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公开(公告)号：WO2015179425A3
公开(公告)日：2016-03-17
申请号：PCT/US2015031614
申请日：2015-05-19
Applicant: ALPHA METALS
Inventor： PROKOPIAK STEVEN , TORMEY ELLEN S , KHASELEV OSCAR , MARCZI MICHAEL T , SINGH BAWA
IPC: C09K13/00
CPC classification number: C23F1/16 , C23F1/02 , H01L21/32134 , H01L31/02168 , H01L31/022425 , H01L31/022441 , H01L31/02363 , H01L31/18 , H01L31/1804 , Y02E10/50
Abstract: A jettable etchant composition includes 1 to 90 wt% active ingredient, and a remainder containing any combination of the following: 10 to 90 wt% solvent, 0 to 10 wt% reducing agents,
Abstract translation: 可喷射的蚀刻剂组合物包含1至90重量％的活性成分，其余部分包含以下物质的任意组合：10至90重量％溶剂，0至10重量％还原剂，<1至20重量％酸洗剂，0至5 wt％表面活性剂和0-5wt％消泡剂。 所述组合物还可以包含含有至少一种元素的可溶性化合物，所述元素在溶解时具有比要蚀刻的金属或含有IA族元素的可溶性化合物和可溶性铂族金属更高的标准电极电位。 油墨组合物可以在溶剂体系中包含VA族化合物或IIIA族化合物，所述溶剂体系被配制成以约5至约10皮升的液滴体积喷射在表面上并且实现小于约20Ω/ 激活时表面的α。
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公开(公告)号：WO2015179425A9
公开(公告)日：2016-05-06
申请号：PCT/US2015031614
申请日：2015-05-19
Applicant: ALPHA METALS
Inventor： PROKOPIAK STEVEN , TORMEY ELLEN S , KHASELEV OSCAR , MARCZI MICHAEL T , SINGH BAWA
IPC: C09K13/00
CPC classification number: C23F1/16 , C23F1/02 , H01L21/32134 , H01L31/02168 , H01L31/022425 , H01L31/022441 , H01L31/02363 , H01L31/18 , H01L31/1804 , Y02E10/50
Abstract: A jettable etchant composition includes 1 to 90 wt% active ingredient, and a remainder containing any combination of the following: 10 to 90 wt% solvent, 0 to 10 wt% reducing agents,
Abstract translation: 可喷射蚀刻剂组合物包含1至90重量％的活性成分，余量包含以下任何组合：10至90重量％的溶剂，0至10重量％的还原剂，1至20重量％的酸洗剂，0至5 wt％表面活性剂和0-5wt％消泡剂。 该组合物还可以包括含有至少一种元素的可溶性化合物，当溶解时，具有比被蚀刻金属更高的标准电极电位或含有IA族元素的可溶性化合物和可溶性铂族金属。 油墨组合物可以在溶剂体系中包括VA化合物或IIIA族化合物，配制成在约5至约10微摩尔的液滴体积的表面上可喷射，并获得小于约20Ω/ 激活后表面的α。
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3.发明申请COMPOSITE AND MULTILAYERED SILVER FILMS FOR JOINING ELECTRICAL AND MECHANICAL COMPONENTS 审中-公开用于连接电气和机械组件的复合和多层银膜
公开(公告)号：WO2015031801A3
公开(公告)日：2015-11-19
申请号：PCT/US2014053489
申请日：2014-08-29
Applicant: ALPHA METALS
Inventor： KHASELEV OSCAR , MO BIN , BOUREGHDA MONNIR , MARCZI MICHAEL T , SINGH BAWA
IPC: B32B5/16
Abstract: Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.
