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    METHOD FOR MELTING METAL
    4.
    发明专利
    METHOD FOR MELTING METAL 失效

    公开(公告)号：JPH0421726A

    公开(公告)日：1992-01-24

    申请号：JP12454390

    申请日：1990-05-15

    Applicant: AGENCY IND SCIENCE TECHN

    Inventor： NAKAO YUKIMICHI ,  KAERIYAMA KYOJI ,  YAMAUCHI AIZO

    IPC: C22B9/10 ,  C22B3/04

    Abstract: PURPOSE:To melt metals by a simple operation by bringing metals into contact with soluble halogenated salt, a halogen simple substance and a polar solvent. CONSTITUTION:Metals (typical metals and transition metals) are brought into contact with a halogen simple substance, soluble halogenated salt and a solvent constituted of at least either of water and a polar organic solvent, and melting is executed. Furthermore, as the soluble halogenated salt, sodium iodide, potassium bromide or the like are used by an equivalent mol or above to that of the metals to be melted, and as the halogen simple substance, chlorine, bromine and iodine are used by an molar amt. 0.5 times or above. Moreover, as the polar organic solvent, methanol, acetone, acetonitrile or the like are used. In this way, various metals can easily be melted.

    COLORING BY NOBLE METAL SALT
    5.
    发明专利
    COLORING BY NOBLE METAL SALT 失效

    公开(公告)号：JPH02154063A

    公开(公告)日：1990-06-13

    申请号：JP30209488

    申请日：1988-11-29

    Applicant: AGENCY IND SCIENCE TECHN

    Inventor： NAKAO YUKIMICHI ,  KAERIYAMA KYOJI ,  YAMAUCHI AIZO

    IPC: D06M11/00 ,  D06M11/83 ,  D06Q1/04

    Abstract: PURPOSE:To carry out coloring having excellent wear resistance and falling resistance and high value added free from change of color and fading by treating the surface of silk fiber, etc., with an aqueous solution of a noble metal and heat-treating the surface wholly or according to a given pattern to seal the noble metal to the surface. CONSTITUTION:The solid surface of silk fiber, cellulose fiber, etc., is treated with an aqueous solution of a noble metal comprising a water-soluble noble metal salt such as chloroauric acid, sodium chloroaurate, silver nitrate, palladium chloride, chloroplatinic acid or sodium chlororhodic acid and then the surface is heat-treated. In the operation, only part of a desired pattern shape is heat- treated according to the desired pattern shape and the novel metal salt left on the unheat-treated part is removed.

    METAL PLATING METHOD USING SILVER HYDROSOL
    6.
    发明专利
    METAL PLATING METHOD USING SILVER HYDROSOL 失效

    公开(公告)号：JPS6468478A

    公开(公告)日：1989-03-14

    申请号：JP22370887

    申请日：1987-09-07

    Applicant: AGENCY IND SCIENCE TECHN ,  TODA KOGYO CORP

    Inventor： NAKAO YUKIMICHI ,  KAERIYAMA KYOJI ,  YAMAUCHI AIZO ,  IMAI TOMOYUKI ,  HORIISHI NANAO ,  IGARASHI HIROSHI

    IPC: C23C18/18 ,  C23C18/30

    Abstract: PURPOSE:To uniformly form a plating film having high adhesive power by bringing a silver hydrosol into contact with a material to be plated to apply silver colloid thereto and subjecting a metal to chemical plating with this colloid as a catalyst at the time of forming a metal plating on the surface of an insulating material. CONSTITUTION:The silver hydrosol is formed by adding 1 or >=2 kinds among a cationic surfactant, anionic surfactant, nonionic surfactant or water soluble high polymers such as polyvinyl alcohol to an aq. soln. dissolved with a water soluble silver compd. such as silver nitrate and adding a reducing agent such as sodium borohydride, then stirring the mixture to effect reaction. The material to be plated consisting of insulators such as ceramics and fiber compsn. is immersed therein to apply the silver colloid on the surface thereof. This material is immersed into the chemical plating liquid of Cu, Ag, Co, etc., so that the secure plating film of Cu, Ag, Co, etc., is chemically plated at a low cost on the surface of the material to be plated to a uniform thickness with the silver colloid as a catalyst.

