Abstract:
A method includes forming a plurality of functional features (210, 410) on a semiconductor layer (205, 405) in a first region. A non-functional feature (240, 415) corresponding to the functional feature (210, 410) is formed adjacent at least one of the functional features (210, 410) disposed on a periphery of the region. A stress- inducing layer (300, 500) is formed proximate the functional features (210, 410) and the non-functional feature (240, 415). A device (200, 400) includes a semiconductor layer (205, 405), a plurality of transistor elements (210, 410), a first dummy gate electrode (240A, 415A), and a stress-inducing layer (300, 500). The plurality of transistor elements (210, 410) is formed above the semiconductor layer (205, 405). The plurality includes at least a first end transistor element (210A, 410A), a second end transistor element (210D, 410C), and at least one interior transistor element (210B, 21 OC, 410B). The first dummy gate electrode (240A, 415A) is disposed proximate the first end transistor element (210A, 415A). The stress-inducing layer (300, 500) is disposed proximate the plurality of transistor elements (210, 410) and the first dummy gate electrode (240A, 415A).
Abstract:
A floating gate diode which can be used as a sourceless memory cell, and which may be arranged into an array of memory cells is disclosed. The floating gate diode comprises: a drain region (64) formed in a substrate (62); an oxide overlying and associated with the drain region (64); and a floating gate (66) overlying the oxide. Upon application of a voltage to the drain (64), a current between the drain (64) and substrate (62) is induced in proportion to an amount of electrons stored on the gate. The cells may be arranged into an array which comprises a substrate having a surface; a plurality of drain regions, one of said drain regions respectively corresponding to one of the plurality of cells, formed in the substrate; an oxide region overlying the plurality of drain regions on the surface of the substrate; and a plurality of floating gates overlying the oxide and respectively associated with the plurality of drain regions.
Abstract:
A system and method for providing a very short channel memory cell having a double diffuse implant junction is disclosed. The system and method comprise the sequential steps of providing a junction implant (110), providing a spacer (108), and providing a double diffuse implant (112). Because the double diffuse implant is provided after the spacer, the double diffuse implant does not extend as far under the gate of a memory cell after processing. Thus, the memory cell has a graded junction that does not substantially shorten the effective length of the channel. The memory cell can, therefore, function even as the size of the memory cell is decreased. In addition, the thermal cycling of the double diffuse implant may be decoupled from that of the junction implant. This is achieved without complicating processing. Consequently, overall system performance is enhanced.
Abstract:
A system and method for providing a very short channel memory cell having a double diffuse implant junction is disclosed. The system and method comprise the sequential steps of providing a junction implant (110), providing a spacer (108), and providing a double diffuse implant (112). Because the double diffuse implant is provided after the spacer, the double diffuse implant does not extend as far under the gate of a memory cell after processing. Thus, the memory cell has a graded junction that does not substantially shorten the effective length of the channel. The memory cell can, therefore, function even as the size of the memory cell is decreased. In addition, the thermal cycling of the double diffuse implant may be decoupled from that of the junction implant. This is achieved without complicating processing. Consequently, overall system performance is enhanced.
Abstract:
A system and method for providing a very short channel memory cell having a double diffuse implant junction is disclosed. The system and method comprise the sequential steps of providing a junction implant (110), providing a spacer (108), and providing a double diffuse implant (112). Because the double diffuse implant is provided after the spacer, the double diffuse implant does not extend as far under the gate of a memory cell after processing. Thus, the memory cell has a graded junction that does not substantially shorten the effective length of the channel. The memory cell can, therefore, function even as the size of the memory cell is decreased. In addition, the thermal cycling of the double diffuse implant may be decoupled from that of the junction implant. This is achieved without complicating processing. Consequently, overall system performance is enhanced.