公开(公告)号：AU2014324473B2

公开(公告)日：2017-09-07

申请号：AU2014324473

申请日：2014-09-30

Applicant: APPLE INC

Inventor： GABLE BRIAN M ,  WRIGHT JAMES A ,  KUEHMANN CHARLES J ,  DEMERS BRIAN ,  YOUNG CHUNE-CHING ,  CHIANG CHUN-HSIEN

IPC: C22C21/10

Abstract: The disclosure provides an aluminum alloy including having varying ranges of alloying elements. In various aspects, the alloy has a wt% ratio of Zn to Mg ranging from 4:1 to 7:1. The disclosure further includes methods for producing an aluminum alloy and articles comprising the aluminum alloy.

公开(公告)号：AU2018101337A4

公开(公告)日：2018-10-11

申请号：AU2018101337

申请日：2018-09-12

Applicant: APPLE INC

Inventor： GABLE BRIAN M ,  NALLO CARLO DI ,  ELY COLIN M ,  HORTON CRAIG A ,  DE JONG ERIK G ,  ROTHKOPF FLETCHER R ,  WETTERSTEN HENRY B ,  LI HOISHUN ,  SAUERS JASON C ,  NATH JAYESH ,  MARTINIS MARIO ,  PASCOLINI MATTIA ,  COLEMAN MICHAEL P ,  EHMAN REX T ,  WANG ZHEYU

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure 5 between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：AU2018101337B4

公开(公告)日：2019-10-24

申请号：AU2018101337

申请日：2018-09-12

Applicant: APPLE INC

Inventor： GABLE BRIAN M ,  NALLO CARLO DI ,  ELY COLIN M ,  HORTON CRAIG A ,  DE JONG ERIK G ,  ROTHKOPF FLETCHER R ,  WETTERSTEN HENRY B ,  LI HOISHUN ,  SAUERS JASON C ,  NATH JAYESH ,  MARTINIS MARIO ,  PASCOLINI MATTIA ,  COLEMAN MICHAEL P ,  EHMAN REX T ,  WANG ZHEYU

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure 5 between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：AU2014324473A1

公开(公告)日：2016-04-21

申请号：AU2014324473

申请日：2014-09-30

Applicant: APPLE INC

Inventor： GABLE BRIAN M ,  WRIGHT JAMES A ,  KUEHMANN CHARLES J ,  DEMERS BRIAN ,  YOUNG CHUNE-CHING ,  CHIANG CHUN-HSIEN

IPC: C22C21/10

Abstract: The disclosure provides an aluminum alloy including having varying ranges of alloying elements. In various aspects, the alloy has a wt% ratio of Zn to Mg ranging from 4:1 to 7:1. The disclosure further includes methods for producing an aluminum alloy and articles comprising the aluminum alloy.