公开(公告)号：MY179941A

公开(公告)日：2020-11-19

申请号：MYPI2015000887

申请日：2013-10-09

Applicant: ALPHA METALS ,  ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/26

Abstract: A lead-free, antimony-free solder alloy comprising: (a) 10 wt.% or less of silver (b) 10 wt.% or less of bismuth (c) 3 wt.% or less of copper (d) at least one of the following elements up to 1 wt.% of nickel up to 1 wt.% of titanium up to 1 wt.% of cobalt up to 3.5 wt.% of indium up to 1 wt.% of zinc up to 1 wt.% of arsenic (e) optionally one or more of the following elements 0 to 1 wt.% of manganese,0 to 1 wt. % of chromium 0 to 1 wt.% of germanium, 0 to 1 wt.% of iron, 0 to 1 wt.% of aluminum, 0 to 1 wt.% of phosphorus, 0 to 1 wt.% of gold, 0 to 1 wt.% of gallium, 0 to 1 wt.% of tellurium, 0 to 1 wt.% of selenium, 0 to 1 wt.% of calcium, 0 to 1 wt.% of vanadium, 0 to 1 wt.% of molybdenum, 0 to 1 wt.% of platinum, 0 to 1 wt.% of magnesium, 0 to 1 wt.% of rare earths, (f) the balance tin, together with any unavoidable impurities. (Fig.1)

公开(公告)号：SG11201502567TA

公开(公告)日：2015-05-28

申请号：SG11201502567T

申请日：2013-10-29

Applicant: ALPHA METALS

Inventor： GHOSAL SHAMIK ,  PANDHER RANJIT ,  KHASELEV OSCAR ,  BHATKAL RAVI ,  RAUT RAHUL ,  SINGH BAWA ,  RIBAS MORGANA ,  SARKAR SIULI ,  MUKHERJEE SUTAPA ,  KUMAR SATHISH ,  CHANDRAN REMYA ,  VISHWANATH PAVAN ,  PACHAMUTHU ASHOK ,  BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  CHAKI NIRMALYA KUMAR

IPC: C01G5/00 ,  B22F1/00 ,  B22F7/08 ,  B22F9/24 ,  C09C1/62 ,  C09C3/08 ,  C21C1/04

Abstract: A sintering powder comprising:a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.

公开(公告)号：SG11201401482UA

公开(公告)日：2014-06-27

申请号：SG11201401482U

申请日：2013-10-09

Applicant: ALPHA METALS

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K35/26 ,  B23K35/02

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.