Abstract:
PROBLEM TO BE SOLVED: To provide a method reducing soft error rates by stabilizing a configuration memory cell in a programmable logic device. SOLUTION: The configuration memory cell in the programmable logic device comprises: a pair of cross-coupling inverters, connected between the input terminal of a programmable logic device memory cell and the output terminal thereof, which store programming data; and a stabilizing capacitor connected between the input terminal of the configuration memory cell in the programmable logic device and the output terminal of the programmable logic device memory cell. This stabilizing capacitor acts so that a voltage on the input terminal of the configuration memory cell in the programmable logic device and the output terminal of the configuration memory cell in the programmable logic device is buffered when the memory cell breaks a radiation. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
The core of an IC may be supplied with a reduced voltage by an internal voltage dropping circuit VDC, while the input and output circuits remain compatible with circuits supplied with an unreduced voltage. Alternatively, the IC may be supplied with reduced voltage, and the input can be configured to accept signals from circuits supplied with the reduced voltage (figure 4), or from circuits supplied with the unreduced voltage (figure 5). When the IC is supplied with reduced voltage, an output driver (figure 9a) may be protected against leakage currents by applying a boosted voltage, e.g. from a voltage pump, to some driver nodes. The same IC design may be used in different operating modes depending on the option selected by metal masks, by fuses, or by EEPROM, EPROM, or SRAM cells.
Abstract:
An output circuit for a programmable circuit with a low voltage core 1310 comprises a level converter 1317 powered from a quiet supply 1335 and feeding an output driver 1323 which is supplied by a noisy supply 1338. The core 1310 is supplied from the quiet supply via a voltage supply down converter 1330 comprising an NMOS transistor 1335 and a CMOS inverting feedback amplifier 1360.
Abstract:
A static, nonvolatile, and reprogrammable programmable interconnect junction cell for implementing programmable interconnect in an integrated circuit. The programmable interconnect junction (600) is programmably configured to couple or decouple a first interconnect line (210) and a second interconnect line (220). The configured state of the programmable interconnect junction is detected directly, and memory cell detection circuitry such as sense amplifiers are not needed during normal operation. Full-rail voltages may be passed from the first interconnect line and the second interconnect line. An interconnect transistor 610 and a memory transistor 635 share a floating gate 620 which is charged via a write transistor 650 and tunnel diode 660 and controlled from a line 670 via a capacitor 680. A read transistor 630 can be used for margin testing.
Abstract:
A configuration memory cell ("CRAM") for a field programmable gate array ("FPGA") integrated circuit ("IC") device is given increased resistance to single event upset ("SEU"). A portion of the gate structure of the input node of the CRAM is increased in size relative to the nominal size of the remainder of the gate structure. Part of the enlarged gate structure is located capacitively adjacent to an N-well region of the IC, and another part is located capacitively adjacent to a P-well region of the IC. This arrangement gives the input node increased capacitance to resist SEU, regardless of the logical level of the input node. The invention is also applicable to any node of any type of memory cell for which increased resistance to SEU is desired.
Abstract:
Reverse conduction through the PMOS pull-up device MP3 is prevented by providing a 5 volt gate potential when MP3 is off. Conduction through the substrate of MP3 is prevented by connecting the substrate to the 5 volt supply instead of to the source of MP3. The output driver may be used in a programmable logic circuit with a logic core operating at 3 volts. The 5 volt supply may be generated on-chip by a voltage pump.
Abstract:
A configuration memory cell ("CRAM") for a field programmable gate array ("FPGA") integrated circuit ("IC") device is given increased resistance to single event upset ("SEU"). A portion of the gate structure of the input node of the CRAM is increased in size relative to the nominal size of the remainder of the gate structure. Part of the enlarged gate structure is located capacitively adjacent to an N-well region of the IC, and another part is located capacitively adjacent to a P-well region of the IC. This arrangement gives the input node increased capacitance to resist SEU, regardless of the logical level of the input node. The invention is also applicable to any node of any type of memory cell for which increased resistance to SEU is desired.
Abstract:
A technique provides an on-chip voltage to a core portion of an integrated circuit by way of a conversion transistor. The on-chip voltage may be a reduced internal voltage, less than the VCC of the integrated circuit. In an embodiment, the layout (or physical structure) of the conversion transistor is distributed surrounding the core portion. By providing the core with a reduced voltage, the integrated circuit may interface with other integrated circuits compatible with different voltage levels.