公开(公告)号：EP1746132A4

公开(公告)日：2009-12-16

申请号：EP05739080

申请日：2005-05-10

Applicant: ADEKA CORP ,  KANSAI ELECTRIC POWER CO

Inventor： SUEYOSHI TAKASHI ,  HIWATARI KEN ,  JANADO TADASHI ASAHI ,  SHOJI YOSHIKAZU ,  SUGAWARA YOSHITAKA

IPC: C08L83/07 ,  C08L83/04 ,  C08L83/05

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08L83/00

公开(公告)号：EP2141188A4

公开(公告)日：2010-08-04

申请号：EP08740710

申请日：2008-04-21

Applicant: ADEKA CORP

Inventor： SUEYOSHI TAKASHI ,  HIWATARI KEN-ICHIRO ,  JANADO TADASHI ,  SHOJI YOSHIKAZU ,  SAITO SEIICHI ,  SUGAWARA YOSHITAKA

IPC: C08G77/50 ,  C08K3/20 ,  C08K3/36 ,  C08L83/05 ,  C08L83/07 ,  C08L83/14

CPC classification number: C08G77/50 ,  C08L83/14 ,  C08L83/00

公开(公告)号：JP2013035880A

公开(公告)日：2013-02-21

申请号：JP2011170164

申请日：2011-08-03

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： MORITA HIROSHI ,  OMI JINICHI ,  SUEYOSHI TAKASHI

IPC: C08G59/62

Abstract: PROBLEM TO BE SOLVED: To provide a curing agent for an epoxy resin.SOLUTION: There is provided a specific phenol compound having a group of formula (1), a group of formula (2) and having a group of formula (2) and a group of formula (3). In formula (1), Rs are the same or different and each represents a 1-4C alkyl or 6-10C aryl; Xrepresents a group represented by general formula (4); and a denotes a number of 3-6. In formula (2), Rs are the same or different and each represents a 1-4C alkyl or 6-10C aryl; Xrepresents a group represented by general formula (4); and b denotes a number of 2-5. In formula (3), c denotes a number of 1-5, provided that b-c is a number of 0-4; R, Xand b are as defined in formula (2). In formula (4), Rrepresents a 2-10C bivalent saturated aliphatic hydrocarbon group; Rrepresents 1-4C alkyl; d denotes a number of 1-2; and e denotes a number of 0-3.

Abstract translation: 要解决的问题：提供环氧树脂的固化剂。 提供具有式（1）的基团，式（2）的基团和具有式（2）的基团和式（3）的基团的特定的酚化合物。 在式（1）中，R“相同或不同，各自表示1-4C烷基或6-10C芳基; X 1 表示通式（4）表示的基团。 a表示3-6。 在式（2）中，R“相同或不同，各自表示1-4C烷基或6-10C芳基; X 2 表示由通式（4）表示的基团。 b表示2-5。 在式（3）中，c表示1-5的数，条件是b-c为0-4的数; R 2 ，X 2 和b如公式（2）中定义。 在式（4）中，R 3 表示2-10C二价饱和脂族烃基; R 4 表示1-4C烷基; d表示1-2的数; e表示0-3的数。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2009280747A

公开(公告)日：2009-12-03

申请号：JP2008136155

申请日：2008-05-26

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: C08L83/05 ,  C08K5/56 ,  C08L83/07

