公开(公告)号：WO2016012754A3

公开(公告)日：2016-05-06

申请号：PCT/GB2015052036

申请日：2015-07-15

Applicant: ALPHA METALS ,  SETNA ROHAN P

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVINDRA ,  SINGH BAWA

IPC: C22C13/00 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  B23K35/00 ,  B23K35/02 ,  B23K35/26 ,  C22C13/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/085 ,  B23K35/00 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K2201/40 ,  B23K2201/42 ,  C22C13/00 ,  C22C13/02 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29117 ,  H01L2224/29123 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29149 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29163 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29172 ,  H01L2224/2918 ,  H01L2224/83815 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01034 ,  H01L2924/01052 ,  H01L2924/01058

Abstract: A lead-free, antimony-free solder alloy comprising: (a) from 1 to 4 wt.% silver (b) from 0.5 to 6 wt.% bismuth (c) from 3.55 to 15 wt.% indium (d) 3 wt.% or less of copper (e) optionally one or more of the following elements 0 to 1 wt.% nickel 0 to 1 wt.% of titanium 0 to 1 wt.% manganese 0 to 1 wt.% of rare earths, such as cerium 0 to 1 wt.% of chromium 0 to 1 wt.% germanium 0 to 1 wt.% of gallium 0 to 1 wt.% of cobalt 0 to 1 wt.% of iron 0 to 1 wt.% of aluminum 0 to 1 wt.% of phosphorus 0 to 1 wt.% of gold 0 to 1 wt.% of tellurium 0 to 1 wt.% of selenium 0 to 1 wt.% of calcium 0 to 1 wt.% of vanadium 0 to 1 wt.% of molybdenum 0 to 1 wt.% of platinum 0 to 1 wt.% of magnesium (f) the balance tin, together with any unavoidable impurities.

Abstract translation: 一种无铅，无锑焊料合金，其包含：（a）1至4重量％的银（b）0.5至6重量％的铋（c）3.55至15重量％的铟（d）3重量％ 。％或更少的铜（e）任选一种或多种以下元素0至1重量％的镍0至1重量％的钛0至1重量％的锰0至1重量％的稀土，例如 作为铈0至1重量％的铬0至1重量％的锗0至1重量％的镓0至1重量％的钴0至1重量％的铁0至1重量％的铝0 至1重量％的磷0至1重量％的金0至1重量％的碲0至1重量％的硒0至1重量％的钙0至1重量％的钒0至1 钼的重量百分比为0至1重量％的铂0至1重量％的镁（f）余量为锡，以及任何不可避免的杂质。

公开(公告)号：SG11201600866TA

公开(公告)日：2016-03-30

申请号：SG11201600866T

申请日：2014-08-29

Applicant: ALPHA METALS

Inventor： PANDHER RANJIT ,  SINGH BAWA ,  RAUT RAHUL ,  SANYOGITA ARORA ,  BHATKAL RAVINDRA ,  MO BIN

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/36 ,  B23K35/362

公开(公告)号：MX2016002429A

公开(公告)日：2016-06-24

申请号：MX2016002429

申请日：2014-08-29

Applicant: ALPHA METALS

Inventor： SINGH BAWA ,  PANDHER RANJIT ,  RAUT RAHUL ,  SANYOGITA ARORA ,  BHATKAL RAVINDRA ,  MO BIN

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/36 ,  B23K35/362

Abstract: Un fundente que comprende una o más aminas.

公开(公告)号：MY179941A

公开(公告)日：2020-11-19

申请号：MYPI2015000887

申请日：2013-10-09

Applicant: ALPHA METALS ,  ALPHA ASSEMBLY SOLUTIONS INC

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K1/00 ,  B23K3/06 ,  B23K35/02 ,  B23K35/26

Abstract: A lead-free, antimony-free solder alloy comprising: (a) 10 wt.% or less of silver (b) 10 wt.% or less of bismuth (c) 3 wt.% or less of copper (d) at least one of the following elements up to 1 wt.% of nickel up to 1 wt.% of titanium up to 1 wt.% of cobalt up to 3.5 wt.% of indium up to 1 wt.% of zinc up to 1 wt.% of arsenic (e) optionally one or more of the following elements 0 to 1 wt.% of manganese,0 to 1 wt. % of chromium 0 to 1 wt.% of germanium, 0 to 1 wt.% of iron, 0 to 1 wt.% of aluminum, 0 to 1 wt.% of phosphorus, 0 to 1 wt.% of gold, 0 to 1 wt.% of gallium, 0 to 1 wt.% of tellurium, 0 to 1 wt.% of selenium, 0 to 1 wt.% of calcium, 0 to 1 wt.% of vanadium, 0 to 1 wt.% of molybdenum, 0 to 1 wt.% of platinum, 0 to 1 wt.% of magnesium, 0 to 1 wt.% of rare earths, (f) the balance tin, together with any unavoidable impurities. (Fig.1)

