公开(公告)号：AU2018237087B2

公开(公告)日：2020-01-23

申请号：AU2018237087

申请日：2018-03-20

Applicant: APPLE INC

Inventor： LI HOISHUN ,  CURRENS ETHAN E ,  HUANG WEIMING ,  WRIGHT JAMES A

IPC: C22C38/00 ,  C21D6/00 ,  C21D8/02 ,  C21D8/04 ,  C22C38/02 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C23C8/06 ,  C23C8/24 ,  C23C8/26

Abstract: The disclosure provides methods of making iron-based alloys, as well as resulting alloys. An iron-based alloy containing a small amount of nickel (e.g., 0.5 to 2.0 wt%) is annealed and machined. The alloy is sufficiently ductile to reduce the likelihood of cracking, while not sufficiently high to result in a hardened alloy. After the alloy is shaped, the alloy is hardened by nitriding.

公开(公告)号：AU2018101337B4

公开(公告)日：2019-10-24

申请号：AU2018101337

申请日：2018-09-12

Applicant: APPLE INC

Inventor： GABLE BRIAN M ,  NALLO CARLO DI ,  ELY COLIN M ,  HORTON CRAIG A ,  DE JONG ERIK G ,  ROTHKOPF FLETCHER R ,  WETTERSTEN HENRY B ,  LI HOISHUN ,  SAUERS JASON C ,  NATH JAYESH ,  MARTINIS MARIO ,  PASCOLINI MATTIA ,  COLEMAN MICHAEL P ,  EHMAN REX T ,  WANG ZHEYU

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure 5 between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

公开(公告)号：AU2018237087A1

公开(公告)日：2019-03-07

申请号：AU2018237087

申请日：2018-03-20

Applicant: APPLE INC

Inventor： LI HOISHUN ,  CURRENS ETHAN E ,  HUANG WEIMING ,  WRIGHT JAMES A

IPC: C22C38/00 ,  C21D6/00 ,  C21D8/02 ,  C21D8/04 ,  C22C38/02 ,  C22C38/42 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C23C8/06 ,  C23C8/24 ,  C23C8/26

Abstract: The disclosure provides methods of making iron-based alloys, as well as resulting alloys. An iron-based alloy containing a small amount of nickel (e.g., 0.5 to 2.0 wt%) is annealed and machined. The alloy is sufficiently ductile to reduce the likelihood of cracking, while not sufficiently high to result in a hardened alloy. After the alloy is shaped, the alloy is hardened by nitriding.

公开(公告)号：AU2018101337A4

公开(公告)日：2018-10-11

申请号：AU2018101337

申请日：2018-09-12

Applicant: APPLE INC

Inventor： GABLE BRIAN M ,  NALLO CARLO DI ,  ELY COLIN M ,  HORTON CRAIG A ,  DE JONG ERIK G ,  ROTHKOPF FLETCHER R ,  WETTERSTEN HENRY B ,  LI HOISHUN ,  SAUERS JASON C ,  NATH JAYESH ,  MARTINIS MARIO ,  PASCOLINI MATTIA ,  COLEMAN MICHAEL P ,  EHMAN REX T ,  WANG ZHEYU

IPC: H04M1/02 ,  B29C45/14 ,  H01Q1/24 ,  H01Q1/38 ,  H04M1/18 ,  H05K7/18

Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure 5 between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.