公开(公告)号：GB2442391B

公开(公告)日：2010-12-08

申请号：GB0800312

申请日：2006-04-19

Applicant: ADVANCED MICRO DEVICES INC

Inventor： MASTER RAJ N ,  ANNAD SRINIVASAN ASHOK ,  PARTHASARATHY SRINIVASAN ,  MUI YEW CHEONG

IPC: H01L21/60 ,  B23K35/26 ,  C22C13/02 ,  H01L23/498 ,  H05K3/34

Abstract: A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

公开(公告)号：GB2442391A

公开(公告)日：2008-04-02

申请号：GB0800312

申请日：2006-04-19

Applicant: ADVANCED MICRO DEVICES INC

Inventor： MASTER RAJ N ,  ANNAD SRINIVASAN ASHOK ,  PARTHASARATHY SRINIVASAN ,  MUI YEW CHEONG

IPC: H01L21/60 ,  B23K35/26 ,  C22C13/02 ,  H01L23/498 ,  H05K3/34

Abstract: A package substrate (4) includes die solder pads (3) and pin solder fillets (5). The pin solder fillets (5) might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads (3) might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads (3) might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

公开(公告)号：DE112006001732T5

公开(公告)日：2008-05-21

申请号：DE112006001732

申请日：2006-04-19

Applicant: ADVANCED MICRO DEVICES INC

Inventor： MASTER RAJ N ,  ANNAD SRINIVASAN ASHOK ,  PARTHASARATHY SRINIVASAN ,  MUI YEW CHEONG

IPC: H01L21/60 ,  B23K35/26 ,  C22C13/00 ,  H01L23/498

Abstract: A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

公开(公告)号：WO2007001598A3

公开(公告)日：2007-03-15

申请号：PCT/US2006014625

申请日：2006-04-19

Applicant: ADVANCED MICRO DEVICES INC ,  MASTER RAJ N ,  ANNAD SRINIVASAN ASHOK ,  PARTHASARATHY SRINIVASAN ,  MUI YEW CHEONG

Inventor： MASTER RAJ N ,  ANNAD SRINIVASAN ASHOK ,  PARTHASARATHY SRINIVASAN ,  MUI YEW CHEONG

IPC: H01L21/60 ,  B23K35/26 ,  C22C13/00 ,  H01L23/498

CPC classification number: C22C13/02 ,  B23K35/262 ,  H01L23/49811 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19105 ,  H05K3/3463 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2203/047 ,  H01L2224/81 ,  H01L2224/0401

Abstract: A package substrate (4) includes die solder pads (3) and pin solder fillets (5). The pin solder fillets (5) might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads (3) might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads (3) might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

Abstract translation: 封装衬底（4）包括管芯焊盘（3）和管脚焊料圆角（5）。 销焊脚（5）可以包含约90重量％至约99重量％的锡和约10重量％至1重量％的锑。 裸片焊盘（3）可以包括约4重量％至约8重量％的铋，约2重量％至约4重量％的银，约0重量％至约0.7重量％的铜和约87重量％至约 92重量％的锡。 裸片焊盘（3）可包括约7重量％至约20重量％的铟，约2重量％至约4.5重量％的银，约0重量％至约0.7重量％的铜，约0重量％ 至约0.5重量％的锑，以及约74.3重量％至约90重量％的锡。