Packaged microchip with premolded-type package
    1.
    发明专利
    Packaged microchip with premolded-type package 审中-公开
    包装型微型包装

    公开(公告)号:JP2010101900A

    公开(公告)日:2010-05-06

    申请号:JP2009278054

    申请日:2009-12-07

    Abstract: PROBLEM TO BE SOLVED: To provide a packaged microchip with a premolded-type package. SOLUTION: A MEMS (micro electro mechanical systems) inertial sensor 10 is secured within a premolded-type package 12 formed from a low moisture permeable molding material. Consequently, such a motion detector can be produced more economically than those using ceramic packages. To those ends, the package 12 has at least one wall 13 extending from a lead frame 24 to form a cavity, and an isolator 22 within the cavity. The MEMS inertial sensor 10 has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. The contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator 22 forms a space between at least a portion of the bottom substrate surface and the package 12. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供具有预成型包装的封装微芯片。 解决方案:MEMS(微机电系统)惯性传感器10固定在由低透湿成型材料形成的预成型包装12内。 因此,与使用陶瓷封装的那些相比,这样的运动检测器可以比经济地生产。 在这些端部,包装12具有从引线框架24延伸以形成空腔的至少一个壁13和腔内的隔离件22。 MEMS惯性传感器10具有悬挂在具有底面的基板上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 接触面积小于基板底面的表面积。 因此,隔离器22在底部基板表面的至少一部分和封装12之间形成空间。(C)2010,JPO和INPIT

    Bonded wafer optical mems process

    公开(公告)号:AU8138101A

    公开(公告)日:2002-02-18

    申请号:AU8138101

    申请日:2001-08-03

    Abstract: A microelectromechanical system is fabricated from a substrate having a handle layer, a silicon sacrificial layer and a device layer. A micromechanical structure is etched in the device layer and the underlying silicon sacrificial layer is etched away to release the micromechanical structure for movement. One particular micromechanical structure described is a micromirror.

    NON-DEGENERATE MODE MEMS GYROSCOPE
    4.
    发明申请
    NON-DEGENERATE MODE MEMS GYROSCOPE 审中-公开
    非退化模式MEMS陀螺仪

    公开(公告)号:WO2012075338A3

    公开(公告)日:2012-11-08

    申请号:PCT/US2011062961

    申请日:2011-12-01

    CPC classification number: G01C19/5698

    Abstract: Bulk acoustic wave (BAW) gyroscopes purposefully operate using non-degenerate modes, i.e., resonant frequencies of drive and sense modes are controlled so they are not identical. The resonant frequencies differ by a small controlled amount (??). The difference (??) is selected such that the loss of sensitivity, as a result of using non-degenerate modes, is modest. Non-degenerate operation can yield better bandwidth and improves signal-to-noise ratio (SNR) over comparable degenerate mode operation. Increasing Q of a BAW resonator facilitates trading bandwidth for increased SNR, thereby providing a combination of bandwidth and SNR that is better than that achievable from degenerate mode devices. In addition, a split electrode configuration facilitates minimizing quadrature errors in BAW resonators.

    Abstract translation: 体声波(BAW)陀螺仪有意地使用非简并模式进行操作,即,驱动和感测模式的谐振频率被控制,使得它们不相同。 谐振频率相差很小的控制量(??)。 选择差值(Δθ),使得由于使用非退化模式而导致的灵敏度损失是适度的。 非退化操作可以产生更好的带宽,并且与可比退化模式操作相比可提高信噪比(SNR)。 增加体声波谐振器的Q值便于交换带宽以提高SNR,从而提供带宽和SNR的组合,其优于退化模式器件所能实现的带宽和SNR。 另外,分离电极配置有助于最小化BAW谐振器中的正交误差。

    BONDED WAFER OPTICAL MEMS PROCESS
    5.
    发明申请
    BONDED WAFER OPTICAL MEMS PROCESS 审中-公开
    粘结波长光学MEMS工艺

    公开(公告)号:WO0212116A3

    公开(公告)日:2002-04-04

    申请号:PCT/US0141523

    申请日:2001-08-03

    Abstract: A microelectromechanical system is fabricated from a substrate having a handle layer, a silicon sacrificial layer and a device layer. A micromechanical structure is etched in the device layer and the underlying silicon sacrificial layer is etched away to release the micromechanical structure for movement. One particular micromechanical structure described is a micromirror.

    Abstract translation: 由具有手柄层,硅牺牲层和器件层的衬底制造微机电系统。 在器件层中蚀刻微机械结构,并蚀刻掉下面的硅牺牲层以释放用于移动的微机械结构。 所描述的一个特定的微机械结构是微镜。

    MEMS SENSOR WITH MOVABLE Z-AXIS SENSING ELEMENT
    6.
    发明申请
    MEMS SENSOR WITH MOVABLE Z-AXIS SENSING ELEMENT 审中-公开
    具有可移动的Z轴感测元件的MEMS传感器

    公开(公告)号:WO2010027600A2

    公开(公告)日:2010-03-11

    申请号:PCT/US2009052964

    申请日:2009-08-06

    CPC classification number: G01P15/125 G01P15/0802 G01P15/18 G01P21/00

    Abstract: A MEMS sensor includes a substrate and a MEMS structure coupled to the substrate. The MEMS structure has a mass movable with respect to the substrate. The MEMS sensor also includes a reference structure positioned radially outward from the MEMS structure. The reference structure is used to provide a reference to offset any environmental changes that may affect the MEMS sensor in order to increase the accuracy of its measurement.

    Abstract translation: MEMS传感器包括衬底和耦合到衬底的MEMS结构。 MEMS结构具有相对于基板可移动的质量。 MEMS传感器还包括从MEMS结构径向向外定位的参考结构。 参考结构用于提供参考,以抵消可能影响MEMS传感器的任何环境变化,以提高其测量精度。

    MICROPHONE WITH PRESSURE RELIEF
    7.
    发明申请
    MICROPHONE WITH PRESSURE RELIEF 审中-公开
    麦克风与压力消除

    公开(公告)号:WO2008089328A9

    公开(公告)日:2008-09-25

    申请号:PCT/US2008051310

    申请日:2008-01-17

    Abstract: A microphone has a movable diaphragm having a rest position, a stationary portion, and a set of springs movably coupling the diaphragm and the stationary portion. The diaphragm and stationary portion are spaced a first distance when the diaphragm is in the rest position. When not in the rest position, however, the diaphragm and stationary portion are capable of being spaced a second distance, which is greater than the first distance. Despite the change in distance, the diaphragm still is capable of returning the space from the second distance to the first distance when the diaphragm returns to the rest position.

    Abstract translation: 麦克风具有可移动隔膜,其具有静止位置,静止部分以及可移动地联接隔膜和固定部分的一组弹簧。 当隔膜处于静止位置时,隔膜和固定部分间隔开第一距离。 然而,当不处于静止位置时,隔膜和静止部分能够间隔第二距离,第二距离大于第一距离。 尽管距离的变化,当隔膜返回到静止位置时,隔膜仍然能够将空间从第二距离返回到第一距离。

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