公开(公告)号：CA2843509A1

公开(公告)日：2013-02-07

申请号：CA2843509

申请日：2012-08-02

Applicant: ALPHA METALS

Inventor： PANDHER RANJIT ,  SINGH BAWA ,  SARKAR SIULI ,  CHEGUDI SUJATHA ,  KUMAR ANIL K N ,  CHATTOPADHYAY KAMANIO ,  LODGE DOMINIC ,  DE AVILA RIBAS MORGANA

IPC: B23K35/26 ,  C22C12/00 ,  C22C13/02

Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59 %wt Bi; from 0 to.0 wt% Ag; from 0 to 1.0 %wt Au; from 0 to 1.0 %wt Cr; from 0 to 2.0 %wt In; from 0 to 1.0 %wt P; from 0 to 1.0 %wt Sb; from 0 to 1.0 %wt Sc; from 0 to 1.0 %wt Y; from 0 to 1.0 %wt Zn; from 0 to 1.0 %wt rare earth elements; one or more of: 10 from greater than 0 to 1.0 %wt Al; from 0.01 to 1.0 %wt Ce; from greater than 0 to 1.0 %wt Co; from greater than 0 to.0 %wt Cu; from 0.001 to 1.0 %wt Ge; from greater than 0 to.0 %wt Mg; from greater than 0 to 1.0 %wt Mn; from 0.01 to 1.0 %wt Ni; and from greater than 0 to 1.0 %wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

公开(公告)号：CA2842762A1

公开(公告)日：2013-02-07

申请号：CA2842762

申请日：2012-08-02

Applicant: ALPHA METALS

Inventor： DE AVILA RIBAS MORGANA ,  LODGE DOMINIC ,  PANDHER RANJIT ,  SINGH BAWA ,  BHATKAL RAVINDRA M ,  RAUT RAHUL ,  SARKAR SIULI ,  CHATTOPADHYAY KAMANIO ,  NANDI PROLOY

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36

Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.

公开(公告)号：IN939CHN2014A

公开(公告)日：2015-04-10

申请号：IN939CHN2014

申请日：2014-02-05

Applicant: ALPHA METALS

Inventor： DE AVILA RIBAS MORGANA ,  LODGE DOMINIC ,  PANDHER RANJIT ,  SINGH BAWA ,  BHATKAL RAVINDRA M ,  RAUT RAHUL ,  SARKAR SIULI ,  CHATTOPADHYAY KAMANIO ,  NANDI PROLOY

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/30

Abstract: A solder composition comprising a blend of a first powder component and a second powder component wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.

公开(公告)号：MX2014001204A

公开(公告)日：2014-08-22

申请号：MX2014001204

申请日：2012-08-02

Applicant: ALPHA METALS

Inventor： RIBAS MORGANA DE AVILA ,  LODGE DOMINIC ,  PANDHER RANJIT ,  SINGH BAWA ,  BHATKAL RAVINDRA M ,  RAUT RAHUL ,  CHATTOPADHYAY KAMANIO ,  NANDI PROLOY ,  SARKAR SIULI

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36

Abstract: Una composición de soldadura que comprende una mezcla de un primer componente en polvo y un segundo componente en polvo, en donde el primer componente en polvo es una primera aleación de soldadura y el segundo componente en polvo es una segunda aleación de soldadura o un metal.

公开(公告)号：SG11201401482UA

公开(公告)日：2014-06-27

申请号：SG11201401482U

申请日：2013-10-09

Applicant: ALPHA METALS

Inventor： CHOUDHURY PRITHA ,  DE AVILA RIBAS MORGANA ,  MUKHERJEE SUTAPA ,  KUMAR ANIL ,  SARKAR SIULI ,  PANDHER RANJIT ,  BHATKAL RAVI ,  SINGH BAWA

IPC: B23K35/26 ,  B23K35/02

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

公开(公告)号：SG11201502567TA

公开(公告)日：2015-05-28

申请号：SG11201502567T

申请日：2013-10-29

Applicant: ALPHA METALS

Inventor： GHOSAL SHAMIK ,  PANDHER RANJIT ,  KHASELEV OSCAR ,  BHATKAL RAVI ,  RAUT RAHUL ,  SINGH BAWA ,  RIBAS MORGANA ,  SARKAR SIULI ,  MUKHERJEE SUTAPA ,  KUMAR SATHISH ,  CHANDRAN REMYA ,  VISHWANATH PAVAN ,  PACHAMUTHU ASHOK ,  BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  CHAKI NIRMALYA KUMAR

IPC: C01G5/00 ,  B22F1/00 ,  B22F7/08 ,  B22F9/24 ,  C09C1/62 ,  C09C3/08 ,  C21C1/04

Abstract: A sintering powder comprising:a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.