    PALLADIUM-QUATERNARY AMMONIUM COMPOUND ADDUCT
    7.
    发明专利
    PALLADIUM-QUATERNARY AMMONIUM COMPOUND ADDUCT 失效

    公开(公告)号：JPS63101349A

    公开(公告)日：1988-05-06

    申请号：JP24856586

    申请日：1986-10-17

    Applicant: AGENCY IND SCIENCE TECHN

    Inventor： NAKAO YUKIMICHI ,  KAERIYAMA KYOJI ,  SUDA MASAO

    IPC: B01J23/44 ,  C07B61/00 ,  C07C211/63 ,  C07D213/20 ,  C07F15/00

    Abstract: NEW MATERIAL:A palladium-quaternary ammonium compound adduct expressed by formula I (RidenticalN is trilower alkylamino or pyridyl; R' is 6-22C alkyl; X is halogen). EXAMPLE:A compound expressed by formula II. USE:Useful for producing highly active palladium catalysts, the purpose of forming palladium coating layers on solids or adsorbing the palladium catalysts on porous carriers, etc., capable of forming solutions by dissolving in organic solvents and directly usable or depositing as metal by coating, drying the solutions and reducing the dried film with a reducing agent. PREPARATION:A water-soluble palladium complex compound is dissolved in water and an aqueous solution of a cationic surfactant expressed by formula II (Y is a group forming anion, e.g. halogen, methylsulfuric acid) is added and reacted therewith. The formed precipitates are separated by filtration, extraction, etc., to afford the aimed compound expressed by formula I.

    FORMATION OF METALLIC PATTERN ON SURFACE OF SYNTHETIC RESIN
    8.
    发明专利
    FORMATION OF METALLIC PATTERN ON SURFACE OF SYNTHETIC RESIN 失效

    公开(公告)号：JPS627872A

    公开(公告)日：1987-01-14

    申请号：JP14622885

    申请日：1985-07-03

    Applicant: AGENCY IND SCIENCE TECHN

    Inventor： NAKAO YUKIMICHI ,  KAERIYAMA KYOJI ,  SUDA MASAO

    IPC: C23C18/20 ,  C23C18/16 ,  C23C18/30 ,  C23C18/31 ,  C23C18/32 ,  C23C18/34 ,  C23C18/40 ,  H05K1/03 ,  H05K3/18

    Abstract: PURPOSE:To form a metallic pattern available in the manufacture of a wiring board on the surface of resin with a simple operation by exposing cellulose fiber packed in a molded body of synthetic resin, immersing this in palladium hydrogel and thereafter performing electroless plating thereon. CONSTITUTION:Cellulose fiber is exposed according to a prescribed pattern from the surface of a molded body of synthetic resin such as phenolic resin and melamine resin which is uniformly packed with cellulose fiber such as paper and pulp. Therefor the resin may be cut, abraded and disconnected for example by using a cutter and a file of a hard material made of steel. After washing a molded body of synthetic resin wherein cellulose fiber is exposed in the prescribed part with an organic solvent such as ethanol and washing it with water, it is immersed in palladium hydrosol having 0.01-5mg-atom/l Pd concn. Normally for >=1 minute. Then after washing the resin molded body subjected to the immersion treatment with water, it is immersed in an electroless plating bath to form a metallic pattern on the resin molded body. In such a method, the metallic pattern can be formed on the resin molded body in a simple operation without using a resist and an etching operation.

    METHOD FOR PLATING MOLDED BODY OF POLYETHYLENE TEREPHTHALATE WITH METAL
    9.
    发明专利
    METHOD FOR PLATING MOLDED BODY OF POLYETHYLENE TEREPHTHALATE WITH METAL 失效

    公开(公告)号：JPS621876A

    公开(公告)日：1987-01-07

    申请号：JP14078985

    申请日：1985-06-27

    Applicant: AGENCY IND SCIENCE TECHN ,  TODA KOGYO CORP

    Inventor： NAKAO YUKIMICHI ,  KAERIYAMA KYOJI ,  SUDA MASAO ,  IMAI TOMOYUKI ,  HORIISHI NANAO

    IPC: C23C18/20 ,  C23C18/28 ,  C23C18/30

    Abstract: PURPOSE:To simply form a metallic film having superior adhesion by plating with high reproducibility by etching a molded body of polyethylene terephthalate and immersing it in palladium hydrosol contg. a cationic surfactant. CONSTITUTION:A molded body of polyethylene terephthalate is etched by immersion in an aqueous soln. of an alkali metallic hydride for >=about 10min. the molded body is then immersed in palladium hydrosol contg. a cationic surfactant to stick palladium colloid to the surface of the molded body. About 0.002-0.1% stearyltrimethylammonium chloride is preferably used as the surfactant. The palladium hydrosol contains bout 0.1-2mg atom/l Pd and the immersion is preferably carried out at room temp.-about 100 deg.C for >=about 1min. The molded body is pulled up, washed and chemically plated by a conventional method.

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