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公开(公告)号：AU2018101337A4
公开(公告)日：2018-10-11
申请号：AU2018101337
申请日：2018-09-12
Applicant: APPLE INC
Inventor： GABLE BRIAN M , NALLO CARLO DI , ELY COLIN M , HORTON CRAIG A , DE JONG ERIK G , ROTHKOPF FLETCHER R , WETTERSTEN HENRY B , LI HOISHUN , SAUERS JASON C , NATH JAYESH , MARTINIS MARIO , PASCOLINI MATTIA , COLEMAN MICHAEL P , EHMAN REX T , WANG ZHEYU
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure 5 between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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公开(公告)号：AU2018101337B4
公开(公告)日：2019-10-24
申请号：AU2018101337
申请日：2018-09-12
Applicant: APPLE INC
Inventor： GABLE BRIAN M , NALLO CARLO DI , ELY COLIN M , HORTON CRAIG A , DE JONG ERIK G , ROTHKOPF FLETCHER R , WETTERSTEN HENRY B , LI HOISHUN , SAUERS JASON C , NATH JAYESH , MARTINIS MARIO , PASCOLINI MATTIA , COLEMAN MICHAEL P , EHMAN REX T , WANG ZHEYU
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure 5 between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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