Abstract:
A programmable logic device (PLD) includes a delay circuit and a body-bias generator. The delay circuit has a delay configured to represent a delay of user circuit implement in the PLD. The body-bias generator is configured to adjust the body bias of a transistor within the user circuit. The body-bias generator adjusts the body bias of the transistor in response to a level derived from the signal propagation delay of the delay circuit.
Abstract:
Integrated circuits are provided that have sensitive circuitry such as programmable polysilicon fuses (56). Electrostatic discharge (ESD) protection circuitry (40) is provided that prevents damage or undesired programming of the sensitive circuitry in the presence of an electrostatic discharge event. The electrostatic discharge protection circuitry may have a power ESD device (44) that limits the voltage level across the sensitive circuitry to a maximum voltage and that draws current away from the sensitive circuitry when exposed to ESD signals. The electrostatic discharge protection circuitry may also have an ESD margin circuit (42) that helps to prevent current flow through the sensitive circuitry when the maximum voltage is applied across the sensitive circuitry.
Abstract:
A programmable logic device (PLD) includes mechanisms for adjusting or setting the body bias of one or more transistors. The PLD includes a body-bias generator. The body-bias generator is configured to set a body bias of one or more transistors within the programmable logic device. More specifically, the body-bias generator sets the body bias of the transistor(s) so as to trade off performance and power consumption of the transistor(s).
Abstract:
A configuration memory cell ("CRAM") for a field programmable gate array ("FPGA") integrated circuit ("IC") device is given increased resistance to single event upset ("SEU"). A portion of the gate structure of the input node of the CRAM is increased in size relative to the nominal size of the remainder of the gate structure. Part of the enlarged gate structure is located capacitively adjacent to an N-well region of the IC, and another part is located capacitively adjacent to a P-well region of the IC. This arrangement gives the input node increased capacitance to resist SEU, regardless of the logical level of the input node. The invention is also applicable to any node of any type of memory cell for which increased resistance to SEU is desired.
Abstract:
A configuration memory cell ("CRAM") for a field programmable gate array ("FPGA") integrated circuit ("IC") device is given increased resistance to single event upset ("SEU"). A portion of the gate structure of the input node of the CRAM is increased in size relative to the nominal size of the remainder of the gate structure. Part of the enlarged gate structure is located capacitively adjacent to an N-well region of the IC, and another part is located capacitively adjacent to a P-well region of the IC. This arrangement gives the input node increased capacitance to resist SEU, regardless of the logical level of the input node. The invention is also applicable to any node of any type of memory cell for which increased resistance to SEU is desired.
Abstract:
PROBLEM TO BE SOLVED: To provide faster techniques for configuring field programmable gate arrays, and to provide ways to adequately secure user designs during the configuration process. SOLUTION: Volatile and non-volatile programmable logic are combined into one integrated circuit (IC). The IC is segregated into two portions. A first block of programmable logic is configured by bits stored in on-chip non-volatile memory. A second block of programmable logic is configured by bits stored in off-chip memory. The function of IO banks on the IC is multiplexed between the two logic blocks of the IC. The programmable logic in the first block can be fully functional in a fraction of the time that the programmable logic in the second block can be configured. The programmable logic in the first block can configure fast enough and have enough independence to assist in the configuration of the second block. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an improved configuration random access memory. SOLUTION: A memory element has: an address transistor including a gate connected to an address line, a first source-drain connected to a data line and a second source-drain connected to a data node; a capacitor connected between a capacitor ground terminal and the second source-drain; and first and second cross-coupled inverters, the first inverter including an output connected to the data node and an input, and the second inverter including an input connected to the data node and an output. COPYRIGHT: (C)2008,JPO&INPIT