公开(公告)号：EP1602689A4

公开(公告)日：2007-07-25

申请号：EP04717817

申请日：2004-03-05

Applicant: ADEKA CORP

Inventor： TAKAHATA YOSHINORI ,  MORI TAKAHIRO ,  HIRAKAWA SETSUKO ,  SAITO SEIICHI

IPC: C08J5/24 ,  C08G59/40 ,  C08G59/50 ,  C08K7/00 ,  C08L63/00

CPC classification number: C08G59/4014 ,  C08K7/00 ,  C08L63/00

Abstract: An epoxy resin composition is disclosed which contains (A) 1-10 weight % of a polyvalent epoxy compound, (B) 1-10 weight % of a curing agent selected among cyanate compounds and benzoxazine compounds, (C) 0.1-5 weight % of a polyvalent phenolic compound and (D) 80-97.9 weight % of a spherical filler having an elastic modulus of 300 GPa or more. The epoxy resin composition has a void fraction of 3% or less and a high elastic modulus.