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which scarcely causes discoloration due to light deterioration and thermal deterioration, is rigid, has less dust attachment, and is useful as a sealant for electric or electronic materials, and, inter alia, light emitting devices.
SOLUTION: The silicon-containing curable composition contains: (A) a prepolymer having not less than two Si-H groups in one molecule obtained by hydrosilylating (a-1) a compound having not less than two Si-H groups in the molecule and (a-2) an unsaturated compound having an alicyclic structure, an ether group, and not less than two carbon-carbon double bonds in one molecule reactive with the Si-H groups in the compound (a-1) in a ratio at which not less than two Si-H groups are left in one molecule after the reaction; (B) a cyclic siloxane compound having not less than two carbon-carbon double bonds in one molecule reactive with the Si-H groups; and (C) a hydrosilylating catalyst.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供几乎不会由于光劣化和热劣化而引起变色的含硅可固化组合物，是刚性的，具有较少的粉尘附着，并且可用作电气或电子材料的密封剂， 尤其是发光器件。 解决方案：含硅可固化组合物包含：（A）在一个分子中具有不少于两个Si-H基团的预聚物，其通过将（a-1）具有不少于两个Si-H基团的化合物氢化 该分子和（a-2）具有脂环结构，醚基和在一个分子中具有不少于两个碳 - 碳双键的不饱和化合物与化合物（a-1）中的Si-H基反应，在 反应后一分子中不少于两个Si-H基团的比例; （B）一个分子中具有不少于2个碳 - 碳双键的环硅氧烷化合物与Si-H基团反应; 和（C）氢化硅烷化催化剂。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2012237801A

公开(公告)日：2012-12-06

申请号：JP2011105251

申请日：2011-05-10

Applicant: Sumitomo Electric Ind Ltd ,  住友電気工業株式会社 ,  Adeka Corp ,  株式会社Adeka

Inventor： SOMA KAZUYUKI ,  HATTORI TOMOYUKI ,  SUEYOSHI TAKASHI ,  SAKAMAKI KOICHI

IPC: G02B6/44

Abstract: PROBLEM TO BE SOLVED: To provide an optical fiber that is usable for a temperature sensor system etc. in a high temperature environment and excellent in heat resistance, and a manufacturing method for the same.SOLUTION: An optical fiber includes, on an outer periphery of a glass fiber made up of a core part and a cladding part, a heat-resistant coating layer made of by crosslinking an energy curable resin composition including a silicon compound. The silicon compound included in the energy curable resin composition of the coating layer at the outermost layer thereof contains 10-30 mass% of a cyclic silicone portion.

Abstract translation: 要解决的问题：提供可用于温度传感器系统等的高温环境中的耐热性和优异的耐热性的光纤及其制造方法。 解决方案：光纤在由芯部和包层部分构成的玻璃纤维的外周上包括通过交联包含硅化合物的能量固化树脂组合物制成的耐热涂层。 包含在其最外层的涂层的能量固化树脂组合物中的硅化合物含有10-30质量％的环状硅氧烷部分。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011221226A

公开(公告)日：2011-11-04

申请号：JP2010089378

申请日：2010-04-08

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： ISHIKAWA YOSHIHIRO ,  SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: G02B6/13

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a polymer light guide having an excellent flexibility even when a layer of photosensitive polymer material is formed by DFR method.SOLUTION: A method for manufacturing a light guide 11 comprises a step of forming a core material layer 7 by laminating a dry film 2 comprising photosensitive polymer material formed on a support film 1 onto a surface of a lower cladding layer 5 by thermocompression under reduced pressure, a step of peeling the support film 1 on the core material layer 7, a step of heat-treating the core material layer 7 for smoothing the surface, and a step of pattern-exposing the heat-treated core material layer 7 for forming a core part 9 with a predetermined pattern.

Abstract translation: 要解决的问题：提供一种制造具有优异柔性的聚合物光导的方法，即使通过DFR方法形成感光性聚合物材料层也是如此。 解决方案：制造光导11的方法包括通过将包含形成在支撑膜1上的感光性聚合物材料的干膜2层压到下包层5的表面上的热压缩形成芯材层7的步骤 在减压下，将芯材层7上的支撑膜1剥离的步骤，使芯材层7进行热处理以使表面平滑化的工序，以及使热处理后的芯材层7图案曝光的工序 用于形成具有预定图案的芯部9。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2008266484A

公开(公告)日：2008-11-06

申请号：JP2007112738

申请日：2007-04-23

Applicant: Adeka Corp ,  Kansai Electric Power Co Inc:The ,  株式会社Adeka ,  関西電力株式会社

Inventor： SUEYOSHI TAKASHI ,  HIWATARI KENICHIRO ,  SHANADO TADASHI ,  SHOJI YOSHIKAZU ,  SAITO SEIICHI ,  SUGAWARA YOSHITAKA