Abstract translation: 用于芯片附着的材料例如银烧结膜可以包括增强，改性颗粒以提高性能。 模具附着的方法可能涉及这些材料。
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公开(公告)号：HK1163598A1
公开(公告)日：2012-09-14
申请号：HK12104052
申请日：2012-04-24
Applicant: ALPHA METALS
Inventor： PARASHAR SACHIN , SARKAR SIULI , KHASELEV OSCAR , LEWIS BRIAN , MARCZI MICHAEL , SINGH BAWA , DESAI NITIN , LIBERATORE MICHAEL
IPC: C09D20060101 , B22F20060101 , H01B20060101 , H01L20060101
Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards. The particles, in particular silver particles are produced by a process comprising, mixing a metal or a metal salt with a capping agent in a single phase solution; and adding a reducing agent to the single phase solution to produce capped nanoparticles.
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Patent Agency Ranking
公开(公告)号：ES2612734T3
公开(公告)日：2017-05-18
申请号：ES07872304
申请日：2008-03-18
Applicant: ALPHA METALS
Inventor： KHASELEV OSCAR , DESAI NITIN , MARCZI MICHAEL , SINGH BAWA
Abstract: Un método para producir una placa de circuito impreso que comprende: un sustrato; y al menos un patrón conductor de alta relación de aspecto dispuesto sobre el sustrato, caracterizado por que el patrón conductor de alta relación de aspecto tiene una altura que es al menos cinco veces mayor que la anchura, y por que el método comprende: imprimir un material conductor entre una separación definida de un soporte polimérico sobre el sustrato; imprimir el material de soporte polimérico sobre el soporte polimérico; imprimir material conductor adicional entre la separación definida del soporte polimérico; sinterizar el material conductor; y después de la sinterización, retirar el soporte polimérico para proporcionar el patrón conductor de alta relación de aspecto.
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公开(公告)号：SG11201502567TA
公开(公告)日：2015-05-28
申请号：SG11201502567T
申请日：2013-10-29
Applicant: ALPHA METALS
Inventor： GHOSAL SHAMIK , PANDHER RANJIT , KHASELEV OSCAR , BHATKAL RAVI , RAUT RAHUL , SINGH BAWA , RIBAS MORGANA , SARKAR SIULI , MUKHERJEE SUTAPA , KUMAR SATHISH , CHANDRAN REMYA , VISHWANATH PAVAN , PACHAMUTHU ASHOK , BOUREGHDA MONNIR , DESAI NITIN , LIFTON ANNA , CHAKI NIRMALYA KUMAR
Abstract: A sintering powder comprising:a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.
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公开(公告)号：SG11201601437UA
公开(公告)日：2016-03-30
申请号：SG11201601437U
申请日：2014-08-29
Applicant: ALPHA METALS
Inventor： KHASELEV OSCAR , MO BIN , BOUREGHDA MONNIR , MARCZI MICHAEL T , SINGH BAWA
IPC: B32B5/16
Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.
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公开(公告)号：EP3146015A4
公开(公告)日：2018-05-16
申请号：EP15796809
申请日：2015-05-19
Applicant: ALPHA METALS
Inventor： PROKOPIAK STEVEN , TORMEY ELLEN S , KHASELEV OSCAR , MARCZI MICHAEL T , SINGH BAWA
IPC: C09K13/00 , C23F1/02 , C23F1/16 , C23F1/20 , C23F1/30 , H01L21/3213 , H01L31/0224 , H01L31/18
CPC classification number: C23F1/16 , C23F1/02 , H01L21/32134 , H01L31/02168 , H01L31/022425 , H01L31/022441 , H01L31/02363 , H01L31/18 , H01L31/1804 , Y02E10/547 , Y02P70/521
Abstract: A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents,
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9.发明公开COMPOSITE AND MULTILAYERED SILVER FILMS FOR JOINING ELECTRICAL AND MECHANICAL COMPONENTS 审中-公开用于连接电气和机械组件的复合材料和多层银膜
公开(公告)号：EP3038824A4
公开(公告)日：2017-05-10
申请号：EP14841100
申请日：2014-08-29
Applicant: ALPHA METALS
Inventor： KHASELEV OSCAR , MO BIN , BOUREGHDA MONNIR , MARCZI MICHAEL T , SINGH BAWA
IPC: B32B5/16
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