：JP2013076055A

    公开(公告)日：2013-04-25

    申请号：JP2012108297

    申请日：2012-05-10

    Applicant: Adeka Corp ,  株式会社Adeka

    Inventor： MORI TAKAHIRO ,  KASHIWAZAKI CHIKASHI ,  SAIBI YOSHIHIDE ,  KIKUCHI TAKAAKI ,  TAKAHATA YOSHINORI

    IPC: C08G59/62 ,  C08G59/20 ,  C08K5/5399 ,  C08L63/00 ,  H05K1/03

    CPC classification number: H05K1/0326 ,  C08G59/621 ,  H05K2201/012 ,  C08K5/5399 ,  C08L63/00 ,  C08K5/0066

    Abstract: PROBLEM TO BE SOLVED: To provide a printed board excellent in low dielectric property, flame retardancy and solder heat resistance after boiled, and to provide an epoxy resin composition used for the printed board.SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent and a reactive flame retardant, wherein the curing agent is a biphenylene aralkyl-type phenol resin represented by formula (I). A printed wiring board is obtained by using the epoxy resin composition. In formula (I), m represents an integer of 0 to 400; and Xto Xeach independently represent a hydrogen atom or a 1-10C alkyl group.

    Abstract translation: 要解决的问题：提供一种在煮沸后具有优异的低介电性，阻燃性和焊料耐热性的印刷电路板，并提供用于印刷电路板的环氧树脂组合物。 环氧树脂组合物包含环氧树脂，固化剂和反应性阻燃剂，其中固化剂是由式（I）表示的亚联苯基芳烷基型酚醛树脂。 通过使用环氧树脂组合物获得印刷线路板。 式（I）中，m表示0〜400的整数， 并且X 1 至X 4 各自独立地表示氢原子或1-10C烷基。 版权所有（C）2013，JPO＆INPIT

    Prepreg and copper-clad substrate having the same as insulating layer
    6.
    发明专利
    Prepreg and copper-clad substrate having the same as insulating layer 审中-公开
    具有绝缘层的预浸料和铜箔基材

    公开(公告)号：JP2014172983A

    公开(公告)日：2014-09-22

    申请号：JP2013046235

    申请日：2013-03-08

    Applicant: Adeka Corp ,  株式会社Adeka

    Inventor： KASHIWAZAKI CHIKASHI ,  TAKAHATA YOSHINORI ,  SAIBI YOSHIHIDE

    IPC: C08J5/24 ,  C08G59/62 ,  C08K3/20 ,  C08K3/36 ,  C08K5/521 ,  C08K5/544 ,  C08L63/00 ,  H05K1/03

    Abstract: PROBLEM TO BE SOLVED: To provide a prepreg suitable for a copper-clad substrate, which exhibits high processing precision in forming vias by laser and can form vias of high processing accuracy with a few laser shots, especially in high-energy laser processing by a direct laser method.SOLUTION: Provided is a prepreg formed by impregnating a glass cloth with a thermosetting resin composition whose glass transition temperature after curing becomes 170 to 300°C. The thermosetting resin composition comprises a thermosetting resin component (A) comprising a polyfunctional epoxy resin, a phenol resin and an imidazole-based curing agent, a phosphoric acid-based flame retardant component (B) comprising a phosphoric acid amide compound and a phosphoric ester compound, and an inorganic filler component (C) comprising aluminum hydroxide and silica as essential components. Furthermore, a content of the inorganic filler component (C) in the thermosetting resin component is 40 to 80 mass%.

    Abstract translation: 要解决的问题：提供一种适合于铜包覆基板的预浸料，其在通过激光形成通孔中表现出高的加工精度，并且可以通过几个激光照射形成具有高加工精度的通孔，特别是在通过 直接激光法。方法：提供一种通过用固化后的玻璃化转变温度为170〜300℃的热固性树脂组合物浸渍玻璃布而形成的预浸料。 热固性树脂组合物包含含有多官能环氧树脂，酚醛树脂和咪唑类固化剂的热固性树脂组分（A），包含磷酸酰胺化合物和磷酸酯的磷酸基阻燃组分（B） 化合物和包含氢氧化铝和二氧化硅作为必要成分的无机填料组分（C）。 此外，热固性树脂成分中的无机填料成分（C）的含量为40〜80质量％。

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