IPC: C08G77/44 ,  C08L83/05 ,  C08L83/07

CPC classification number: C08G77/50 ,  C08L83/14 ,  C08L83/00

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition excellent in a handling property and a curing property in which an obtained cured article is excellent in heat-resistance and flexibility.
SOLUTION: The curable composition comprises a silicon-containing compound represented by general formula (1), the compound in which Z is a hydrogen atom in general formula (1), the compound in which Z is a 2-4C alkenyl group or an alkynyl group in general formula (1), and a hydrosilylated reaction catalyst. In the formula, R
a -R
g are a 1-12C saturated aliphatic hydrocarbon group or a 6-12C aromatic hydrocarbon group (however, R
e and R
f do not simultaneously become the 1-12C saturated aliphatic hydrocarbon group), Y is a 2-4C alkylene group, Z is a hydrogen atom or a 2-4C alkenyl group or an alkynyl group, K is an integer of 2-7, T is an integer of 1-7, and P is an integer of 0-3. M and N are N:M=1:1 to 1:100, are the number in which total of all Ms and all Ns becomes 15 or higher, and are the number in which a mass average molecular weight of the compound is made to 3,000-1,000,000.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种处理性能和固化性能优异的含硫可固化组合物，其中获得的固化物具有优异的耐热性和柔软性。 解决方案：可固化组合物包含通式（1）表示的含硅化合物，其中Z为通式（1）中的氢原子的化合物，其中Z为2-4C烯基的化合物 或通式（1）中的炔基和氢化硅烷化反应催化剂。 在该式中，R 16是具有1-12个碳原子的饱和脂族烃基或6-12个碳芳族烃基（然而，R“ SP>和R f 不同时成为1-12C饱和脂族烃基），Y为2-4C亚烷基，Z为氢原子或2-4C烯基或炔基 组，K为2-7的整数，T为1-7的整数，P为0-3的整数。 M和N为N:M = 1:1至1:100，是所有Ms和全部Ns的总和变为15或更高的数，并且是化合物的质均分子量为 3,000-1,000,000。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008266483A

公开(公告)日：2008-11-06

申请号：JP2007112735

申请日：2007-04-23

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  HIWATARI KENICHIRO ,  SHANADO TADASHI ,  SHOJI YOSHIKAZU

IPC: C08G77/04 ,  C08L83/05 ,  C08L83/07

CPC classification number: C08G77/50 ,  C08L83/14

Abstract: PROBLEM TO BE SOLVED: To provide a curable composition excellent in a handling property and a curing property in which an obtained cured article is excellent in transparency and flexibility.
SOLUTION: The curable composition comprises a silicon-containing compound represented by general formula (1), the compound in which Z is a hydrogen atom in general formula (1), the compound in which Z is a 2-4C alkenyl group or an alkynyl group, and a hydrosilylated reaction catalyst. In the formula, R
a -R
d are a 1-12C saturated aliphatic hydrocarbon group, R
e is a 1-12C saturated aliphatic hydrocarbon group or a 6-12C aromatic hydrocarbon group, Y is a 2-4C alkylene group, Z is a hydrogen atom or a 2-4C alkenyl group or an alkynyl group, K is an integer of 2-7, T is an integer of 1-7, P is an integer of 0-3, and M is the number in which the mass average molecular weight of the silicon-containing compound is made to 3,000-1,000,000.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 待解决的问题：提供一种处理性和固化性优异的固化性组合物，其中获得的固化物的透明性和柔韧性优异。 解决方案：可固化组合物包含通式（1）表示的含硅化合物，其中Z为通式（1）中的氢原子的化合物，其中Z为2-4C烯基的化合物 或炔基，和氢化硅烷化反应催化剂。 在该式中，R“SP”a -R d 是1-12C饱和脂族烃基，R SP是一个1-12C饱和脂族烃 基团或6-12元芳族烃基，Y为2-4C亚烷基，Z为氢原子或2-4C烯基或炔基，K为2-7的整数，T为 1-7，P为0-3的整数，M为含硅化合物的质均分子量为3,000〜1,000,000的数。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2013256587A

公开(公告)日：2013-12-26

申请号：JP2012133191

申请日：2012-06-12

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： TAKENOUCHI HIROMI ,  MATSUMOTO TAKUYA ,  SUEYOSHI TAKASHI

IPC: C08J5/18 ,  C08L83/05 ,  C08L83/07

Abstract: PROBLEM TO BE SOLVED: To provide a curable composition capable of obtaining the corresponding cured product with hardness and adhesiveness, and supressed in development of debonding and cracks even if heated to 260°C as a lead-free solder reflow temperature, thus maintaining its own adhesiveness.SOLUTION: A curable composition comprises: (A) a siloxane compound having in the molecule at least three SiH groups; (B) a siloxane compound having in the molecule at least two alkenyl groups reactive with SiH group; and (C) a hydrosilylating catalyst. In this curable composition, the molar ratio of the SiH groups to the alkenyl groups reactive with the SiH groups is 2-15; and the excess amount of the content of the SiH groups based on that of the alkenyl groups reactive with the SiH groups is at least 2 mmol/g.

Abstract translation: 要解决的问题：提供一种能够获得相应的硬化和粘合性的固化产物的固化性组合物，即使加热至260℃，因此无需维持其自身的温度，因此在剥离和裂纹的开发中被抑制 粘合性。解决方案：可固化组合物包含：（A）在分子中具有至少三个SiH基团的硅氧烷化合物; （B）在分子中具有至少两个与SiH基反应的烯基的硅氧烷化合物; 和（C）氢化硅烷化催化剂。 在该可固化组合物中，SiH基与与SiH基反应的烯基的摩尔比为2-15; 并且基于与SiH基反应的烯基的SiH基的含量的过量为至少2mmol / g。

公开(公告)号：JP2010100758A

公开(公告)日：2010-05-06

申请号：JP2008274294

申请日：2008-10-24

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: C08L83/05 ,  C08L83/07

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which eliminates cissing to have sufficient adhesion even to a polyimide resins and is suitably used as an electric or electronic material, particularly as a sealing medium for luminous elements.
SOLUTION: The silicon-containing curable composition contains: a compound (H-2) having two or more Si-H groups in the molecule, obtained by the hydrosilylation of a compound (V-1) represented by formula (1) (wherein R
1 is a 2-10C organic group having a carbon-carbon double bond having reactivity with an Si-H group and R
2 is a 1-10C organic group) and a compound (H-1) having two or more Si-H groups in the molecule; a prepolymer (V-3) having two or more carbon-carbon double bonds having reactivity with an Si-H group in the molecule, obtained by the hydrosilylation of a cyclic siloxane compound (V-2) having two or more carbon-carbon double bonds reactive with an Si-H group in the molecule and/or the compound (V-2) and a compound (H-3) having two or more Si-H groups in the molecule; and a hydrosilylation catalyst.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种除了可以使聚酰亚胺树脂具有足够的粘附性而能够消除咀嚼的含硅可固化组合物，并且适合用作电气或电子材料，特别是用作发光元件的密封介质。 解决方案：含硅可固化组合物包含：通过由式（1）表示的化合物（V-1）的氢化硅烷化得到的分子中具有两个或更多个Si-H基团的化合物（H-2） （其中R 1 是具有与Si-H基具有反应性的碳 - 碳双键的2-10C有机基团，R 2 是1-10C有机基团 ）和在分子中具有两个或更多个Si-H基团的化合物（H-1）; 通过具有两个或多个碳 - 碳双键的环状硅氧烷化合物（V-2）的氢化硅烷化获得具有两个或多个与分子中的Si-H基具有反应性的碳 - 碳双键的预聚物（V-3） 与分子中的Si-H基团和/或化合物（V-2）和在分子中具有两个或更多个Si-H基团的化合物（H-3）反应的键; 和氢化硅烷化催化剂。 版权所有（C）2010，JPO＆INPIT